Abstract: A vehicle front portion structure includes: front side members that are disposed on both sides of a vehicle front portion in a vehicle width direction, and extend in a front-rear direction to support a floor of a cabin; a high voltage component that is disposed below the floor; and support members having rear end portions joined to the front side members and extending obliquely forward and downward from the front side members, respectively.

Abstract: A ridgeline of a bottom surface portion at a rear portion of a rear side member rear at a rear of a fastening portion of rear side members to a rear portion of a rear suspension member is a slope shape which inclines downward toward a vehicle rear. A side member reinforcement, which is a reinforcing member which is against a load in a vehicle length direction, is attached to the rear portion of the rear side member rear. A fragile portion of low rigidity compared to a lower portion is formed at an upper portion of the side member reinforcement.

Abstract: A rear side member rear includes a bottom plate, an upper plate, and a side plate that connects the bottom plate and the upper plate. On the bottom plate, a body mount bracket rear is provided. A fastening member fastens a vehicle length direction rearward of a rear suspension member upward to the body mount bracket rear. On the upper plate, a step structure, which is a fragile section, is formed further forward than a center axis of the suspension member bolt fastened to the body mount bracket rear.

Abstract: A vehicle rear structure includes a pair of laterally spaced apart rear side members extending along a longitudinal axis of a vehicle, and cross members extending between the pair of rear side members. Each of the rear side members includes a curve portion curved to be more inward at a rearer portion, and longitudinally-extending front and rear portions respectively disposed in front and at rear of the curve portion. A center cross member connects the front portions of the pair of rear side members. A first rear cross member connects boundary portions of the pair of rear side members. Each of the boundary portions is located between the curve portion and the rear portion of each of the rear side members. An intermediate cross member connects the curve portions of the pair of rear side members.

Abstract: A ridgeline of a bottom surface portion at a rear portion of a rear side member rear at a rear of a fastening portion of rear side members to a rear portion of a rear suspension member is a slope shape which inclines downward toward a vehicle rear. A side member reinforcement, which is a reinforcing member which is against a toad in a vehicle length direction, is attached to the rear portion of the rear side member rear A fragile portion of low rigidity compared to a lower portion is formed at an upper portion of the side member reinforcement.

Abstract: Rear side members include: side walls inclined outward in the vehicle width direction; and side wall flanges bent from front ends of the side walls, and extending inward in the vehicle width direction. A center floor cross member has a side wall contacting with the side wall flanges of the rear side members. Reinforcement members include: side walls extending to the side wall of the center floor cross member; and flanges bent from rear ends of the side walls, extending outward in the vehicle width direction, and at least partially coinciding with the side wall flanges of the rear side members in the vehicle width direction with the side wall of the center floor cross member interposed therebetween.

Abstract: A rear side member rear includes a bottom plate, an upper plate, and a side plate that connects the bottom plate and the upper plate. On the bottom plate, a body mount bracket rear is provided. A fastening member fastens a vehicle length direction rearward of a rear suspension member upward to the body mount bracket rear. On the upper plate, a step structure, which is a fragile section, is formed further forward than a center axis of the suspension member bolt fastened to the body mount bracket rear.

Abstract: A vehicle rear structure includes a pair of laterally spaced apart rear side members extending along a longitudinal axis of a vehicle, and cross members extending between the pair of rear side members. Each of the rear side members includes a curve portion curved to be more inward at a rearer portion, and longitudinally-extending front and rear portions respectively disposed in front and at rear of the curve portion. A center cross member connects the front portions of the pair of rear side members. A first rear cross member connects boundary portions of the pair of rear side members. Each of the boundary portions is located between the curve portion and the rear portion of each of the rear side members. An intermediate cross member connects the curve portions of the pair of rear side members.

Abstract: Rear side members include: side walls inclined outward in the vehicle width direction; and side wall flanges bent from front ends of the side walls, and extending inward in the vehicle width direction. A center floor cross member has a side wall contacting with the side wall flanges of the rear side members. Reinforcement members include: side walls extending to the side wall of the center floor cross member; and flanges bent from rear ends of the side walls, extending outward in the vehicle width direction, and at least partially coinciding with the side wall flanges of the rear side members in the vehicle width direction with the side wall of the center floor cross member interposed therebetween.

Abstract: An information processing apparatus including a display device; pointed position detecting means for detecting a specified position by a touch operation of a pointing device on a screen of the display device; sensor means for detecting a position of the pointing device when the pointing device is not in contact with the screen of the display device; and control means for recognizing the touch operation detected by the pointed position detecting means and controlling the information processing apparatus in accordance with the recognized touch operation and the position of the pointing device detected by the sensor means.

Abstract: An information processing apparatus including a display device; pointed position detecting means for detecting a specified position by a touch operation of a pointing device on a screen of the display device; sensor means for detecting a position of the pointing device when the pointing device is not in contact with the screen of the display device; and control means for recognizing the touch operation detected by the pointed position detecting means and controlling the information processing apparatus in accordance with the recognized touch operation and the position of the pointing device detected by the sensor means.

Abstract: A semiconductor device includes a board having a lower surface, a container part created in the board, external-connection nodes provided on the lower surface of the board, a supporting member provided inside the container part and secured by the board, a semiconductor chip secured on the supporting member and electrically connected with the external-connection nodes, and a sealing resin fully filling the container part so as to completely cover the semiconductor chip.

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.

Abstract: A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.

Abstract: A process for manufacturing semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by the package body to extend substantially perpendicularly to a bottom edge surface of the package body. The package body carries a cutout part at a predetermined position of a side edge that surrounds the package body such that the cutout part is adapted for engagement with a support leg for supporting the package body substantially upright on a substrate.

Abstract: A semiconductor device unit includes a holder having a plurality of holding parts, and a plurality of semiconductor devices held by the holding parts of the holder. Each of the semiconductor devices has a generally parallelepiped shape with top and bottom surfaces and at least one side surface provided with leads which are exposed whereby the semiconductor device unit stands by itself on the leads.

Abstract: A method of producing a semiconductor device includes the steps of fitting a bottom part of a radiator block within a tapered hole which is provided at a bottom of a recess of a jig and positioning on the jig a lead frame having inner and outer leads and wherein the lead frame has an opening at a central part thereof, the opening being located above a top surface of the radiator block. The semiconductor chip is then mounted on the top surface part of the radiator block and bonded to the lead frame by plurality of wires.

Abstract: A semiconductor device includes a semiconductor chip having top and bottom surfaces, upper leads electrically coupled to the semiconductor chip, where a first gap is formed between the upper leads and the top surface of the semiconductor chip, lower leads electrically coupled to the semiconductor chip, where a second gap is formed between the lower leads and the bottom surface of the semiconductor chip, and an encapsulating resin which encapsulates the semiconductor chip so as to maintain the first and second gaps.

Abstract: A semiconductor device having a package of a single in-line type includes a semiconductor chip, a package body that accommodates the semiconductor chip therein and defined by a pair of opposing major surfaces and a plurality of interconnection leads held by the package body to extend substantially perpendicularly to a bottom surface. Each of the interconnection leads consists of an inner lead part located inside the package body and an outer lead part located outside the package body, the outer lead part being bent laterally at a boundary between the inner part and the outer part, in one of first and second directions that are opposite from each other and substantially perpendicular to the opposing major surfaces of the package body. A plurality of support legs extend laterally at the bottom surface of the package body for supporting the package body upright when the semiconductor device is placed on a substrate.