Patents by Inventor Masanso Munekane

Masanso Munekane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7345289
    Abstract: A sample support of the present invention is prepared such that a silicon substrate is used as a raw material, the thickness structure having a shape and a thickness of 10 ?m or less is prepared using a semiconductor silicon process technique. The sample support of the present invention is adhered to a partially-cut mesh in a state that a sample portion is not adhered. Further, a plurality of portions where the samples are mounted is arranged on the same substrate.
    Type: Grant
    Filed: February 17, 2006
    Date of Patent: March 18, 2008
    Assignee: SII NanoTechnology Inc.
    Inventors: Kouji Iwasaki, Masanso Munekane
  • Publication number: 20060189021
    Abstract: A sample support of the present invention is prepared such that a silicon substrate is used as a raw material, the thickness structure having a shape and a thickness of 10 ?m or less is prepared using a semiconductor silicon process technique. The sample support of the present invention is adhered to a partially-cut mesh in a state that a sample portion is not adhered. Further, a plurality of portions where the samples are mounted is arranged on the same substrate.
    Type: Application
    Filed: February 17, 2006
    Publication date: August 24, 2006
    Inventors: Kouji Iwasaki, Masanso Munekane