Patents by Inventor Masao Akabane

Masao Akabane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5266904
    Abstract: A printed circuit board having through-holes and a test land for testing the through-holes. The test land is composed of a pair of current measurement lands and a pair of resistance measurement lands in order to test accurately the packing conditions of the conductive paste packed in the through-holes, thereby improving the uniformity and completeness of conductive-paste packing in printed circuit boards.
    Type: Grant
    Filed: April 9, 1991
    Date of Patent: November 30, 1993
    Assignee: Nippon CMK Corp.
    Inventor: Masao Akabane
  • Patent number: 5198778
    Abstract: A method for inspecting a printed circuit board having through-holes filled with conductive paste and having a pair of current measurement lands and a pair of resistance measurement lands. The pairs of current measurement lands and resistance measurement lands are used to measure voltage and current through the through-holes using the four-probe method, thereby preventing incomplete inspection of printed circuit boards and improving the dependability of tests on the packing conditions of the conductive paste in the through-holes.
    Type: Grant
    Filed: April 9, 1991
    Date of Patent: March 30, 1993
    Assignee: Nippon CMK Corp.
    Inventor: Masao Akabane