Abstract: A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.

Abstract: A laminated structure including a base material and resin insulating layers formed on the base material. The resin insulating layers include a resin insulating layer (A) containing a curing accelerator composed of an N atom-containing basic compound such that the resin insulating layer (A) is in contact with the base material. The laminated structure includes a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A).

Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.

Abstract: Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

Abstract: [Problem] Provided are: a pattern forming method by which a pattern can be formed by development using a thermosetting resin composition and a cured layer having excellent curability can be obtained; a thermosetting resin composition used in the pattern forming method; and a printed circuit board. [Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a pattern form so as to cure an irradiated part; and (C) forming a negatively patterned layer by removing a non-irradiated part by alkali development.

Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.

Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.

Abstract: Provided are: a thermosetting resin composition in which a cured product is excellent in low warp properties, thermal cycle characteristics, and the like, and occurrence of cracking of a coating film in a B-stage state is suppressed; a cured product thereof; and a printed wiring board in which the cured product is used. The thermosetting resin composition comprises: (A) an epoxy resin; (B) a curing agent for an epoxy resin; (C) spherical silicon dioxide and/or spherical aluminum oxide; and (D) a block copolymer.

Abstract: An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant.

Abstract: The present invention provides a dry film capable of forming a cured coating film having an excellent laser processability and a desmear resistance, and a printed writing board using the same. Further, the present invention provides a method of producing a printed writing board for a flip-chip mounting substrate capable of simply and inexpensively forming a dam preventing from spreading an underfill, a printed writing board obtained by the method of producing, and a flip-chip mounting substrate in which a chip is subjected to flip chip mounting on the printed writing board. A dry film comprising: a carrier film and a photocurable resin composition layer (L1) formed by applying and drying a photocurable resin composition; and at least a thermosetting resin composition layer (L2) formed by applying and drying a thermosetting resin composition in a gap between the photocurable resin composition layer (L1) and the carrier film.

Abstract: Provided is a photocurable resin composition, which has sensitivity equal to or greater than existing compositions, has alkali development properties, and which produces a cured product that does not become brittle with changes in temperature, and which also has excellent reliability in terms of water resistance, electrical insulating properties, PCT resistance, and the like. The photocurable resin composition comprises a carboxyl group-containing resin, a photopolymerization initiator, a vinyl group-containing elastomer, and a styryl group-containing compound.

Abstract: Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.

Abstract: Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: [Problem] Provided are: a pattern forming method by which a pattern can be formed by development using a thermosetting resin composition and a cured layer having excellent curability can be obtained; a thermosetting resin composition used in the pattern forming method; and a printed circuit board. [Means for Solution] The pattern forming method according to the present invention is characterized by comprising the steps of: (A) forming a resin layer composed of an alkali-developable thermosetting resin composition comprising a photobase generator on a substrate; (B) activating the photobase generator contained in the alkali-developable thermosetting resin composition by irradiation with a light in a pattern form so as to cure an irradiated part; and (C) forming a negatively patterned layer by removing a non-irradiated part by alkali development.

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.

Abstract: [Problems] The present invention provides a laminated structure comprising resin insulating layers which exhibits excellent adhesion to a base material and has excellent insulation reliability; and a dry film used for the production of the laminated structure. [Means for Solution] Provided is a laminated structure comprising a base material and a plurality of resin insulating layers formed thereon, which is characterized in that a layer of the plurality of resin insulating layers, which is in contact with the base material, is a resin insulating layer (A) which contains a curing accelerator composed of an N atom-containing basic compound; and that the laminated structure comprises a resin insulating layer (B) which contains a P atom-containing curing accelerator in addition to the resin insulating layer (A) which contains a curing accelerator composed of an N atom-containing basic compound.

Abstract: Disclosed are: a photocurable resin composition which may be developed with an alkali, has excellent resolution properties, and enables a cured article having excellent (humidity) heat resistance and thermal impact resistance to be formed; a dry film; a cured article thereof; and a printed wiring board using the cured article. The photocurable resin composition of the present invention is characterized by containing a carboxyl group-containing resin, a photopolymerization initiator, and surface-treated Neuburg siliceous earth particles.

Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is lower in a surface layer region away from the substrate than in other region, so that a linear thermal expansion coefficient of the layer as a whole is maintained as low as possible. Preferably, the photosensitive resin layer or cured film layer comprises at least two layers having different inorganic filler contents, wherein the inorganic filler content in the layer on the surface side away from the substrate is lower than the inorganic filler content in the other layer. A photosensitive dry film containing the photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.

Abstract: In a layered structure having at least a substrate and a photosensitive resin layer or cured film layer formed on the substrate and containing an inorganic filler, the content of the inorganic filler in the photosensitive resin layer or cured film layer is low on the side contacting the substrate and high on the surface side away from the substrate, so that a linear thermal expansion coefficient of the photosensitive resin layer or cured film layer as a whole is maintained as low as possible. Preferably, the inorganic filler content in the layer gradually increases continuously obliquely or stepwise from the side contacting the substrate to the surface side away from the substrate. A photosensitive dry film containing the above-mentioned photosensitive resin layer is suitable for use as a solder resist or an interlayer resin insulation layer of a printed wiring board.