Patents by Inventor Masao Chida

Masao Chida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Film attachment apparatus and attachment method
    Patent number: 8833423
    Abstract: A film application apparatus removes a glue surface protective sheet from a separated film and applies the film to the panel. The film application apparatus includes a press stage that presses the film from above the film, a press unit that presses an end part of the glue surface protective sheet from below so as to bend and raise the end part of the glue surface protective sheet and remove the end part of the glue surface protective sheet from the film, thereby performing primary removal to the glue surface protective sheet, an application head that is configured to be rotatable around a spindle, and has a curved surface convex toward the glue surface protective sheet and holds the film with the glue surface protective sheet being primarily removed, and a removal tape that removes the entire glue surface protective sheet from the film held by the application head.
    Type: Grant
    Filed: April 14, 2011
    Date of Patent: September 16, 2014
    Assignee: NEC Engineering, Ltd.
    Inventors: Masao Chida, Syouji Mori
  • FILM ATTACHMENT APPARATUS AND ATTACHMENT METHOD
    Publication number: 20130098544
    Abstract: A film application apparatus removes a glue surface protective sheet from a separated film and applies the film to the panel. The film application apparatus includes a press stage that presses the film from above the film, a press unit that presses an end part of the glue surface protective sheet from below so as to bend and raise the end part of the glue surface protective sheet and remove the end part of the glue surface protective sheet from the film, thereby performing primary removal to the glue surface protective sheet, an application head that is configured to be rotatable around a spindle, and has a curved surface convex toward the glue surface protective sheet and holds the film with the glue surface protective sheet being primarily removed, and a removal tape that removes the entire glue surface protective sheet from the film held by the application head.
    Type: Application
    Filed: April 14, 2011
    Publication date: April 25, 2013
    Applicant: NEC Engineering, Ltd.
    Inventors: Masao Chida, Syouji Mori