Abstract: An apparatus for window is used for moving a movable window plate among an insertion position for being inserted into an aperture portion of a fixed window plate, an extraction position for being extracted from the aperture portion toward an indoor side, and an opening position for being moved from the extraction position in a sliding direction that is different from an inserting and extracting direction to open the aperture portion. The apparatus includes a rotating shaft rotatably supported at a predetermined position for the movable window plate; a movement conversion mechanism configured to convert a rotation of the rotating shaft into a translation of the movable window plate between the insertion position and the extraction position; and a drive shaft, fixed to the rotating shaft, configured to rotate the rotating shaft around a central axis of the rotating shaft by revolving around the central axis of the rotating shaft.

Abstract: There is provided a tempered glass plate, wherein a thickness of the tempered glass plate is less than or equal to 2.7 mm, wherein on a surface of the tempered glass plate, a plurality of stress marks are formed, wherein a distance between closest stress marks of the plurality of stress marks is less than or equal to 20 mm, wherein the surface of the tempered glass plate includes a first virtual circle that is formed by connecting points that are separated from a center of one of the plurality of stress marks by 2.5 mm, wherein the tempered glass plate includes a non elastic-wave region that is not affected by an elastic-wave generated during fracturing, and wherein, in the non elastic-wave region, an average number of cracks that exist in the first virtual circle is greater than or equal to 3.4.

Abstract: An apparatus for window is used for moving a movable window plate among an insertion position for being inserted into an aperture portion of a fixed window plate, an extraction position for being extracted from the aperture portion toward an indoor side, and an opening position for being moved from the extraction position in a sliding direction that is different from an inserting and extracting direction to open the aperture portion. The apparatus includes a rotating shaft rotatably supported at a predetermined position for the movable window plate; a movement conversion mechanism configured to convert a rotation of the rotating shaft into a translation of the movable window plate between the insertion position and the extraction position; and a drive shaft, fixed to the rotating shaft, configured to rotate the rotating shaft around a central axis of the rotating shaft by revolving around the central axis of the rotating shaft.

Abstract: There is provided a tempered glass plate, wherein a thickness of the tempered glass plate is less than or equal to 2.7 mm, wherein on a surface of the tempered glass plate, a plurality of stress marks are formed, wherein a distance between closest stress marks of the plurality of stress marks is less than or equal to 20 mm, wherein the surface of the tempered glass plate includes a first virtual circle that is formed by connecting points that are separated from a center of one of the plurality of stress marks by 2.5 mm, wherein the tempered glass plate includes a non elastic-wave region that is not affected by an elastic-wave generated during fracturing, and wherein, in the non elastic-wave region, an average number of cracks that exist in the first virtual circle is greater than or equal to 3.4.

Abstract: A front glass plate for a stacked structure includes greater than or equal to 5 mol % of Al2O3, in terms of an oxide, as a component, 50% crack initiation load of the front glass plate being greater than or equal to 0.5 kg.

Abstract: In a preliminary forming step, positioning of a glass sheet is facilitated, and generation of a hinge mark by a flapping mechanism and generation of excessively bent portions, are prevented at the same time.

Abstract: The present invention relates to an apparatus for bending a glass sheet and a method for bending a glass sheet including an apparatus and a method for conveying a glass sheet, and it aims at producing with good efficiency a glass sheet of high quality, having complicated configuration.

Abstract: A method for bending a glass sheet is provided wherein the glass sheet is put on a bending surface of a frame unit to be preliminarily bent by gravity before the glass sheet is pressed by an upper mold and frame unit. The method is utilized for controlling the amount of preliminary bending so as to control deformation of the glass sheet caused by the preliminary bending and pressing occurs on the preliminary bent glass sheet by the upper mold and the frame unit.

Abstract: An air-cooling/tempering apparatus and method, which can properly temper a glass sheet bent to have a complexly curved surface, without increasing the heating temperature of the glass sheet or increasing a wind pressure from air-blowing openings. A lower blowing member of the air-cooling/tempering apparatus includes a plurality of blade-shaped members arranged into a combtooth shape each having a front end face provided with a plurality of arranged air-blowing openings. Each blade-shaped member has a front end face with a concave curve so that a gap from the plurality of airblowing openings to the bent glass sheet becomes substantially uniform. The arrangement of air-blowing openings provided on the front end face of each blade-shaped member is turned with a predetermined angle and extends in one direction in each side portion in plan view.

Abstract: It is an object of the present invention to provide a method for bending a glass sheet which can appropriately prevent cloth mark due to suctioning.

Abstract: It is an object of the present invention to provide an air-cooling/tempering apparatus for glass sheet and an air-cooling/tempering method, which can properly temper a glass sheet bent to have a complexly curved surface, without increasing the heating temperature of the glass sheet or increasing a wind pressure from air-blowing openings. A lower blowing member of the air-cooling/tempering apparatus of the present invention is constituted by a plurality of blade-shaped members arranged into a comb-tooth shape each having a front end face provided with a plurality of arranged air-blowing openings. Further, each blade-shaped member is configured to have a shape whose front end face has a concave curve so that a gap from the plurality of air-blowing openings to the bent glass sheet G becomes substantially uniform.

Abstract: In a preliminary forming step, positioning of a glass sheet is facilitated, and generation of a hinge mark by a flapping mechanism and generation of excessively bent portions, are prevented at the same time.

Abstract: The present invention relates to an apparatus for bending a glass sheet and a method for bending a glass sheet including an apparatus and a method for conveying a glass sheet, and it aims at producing with good efficiency a glass sheet of high quality, having complicated configuration.

Abstract: A heated and softened glass sheet is put on a bending surface of a frame unit to be preliminarily bent by gravity before the glass sheet is pressed by an upper mold and the frame unit. There are steps for using a certain means for controlling an amount of preliminary bending to control deformation of the glass sheet caused by the preliminary bending; and pressing the preliminarily bent glass sheet by the upper mold and the frame unit.

Abstract: A method for bending a glass sheet is provided wherein the glass sheet is put on a bending surface of a frame unit to be preliminarily bent by gravity before the glass sheet is pressed by an upper mold and frame unit. The method is utilized for controlling the amount of preliminary bending so as to control deformation of the glass sheet caused by the preliminary bending and pressing occurs on the preliminary bent glass sheet by the upper mold and the frame unit.

Abstract: It is an object of the present invention to provide a method for bending a glass sheet which can appropriately prevent cloth mark due to suctioning.

Abstract: There are a preliminarily bending step for putting heated and softened glass sheet on a preliminarily bending supporting-frame, the glass sheet having an edge portion supported by the preliminarily bending supporting-frame, and for bending the glass sheet into a desired preliminarily bent shape while putting the glass sheet on the preliminarily bending supporting-frame; and a finally bending step for transferring the preliminarily bent glass sheet on a finally bending supporting-frame, the glass sheet having an edge portion supported by the finally bending supporting-frame, and for bending the glass sheet into a final bent shape by pressing the glass sheet against a bending surface of a finally bending mold while putting the glass sheet on the finally bending supporting-frame.

Abstract: A heated and softened glass sheet is put on a bending surface of a frame unit to be preliminarily bent by gravity before the glass sheet is pressed by an upper mold and the frame unit. There are steps for using a certain means for controlling an amount of preliminary bending to control deformation of the glass sheet caused by the preliminary bending; and pressing the preliminarily bent glass sheet by the upper mold and the frame unit.

Abstract: In a method for preparing a substrate for semiconductor device, the substrate is prepared either by directly bonding a bonding wafer to a base wafer or by bonding the bonding wafer to the base wafer with an oxide film formed on at least the bonding surface of the bonding wafer or the bonding surface of the base wafer to make finished semiconductor devices with an SOI structure. Prior to the bonding operation, the bonding wafer and the base wafer are subjected to the steps of (1) making the diameter of the bonding wafer smaller than the diameter of the base wafer, (2) setting the beveling width of the back side (bonding side) of the bonding wafer at 50 microns or less, and (3) beveling the front side of said base wafer so that the bonding surface of the base wafer is equal in size to the bonding surface of the bonding wafer.