Patents by Inventor Masao Furukawa

Masao Furukawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970006
    Abstract: The object is to provide a liquid container that can prevent foreign substances from flowing into a liquid ejection apparatus with a simple configuration. The liquid container for containing liquid to be ejected by a liquid ejection apparatus includes: a bag body configured to contain the liquid inside; and a flow path for supplying the liquid contained inside the bag body to the liquid ejection apparatus, wherein, inside a peripheral wall of the flow path, a first capturing unit extending in an anti-gravitational direction and a second capturing unit extending in a gravitational direction are arranged at different positions with respect to a direction in which the liquid flows.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: April 30, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Yu Katano, Hirofumi Ota, Ken Ikegame, Yasuto Kodera, Masao Furukawa
  • Publication number: 20230046404
    Abstract: The object is to provide a liquid container that can prevent foreign substances from flowing into a liquid ejection apparatus with a simple configuration. The liquid container for containing liquid to be ejected by a liquid ejection apparatus includes: a bag body configured to contain the liquid inside; and a flow path for supplying the liquid contained inside the bag body to the liquid ejection apparatus, wherein, inside a peripheral wall of the flow path, a first capturing unit extending in an anti-gravitational direction and a second capturing unit extending in a gravitational direction are arranged at different positions with respect to a direction in which the liquid flows.
    Type: Application
    Filed: August 5, 2022
    Publication date: February 16, 2023
    Inventors: Yu Katano, Hirofumi Ota, Ken Ikegame, Yasuto Kodera, Masao Furukawa
  • Patent number: 10518548
    Abstract: A liquid ejection head has a plurality of ejection modules having a recording element substrate equipped with a plurality of ejection orifices for ejecting a liquid, a plurality of first flow path members that supports at least one of the ejection modules and a second flow path member provided in common with the first flow path members and supporting the first flow path members. The first flow path members and the second flow path member are equipped with a flow path for supplying a plurality of recording element substrates with a liquid. The first flow path members are joined with the second flow path member via an adhesive layer without being brought into direct contact with the second flow path member.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: December 31, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kazuhiro Yamada, Shuzo Iwanaga, Seiichiro Karita, Shingo Okushima, Zentaro Tamenaga, Noriyasu Nagai, Tatsurou Mori, Akio Saito, Akira Yamamoto, Asuka Horie, Masao Furukawa, Takatsuna Aoki
  • Patent number: 10434776
    Abstract: The present invention relates the method of manufacturing a liquid discharge head, in which a plurality of element substrates are adjacently arranged in a predetermined direction on a support plate by using a UV adhesive. The method for manufacturing a liquid ejection head is capable of reducing variations in the positions of element substrates while avoiding an increase of a tact time.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: October 8, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Masao Furukawa
  • Publication number: 20190001697
    Abstract: A liquid ejection head has a plurality of ejection modules having a recording element substrate equipped with a plurality of ejection orifices for ejecting a liquid, a plurality of first flow path members that supports at least one of the ejection modules and a second flow path member provided in common to the first flow path members and supporting the first flow path members. The first flow path members and the second flow path member are equipped with a flow path for supplying a plurality of recording element substrates with a liquid. The first flow path members are joined with the second flow path member via an adhesive layer without being brought into direct contact with each other.
    Type: Application
    Filed: June 26, 2018
    Publication date: January 3, 2019
    Inventors: Kazuhiro Yamada, Shuzo Iwanaga, Seiichiro Karita, Shingo Okushima, Zentaro Tamenaga, Noriyasu Nagai, Tatsurou Mori, Akio Saito, Akira Yamamoto, Asuka Horie, Masao Furukawa, Takatsuna Aoki
  • Patent number: 9776410
    Abstract: A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes: a first step of applying the adhesive agent to an end surface of a wall; a second step of flattening out the adhesive agent on the end surface of the wall of the supply port in the height direction intersecting the end surface by moving the end surface of the wall of the supply port and the end surface of the wall of the supply passage toward each other; and a third step of moving the ridge line of the wall of the supply port in a direction along the end surface of the wall of the supply port.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: October 3, 2017
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takayuki Ono, Masao Furukawa, Masashi Ishikawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Tomohiro Takahashi
  • Publication number: 20160355017
    Abstract: The present invention relates the method of manufacturing a liquid discharge head, in which a plurality of element substrates are adjacently arranged in a predetermined direction on a support plate by using a UV adhesive. The method for manufacturing a liquid ejection head is capable of reducing variations in the positions of element substrates while avoiding an increase of a tact time.
    Type: Application
    Filed: May 17, 2016
    Publication date: December 8, 2016
    Inventor: Masao Furukawa
  • Patent number: 9352562
    Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: May 31, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomohiro Takahashi, Takayuki Ono, Masao Furukawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Masashi Ishikawa
  • Patent number: 9227404
    Abstract: There is provided a liquid ejection head that can reduce trouble in alignment of a print element substrate even in the case where a high magnification optical system is used and a method for fabricating the liquid ejection head. To achieve this, an auxiliary mark that indicates a relative position with respect to a reference mark is detected and recognized, and thus the position of the reference mark is identified even in the case where the reference mark is not reflected in a camera.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: January 5, 2016
    Assignee: Canon Kabushiki Kaisha
    Inventor: Masao Furukawa
  • Patent number: 9085142
    Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: July 21, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takayuki Ono, Masao Furukawa, Masashi Ishikawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Tomohiro Takahashi
  • Publication number: 20140333692
    Abstract: There is provided a liquid ejection head that can reduce trouble in alignment of a print element substrate even in the case where a high magnification optical system is used and a method for fabricating the liquid ejection head. To achieve this, an auxiliary mark that indicates a relative position with respect to a reference mark is detected and recognized, and thus the position of the reference mark is identified even in the case where the reference mark is not reflected in a camera.
    Type: Application
    Filed: April 23, 2014
    Publication date: November 13, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventor: Masao FURUKAWA
  • Patent number: 8851660
    Abstract: There is provided a method for manufacturing an ink jet recording head in which a plurality of recording element substrates used for discharging ink are appropriately arranged onto a support substrate.
    Type: Grant
    Filed: February 7, 2011
    Date of Patent: October 7, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventor: Masao Furukawa
  • Publication number: 20140225957
    Abstract: An electric connection method for connection between a semiconductor substrate and an electric wiring substrate includes a first process for providing the semiconductor substrate having a heating member and a pad and the electric wiring substrate having first wiring and second wiring, a second process for electrically connecting the first wiring and the heating member, a third process for causing the heating member to generate heat by supplying power to the heating member through the first wiring, and a fourth process for electrically connecting the pad and the second wiring at a temperature higher than a temperature for electrically connecting the first wiring and the heating member.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 14, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Tomohiro Takahashi, Takayuki Ono, Masao Furukawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Masashi Ishikawa
  • Publication number: 20140218445
    Abstract: There is provided a method of manufacturing a liquid ejection head that includes a supporting member having a major surface provided with a plurality of supply paths, and a recording element substrate having a bonding surface bonded to the major surface and provided with a plurality of supply ports arranged side by side in an arranging direction in which the supply paths are arranged side by side, the supply ports having smaller widths than the respective supply paths in the arranging direction. The method includes applying a bonding agent on the major surface around each of the supply paths, spreading the bonding agent to inner side surfaces of the supply ports by pressing boundary portions between the bonding surface and the supply ports into the bonding agent applied, and bonding the bonding surface to the major surface at a bonding position where the supply ports face the respective supply paths.
    Type: Application
    Filed: January 29, 2014
    Publication date: August 7, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Takayuki Ono, Masao Furukawa, Masashi Ishikawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Tomohiro Takahashi
  • Publication number: 20140216630
    Abstract: A method of manufacturing a liquid discharge head in which a device substrate having an energy generating element and a supply port and a supporting member having a supply passage are bonded with each other an adhesive agent includes: a first step of applying the adhesive agent to an end surface of a wall; a second step of flattening out the adhesive agent on the end surface of the wall of the supply port in the height direction intersecting the end surface by moving the end surface of the wall of the supply port and the end surface of the wall of the supply passage toward each other; and a third step of moving the ridge line of the wall of the supply port in a direction along the end surface of the wall of the supply port.
    Type: Application
    Filed: January 31, 2014
    Publication date: August 7, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Takayuki Ono, Masao Furukawa, Masashi Ishikawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Shimpei Otaka, Tomohiro Takahashi
  • Patent number: 8714711
    Abstract: A liquid recording head includes a protective layer having resistance to liquid and an adhesiveness improving film disposed on a second surface of a silicon substrate, opposite to a first surface. The first surface and the second surface have a plane direction (100). The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates with a liquid introduction port on a side of the second surface of the silicon substrate.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: May 6, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shimpei Otaka, Takayuki Ono, Masao Furukawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Tomohiro Takahashi, Masashi Ishikawa
  • Patent number: 8622517
    Abstract: A method of manufacturing a liquid ejection head includes: defining a first imaginary reference line along the longitudinal direction of a base member and measuring the distances between the first imaginary reference line and at least two liquid supply port portions of a liquid supply port row, including defining a second imaginary reference line passing the liquid supply port portion at the shortest distance from the first imaginary reference line and the liquid supply port portion at the longest distance from the first imaginary reference line respectively from among the at least two liquid supply port portions and defining the second imaginary reference line between two imaginary lines parallel to the first imaginary reference line.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: January 7, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Masashi Ishikawa, Takayuki Ono, Masao Furukawa
  • Publication number: 20130063523
    Abstract: Provided is a liquid recording head in which a protective layer having resistance to liquid and an adhesiveness improving film are disposed on a second surface opposite to a first surface of a silicon substrate. The first surface and the second surface have a plane direction. The protective layer is disposed in a peripheral region of an opening of a liquid supply port. A liquid ejection chip is bonded to a head substrate with an adhesive so that the liquid supply port communicates to a liquid introduction port on a side of the second surface of the silicon substrate.
    Type: Application
    Filed: August 28, 2012
    Publication date: March 14, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Shimpei Otaka, Takayuki Ono, Masao Furukawa, Jun Hinami, Takeshi Shibata, Ryo Shimamura, Takanori Enomoto, Tomohiro Takahashi, Masashi Ishikawa
  • Patent number: 8386212
    Abstract: When an abnormality or a sign of abnormality occurs in an electric power generating facility, an appropriate operating support can be made in a short time. The electric power facility operation remote supporting method in accordance with the present invention is characterized by that an abnormality or a sign of abnormality is judged based on at least one of information on an operating state of the electric power generating facility and information on time-varying characteristics of components in the electric power generating facility, and a service mode is set based on the judged information of the abnormality or the sign of abnormality, preset abnormality corrective data and preset service modes.
    Type: Grant
    Filed: September 23, 2008
    Date of Patent: February 26, 2013
    Assignee: Hitachi, Ltd.
    Inventors: Naoyuki Nagafuchi, Masao Furukawa
  • Patent number: 8342651
    Abstract: A liquid jet recording head includes a substrate including a plurality of discharge energy generating elements, and a plurality of ink supply ports positioned along an array direction of the plurality of discharge energy generating elements and separated from each other by beams, a plurality of ribs supported by the beams, and an orifice plate supported by the plurality of ribs, wherein the orifice plate includes discharge ports for discharging liquid droplets which enter from the plurality of ink supply ports and is provided with discharge energy by the plurality of discharge energy generating elements.
    Type: Grant
    Filed: February 3, 2010
    Date of Patent: January 1, 2013
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akiko Saito, Masataka Sakurai, Yoshiyuki Nakagawa, Ken Tsuchii, Akira Shibasaki, Masao Furukawa, Seiichi Kamiya, Yusuke Imahashi