Abstract: A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

Abstract: An electronic component that includes a first board having a bow-shaped first main surface and a joining member disposed on the first main surface of the first board and having a top edge configured to be joined with a second board, wherein the top edge of the joining member is disposed in a plane.

Abstract: A manufacturing method for an electronic component that includes a providing a base member on a first main surface of a first board, sandwiching the base member and a joining member paste between the first main surface of the first board and a transfer main surface of a transfer board, forming a joining member joined with the base member while the joining member paste is sandwiched by the first board and the transfer board, and peeling off the transfer board from the joining member joined with the base member.

Abstract: A crystal vibrator that includes a crystal substrate having a front surface and a rear surface, including a vibration portion in a region including a center of the crystal substrate, and a first peripheral portion that surrounds a periphery of the vibration portion and that has a smaller thickness than the vibration portion. Drive electrodes are formed on both surfaces of the vibration portion of the crystal substrate. In at least one of the front surface and the rear surface of the crystal substrate, a step is provided between the vibration portion and the first peripheral portion, and a first peripheral edge portion of the vibration portion and a second peripheral edge portion of the first peripheral portion are in a curved surface shape.

Abstract: A crystal vibrator that includes a crystal substrate having a front surface and a rear surface, including a vibration portion in a region including a center of the crystal substrate, and a first peripheral portion that surrounds a periphery of the vibration portion and that has a smaller thickness than the vibration portion. Drive electrodes are formed on both surfaces of the vibration portion of the crystal substrate. In at least one of the front surface and the rear surface of the crystal substrate, a step is provided between the vibration portion and the first peripheral portion, and a first peripheral edge portion of the vibration portion and a second peripheral edge portion of the first peripheral portion are in a curved surface shape.

Abstract: A dual mode filter includes a casing substrate on which an input electrode, an output electrode, two ground electrodes, and a relay electrode are provided, first and second filter elements mounted in parallel with each other on the casing substrate, and a cap fixed onto the casing substrate. The first and second filter elements each include a first terminal electrode, a second terminal electrode, a pair of segmented electrodes, a counter electrode, and a third terminal electrode. The first terminal electrode of the first filter element is connected to the input electrode, and the third terminal electrode is connected to one ground electrode. The first terminal electrode of the second filter element is connected to the output electrode, and the third terminal electrode is connected to the other ground electrode. The second terminal electrodes of the first and second filter elements are connected to the relay electrode.

Abstract: A piezoelectric filter includes first and second dual-mode filter elements connected in a face-to-face arrangement. The first and second filter elements have substantially the same center frequency. Each of the first and second filter elements has a piezoelectric substrate, which has unpolarized sections located at edges thereof. Portions of a vibration region where energy-trapped vibration of each of the first and second filter elements is generated are located in the unpolarized sections. The ratio of the area of the portions of the vibration region which are located in the unpolarized sections of the first filter element to the area of the entire vibration region of the first filter element is different from the ratio of the area of the portions of the vibration region which are located in the unpolarized sections of the second filter element to the area of the entire vibration region of the second filter element.

Abstract: A piezoelectric filter includes first and second dual-mode filter elements connected in a face-to-face arrangement. The first and second filter elements have substantially the same center frequency. Each of the first and second filter elements has a piezoelectric substrate, which has unpolarized sections located at edges thereof. Portions of a vibration region where energy-trapped vibration of each of the first and second filter elements is generated are located in the unpolarized sections. The ratio of the area of the portions of the vibration region which are located in the unpolarized sections of the first filter element to the area of the entire vibration region of the first filter element is different from the ratio of the area of the portions of the vibration region which are located in the unpolarized sections of the second filter element to the area of the entire vibration region of the second filter element.

Abstract: A piezoelectric filter includes a first three-terminal filter having a first input part and a first output part, a second three-terminal filter which has a second input part connected to the first output part and a second output part, a ground part, a relay capacitance connected between the first output part, the second input part, and the ground part, and an additional capacitance connected between the first or second input part and the first or second output part.

Abstract: A dual mode filter includes a casing substrate on which an input electrode, an output electrode, two ground electrodes, and a relay electrode are provided, first and second filter elements mounted in parallel with each other on the casing substrate, and a cap fixed onto the casing substrate. The first and second filter elements each include a first terminal electrode, a second terminal electrode, a pair of segmented electrodes, a counter electrode, and a third terminal electrode. The first terminal electrode of the first filter element is connected to the input electrode, and the third terminal electrode is connected to one ground electrode. The first terminal electrode of the second filter element is connected to the output electrode, and the third terminal electrode is connected to the other ground electrode. The second terminal electrodes of the first and second filter elements are connected to the relay electrode.

Abstract: A first piezoelectric filter and a second piezoelectric filter are electrically connected to each other with a relay capacitor interposed therebetween. When the thicknesses of the piezoelectric substrate plates of the first and second piezoelectric filters are T1 and T2, respectively, and when the distances between the first main surfaces of the first and second piezoelectric filters and their corresponding adjacent ground electrodes are respectively ta1 and ta2, and when the distances between the second main surfaces of the first and second piezoelectric filters and their corresponding adjacent ground electrodes are respectively tb1 and tb2, the following relationships are satisfied: tb1−ta1 is 0 to 0.1 T1, tb2−ta2 is 0 to 0.1 T2, alternatively, tb1−ta1 is −0.1 T1 to 0, tb2−ta2 is 0.1 T2 to 0.

Abstract: A laminated piezoelectric component or filter is arranged such that a change in the resonance frequency before and after a high temperature heat treatment such as reflowing is minimized and the distribution of the resonance frequency is also minimized. The laminated filter includes a piezoelectric substrate having a vibrating electrode provided on the back surface of the substrate, cover substrates, and adhesives located between the piezoelectric substrate and cover substrate. The change in the center frequency Fo due to the heat applied to the piezoelectric substrate during reflowing is canceled by the change of the center frequency Fo caused by the synthesized stress imparted to the piezoelectric substrates from the cover substrates and adhesives.

Abstract: First resonant electrodes are provided on one main surface of a piezoelectric plate, a second resonant electrode is provided on the other main surface of the piezoelectric plate, such that the first and second resonant electrodes face each other. An energy trap-type piezoelectric vibrating section is thus provided by the first and second resonant electrodes, and a capacitor section is provided in a position separated from the vibrating section. The capacitor section has a first capacitor electrode provided on the upper surface of the piezoelectric plate, and has a second capacitor electrode provided on the bottom surface of the piezoelectric plate. Further, an outer edge portion of the first capacitor electrode is spaced from an outside edge of the piezoelectric plate, thus providing a margin area except at the portions led out to the outside edge of the piezoelectric plate.

Abstract: A balanced input-output piezoelectric filter includes a piezoelectric ceramic substrate provided therein with a ground electrode. Input electrodes and output electrodes are located on both major surfaces of the piezoelectric ceramic substrate so as to be adjacent to each other. The input electrodes function as a balanced-circuit connecting electrode and are connected to balanced input terminals. The output electrodes function as a balanced-circuit connecting electrode and are connected to balanced output terminals.

Abstract: A chip piezoelectric filter has a plurality of energy-trap piezoelectric filters and effectively minimizes unnecessary spurious components in areas other than passbands. In the chip piezoelectric filter, first and second piezoelectric substrates on which first and second energy-trap piezoelectric filter sections are provided, respectively, are stacked on each other and separated from each other via a spacer. Also, first and second housing substrates are individually stacked on upper and lower portions of the first and second piezoelectric substrates. A first cavity is provided in the spacer to prevent interference of vibrations of the first and second piezoelectric substrates. The area of the first cavity is larger than the area of each of second and third cavities individually formed on outer surfaces of the first and second piezoelectric substrates.

Abstract: A piezoelectric resonant part includes a piezoelectric substrate having first and second opposed main surfaces, electrode patterns formed on the main surfaces; and protective substrates bonded to respective ones of the main surfaces of the piezoelectric substrate via adhesive layers to form a laminate. Each of the adhesive layers comprising a first layer made of a soft adhesive whose Shore hardness is less than D60 and a second layer made of a hard adhesive whose Shore hardness is more than D60. External electrodes are formed on exposed surfaces of the piezoelectric resonant part. Only the second adhesive layers are exposed in the areas where the external electrodes are located such that the external electrodes do not contact the relatively soft first adhesive layers. The piezoelectric resonant part is made by forming a respective first adhesive layer on a main surface of each of the protective substrates and then forming a respective second adhesive layer on each of the first layers.

Abstract: A chip type filter reduces a required mount space while facilitating achievement of impedance matching and also enhancing the stability of filter characteristics. The chip type filter includes a first piezoelectric substrate, a filter section with resonance electrodes, a common electrode and a coupling capacitance section, a second piezoelectric substrate, a second filter section with a pair of resonance electrodes, a common electrode opposing the electrodes in a "top/bottom-surface overlap" relationship and a coupling capacitance section. The filter is arranged such that the first and second piezoelectric substrates are adhered to each other with an adhesive layer located therebetween.

Abstract: A piezoelectric filter is arranged to suppress unnecessary vibrations caused by wiring patterns such as lead-out electrodes to improve filter characteristics. The filter includes a filter section having a pair of resonant electrodes located on an upper surface of a piezoelectric substrate, and a common electrode located on the lower surface of the substrate so as to be opposite to the resonant electrodes. A capacitor connected to the filter section includes a capacitive electrode having the function of a lead-out electrode and located on the upper surface of the piezoelectric substrate, and another capacitive electrode located on the lower surface of the piezoelectric substrate. Lead-out electrodes extend to edges of the piezoelectric substrate. The piezoelectric substrate is unpolarized in a region where at least a portion of the lead-out electrodes is located and in a vicinity of this region.

Abstract: A piezoelectric resonant part includes a piezoelectric substrate having first and second opposed main surfaces, electrode patterns formed on the main surfaces; and protective substrates bonded to respective ones of the main surfaces of the piezoelectric substrate via adhesive layers to form a laminate. Each of the adhesive layers comprising a first layer made of a soft adhesive whose Shore hardness is less than D60 and a second layer made of a hard adhesive whose Shore hardness is more than D60. External electrodes are formed on exposed surfaces of the piezoelectric resonant part. Only the second adhesive layers are exposed in the areas where the external electrodes are located such that the external electrodes do not contact the relatively soft first adhesive layers. The piezoelectric resonant part is made by forming a respective first adhesive layer on a main surface of each of the protective substrates and then forming a respective second adhesive layer on each of the first layers.

Abstract: A thickness shear vibration type double mode filter includes two or more vibrating elements disposed in parallel on a piezoelectric substrate and a coupling capacitor formed on the piezoelectric substrate at a position intermediate two of the vibrating elements. The coupling capacity includes a capacitor electrode formed on one main surface of the piezoelectric substrate and an opposing ground electrode formed on a second main surface of the substrate. Input/output electrodes of the vibrating elements are formed on the same surface of the piezoelectric substrate as the capacitor electrode. A damper formed of a resin material on which no solder adheres is formed on top of the capacitor electrode and has sufficient mass to suppress undesired vibration in the area of the coupling capacitor.