Patents by Inventor Masao Hirosawa

Masao Hirosawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6010324
    Abstract: A mold clamping unit comprises guide rollers for guiding fitting and releasing of a mold, a hydraulic clamp for holding the mold at a molding position, a guiding portion formed to project in a direction perpendicular to a mold open-close direction from a lower portion of platen and a locking mechanism provided to an upper portion opposing to the guiding portion for the platen, for locking the mold at a releasing position. Since exchange and maintenance operations of a stamper can be carried out under a condition where the mold is released to the releasing position over the guiding portion and locked by the locking mechanism, fitting/releasing of the mold to/from the platen can be facilitated and exchange and maintenance operations of the stamper can be made easy.
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: January 4, 2000
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Takeo Oshiro, Masao Hirosawa, Hideo Ichikawa
  • Patent number: 5916604
    Abstract: A combination of displacement mechanisms adaptive for positioning a stationary platen to a frame, permitting the stationary platen to be displaced toward an injection unit to allow an escaping extension of tie-rods in a mold clamp action, is operative to displace the same toward the injection unit for a maintenance service, so that it can be displaced toward the injection unit further from a molding position in a molding operation.
    Type: Grant
    Filed: January 29, 1997
    Date of Patent: June 29, 1999
    Assignee: Toshiba Kikai Kabushkiki Kaisha
    Inventors: Takeo Oshiro, Masao Hirosawa
  • Patent number: 5910328
    Abstract: A stationary platen for holding a stationary part of a mold centered to an injection axis is securely connected by tie-rods to a cylinder body integral with a cylinder part of a clamp cylinder which moves a movable part of the mold in a clamp direction, and subjected to a deformation when the mold is clamped, which deformation is made symmetrical with respect to a reference plane including the injection axis by a combination of mechanisms therefor.
    Type: Grant
    Filed: February 21, 1997
    Date of Patent: June 8, 1999
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Takeo Oshiro, Masao Hirosawa, Hiroshi Kanno, Hidekazu Nakamura, Yasuyuki Ono, Takashi Goto, Naoki Yamamoto
  • Patent number: 5352394
    Abstract: A mold clamping device in an injection molding machine comprises a first platen for retaining a first mold therein and a second platen for retaining a second mold therein; a platen feeding mechanism for moving said first and second platens relative to each other on said table; electromagnetic coils arranged on the opposite surfaces of the first and second platens; and a control device for controlling the amount of the current supplied to the electromagnetic coils. The mold clamping operation is carried out using the magnetic attracting force generated by the electromagnetic coils.
    Type: Grant
    Filed: July 29, 1992
    Date of Patent: October 4, 1994
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Jun Fujita, Yoshinori Nakanishi, Shinichi Tazawa, Hideo Tanaka, Masao Hirosawa, Nobukatsu Omura, Harukatsu Goto