Abstract: A method for fabricating a matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board is formed to include a board made of an insulating material, first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other, and through holes provided at cross points of the first and second wiring patterns. A connection pin inserted into at least one of the through holes, electrically connects at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side.

Abstract: A wiring board structure includes a board made of a material which can be etched by a given solution, an electrically conductive portion, which is thermally conductive, having a portion which extends from the board and which can be etched by the given solution, and an insulating layer having a portion which is in contact with the board and only the side surface of the electrically conductive portion and which prevents the board from being etched when the electrically conductive layer is etched.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Abstract: A matrix switch board used for connecting and disconnecting a switching-system line and a subscriber line. The matrix switch board includes a board made of an insulating material, and first and second wiring patterns respectively formed on front and back sides of the board so as to cross each other. The matrix switch board further includes through holes provided at cross points of the first and second wiring patterns. In the matrix switch board, when a connection pin is inserted into at least one of the through holes, at least one of the first wiring patterns on the front side and at least one of the second wiring patterns on the back side are electrically connected to each other.

Abstract: An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).

Abstract: A pin switch board matrix is described including a laminated board with two insulative substrates each, provided with a plurality of parallel conductive X-patterns and Y-patterns, made of resilient metal wires, respectively. The laminated board has a plurality of through holes, each penetrating the two substrates, at positions corresponding to intersections of the respective X and Y-conductive patterns. When a short plug is inserted into a selected through hole, the X and Y-patterns corresponding to the selected via the short plug. The substrates have a plurality of parallel guide grooves for receiving the wire patterns.