Patents by Inventor Masao Iritani

Masao Iritani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6508266
    Abstract: A diaphragm valve can properly mount a peripheral portion of a diaphragm over the entire periphery and reliably establish a seal between the peripheral edge portion on a liquid side of the diaphragm and a diaphragm mounting seat for preventing leakage of a liquid. The diaphragm valve includes an annular base (27) provided to project from a seat surface of mounting seat (12) for a predetermined height and connected with a bracket mounting flange (16) on the side of valve operating portion by bolts (17). A diaphragm retaining portion (30) is formed integrally with flange (16) for compressing the peripheral edge portion of diaphragm with a constant pressure so that flange (16) and base (27) are connected by bolts (17) in the condition where diaphragm (14) is compressed onto base (12) with constant pressure by diaphragm retaining portion (30).
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: January 21, 2003
    Assignee: Toyo Stainless Steel Industries Co., Ltd.
    Inventors: Masao Iritani, Kaoru Ozawa, Toru Tateishi
  • Publication number: 20010025654
    Abstract: A diaphragm valve can properly mount a peripheral portion of a diaphragm over the entire periphery and reliably establish a seal between the peripheral edge portion on a liquid side of the diaphragm and a diaphragm mounting seat for preventing leakage of a liquid. The diaphragm valve includes an annular base (27) provided to project from a seat surface of said mounting seat (12) for a predetermined height and connected with a bracket mounting flange (16) on the side of said valve operating portion by bolts (17). A diaphragm retaining portion (30) is formed integrally with said flange (16) for compressing the peripheral edge portion of said diaphragm with a constant pressure so that said flange (16) and said base (27) are connected by said bolts (17) in the condition where said diaphragm (14) is compressed onto said base (12) with said constant pressure by said diaphragm retaining portion (30).
    Type: Application
    Filed: February 20, 2001
    Publication date: October 4, 2001
    Inventors: Masao Iritani, Kaoru Ozawa, Toru Tateishi
  • Patent number: 5713125
    Abstract: Electronic parts are mounted onto a substrate. A parts supply device holds a plurality of electronic parts and moves to be positioned at a predetermined parts take-out position. The parts supply device includes a readable and writable memory for storing data indicative of the plurality of electronic parts held therein. A reading device reads the data stored in the readable and writable memory provided in the parts supply device when the parts supply device moves relative to the reading device to the predetermined parts take-out position. The electronic part is extracted from the parts supply device position at the predetermined parts take-out position and mounted on a substrate.
    Type: Grant
    Filed: January 4, 1995
    Date of Patent: February 3, 1998
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuhisa Watanabe, Masatoshi Yanagawa, Noriaki Yoshida, Takashi Noyama, Masao Iritani, Shinji Morimoto
  • Patent number: 5400497
    Abstract: An apparatus is for mounting electronic parts onto a substrate. The apparatus includes a parts supply device for holding a plurality of electronic parts and for moving to be positioned at a predetermined parts take-out position. The parts supply device includes a readable and writable memory for storing data indicative of the plurality of electronic parts held therein. The apparatus further includes a reading device for reading the data stored in the readable and writable memory provided in the parts supply device when the parts supply device moves relative to the reading device to the predetermined parts take-out position. The electronic part is extracted from the parts supply device position at the predetermined parts take-out position and mounted on a substrate.
    Type: Grant
    Filed: June 4, 1993
    Date of Patent: March 28, 1995
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Nobuhisa Watanabe, Masatoshi Yanagawa, Noriaki Yoshida, Takashi Noyama, Masao Iritani, Shinji Morimoto
  • Patent number: 5228193
    Abstract: An electronic parts mounting method for taking out from a parts supply device having a plurality of electronic parts at least one of the electronic parts, and mounting the part at a predetermined position of a substrate to be manufactured, includes steps of storing quantity of parts, which is held by each parts supply device, in a storing section provided in each parts supply device, rewriting the quantity of parts according to number of parts taken out from the parts supply device by a calculating section provided in each parts supply device, reading out an initial value of the quantity of parts held by each parts supply device, by a control section provided in an electronic parts mounting machine, calculating one of the quantity of parts required for the substrate and period of time required for mounting the part on the substrate by a calculating section provided in the electronic parts mounting machine, and carrying out, in advance, a parts shortage advance notification in each parts supply device based on
    Type: Grant
    Filed: October 29, 1991
    Date of Patent: July 20, 1993
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masatoshi Yanagawa, Noriaki Yoshida, Masao Iritani, Akira Mouri, Takashi Noyama, Satoshi Tanaka
  • Patent number: 4809430
    Abstract: In the mounting of an electronic component, a holding member is rotated by a predetermined angle prior to actual holding of the electronic parts, thereby to detect a center of the holding member from at least two positions of the rotation angle, and the rotation center of the holding member is found by a calculation based on the detected center of the holding member. The position of the electronic parts against a circuit board then is corrected on the basis of a deviation between the position of the rotation center and the center of the holding member.
    Type: Grant
    Filed: June 11, 1987
    Date of Patent: March 7, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Masahiro Maruyama, Kanji Hata, Eiji Itemadani, Masao Iritani