Abstract: An output system includes a terminal device, an image-forming apparatus, and a server device. The terminal device includes an acquirer that acquires content from the server device, a generator that generates job data including a setting for outputting the content based on the acquired content, a transmitter that transmits the job data to the image-forming apparatus, and a reception slip outputter that outputs a reception slip including a reception number corresponding to the generated job data. The image-forming apparatus includes a receiver that receives the job data from the terminal device, and an outputter that outputs the content after executing a job based on the job data corresponding to the reception number when the reception number is input.

Abstract: A motorcycle includes a front frame configured by connecting a head pipe, frame, down frame, and lower frame in a loop shape. The motorcycle also includes a rear frame, an engine disposed inside the front frame, an air cleaner disposed inside the rear frame, a suction pipe and fuel supply device connected to the air cleaner and supply gas to the engine, an ABS module controlling locking of wheels at the time of braking, and a cross member bridged between the right and left main frames at the rear portion of the front frame. The suction pipe and the fuel supply device are provided to pass on the upper side of the cross member; the ABS module is disposed below the suction pipe and the fuel supply device is disposed behind a cylinder assembly of the engine and above the rear portion of the crankcase.

Abstract: A motorcycle includes: a front frame configured by connecting a head pipe, frame, down frame, and lower frame in a loop shape; rear frame; engine disposed inside the front frame; an air cleaner disposed inside the rear frame; suction pipe and fuel supply device connected to the air cleaner and supply gas to the engine; an ABS module controlling locking of wheels at the time of braking; and cross member bridged between the right and left main frames at the rear portion of the front frame, wherein the suction pipe and the fuel supply device are provided to pass on the upper side of the cross member; and the ABS module is disposed below the suction pipe and the fuel supply device, behind a cylinder assembly of the engine, and above the rear portion of the crankcase.

Abstract: A seating apparatus for a vehicle, in which a seat cushion supported on the vehicle body by a link member can be flipped up toward the front of the vehicle from a use position and which includes a locking mechanism that operates only when the seat cushion is acted upon by an inertial force greater than a predetermined force in the longitudinal direction of the vehicle, to temporarily prevent the seat cushion from flipping up. The locking mechanism includes a locking plate supported on the seat cushion and rockable in the longitudinal direction of the vehicle between a normal position and a rocked position, and a spring for urging the locking plate toward the normal position. The locking plate locks the seat cushion to the link member when it is moved inertially to the rocked position against the force of the spring, to prevent the seat cushion from flipping up, and the locking plate unlocks the seat cushion when it is located in the normal position.

Abstract: A seating apparatus for a vehicle, in which a seat cushion supported on the vehicle body by a link member can be flipped up toward the front of the vehicle from a use position and which includes a locking mechanism that operates only when the seat cushion is acted upon by an inertial force greater than a predetermined force in the longitudinal direction of the vehicle, to temporarily prevent the seat cushion from flipping up. The locking mechanism includes a locking plate supported on the seat cushion and rockable in the longitudinal direction of the vehicle between a normal position and a rocked position, and a spring for urging the locking plate toward the normal position. The locking plate locks the seat cushion to the link member when it is moved inertially to the rocked position against the force of the spring, to prevent the seat cushion from flipping up, and the locking plate unlocks the seat cushion when it is located in the normal position.

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: The electrochemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electrochemical machining apparatus performs electrochemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract: The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract: The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film

Abstract: An electroless plating apparatus controlling the changes in the plating solution along with the elapse of time for performing electroless plating uniformly with a good accuracy and a method thereof are provided. An electroless plating apparatus for applying electroless treatment to a target surface under an atmosphere of a predetermined gas so as to form a conductive film, has a plating tank 21 set so that a target surface of a target object W is close to its inside surface and isolating the target surface from the outside atmosphere, and a plating solution feeding means 26 for feeding a plating solution to the target surface so as to ease the impact of the plating solution on the target surface of the target object W.

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film

Abstract: A polishing method for electropolishing a metal film formed on a wafer surface so as to fill concave portions formed on the wafer surface comprises a step of determining an electropolishing end point of the metal film on the basis of a change of a current waveform resulting from electropolishing the metal film. An electropolishing apparatus comprising a current detector for detecting a current waveform resulting from electropolishing a metal film and an end point determination part for determining an electropolishing end point of the metal film on the basis of the change of a current detected with the current detector is used to realize the polishing method.

Abstract: The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract: A method of production and a method of polishing a semiconductor device and a polishing apparatus, capable of easily flattening an initial unevenness of a metal film, excellent in efficiency of removal of an excess metal film, and capable of suppressing damage to an interlayer insulation film below the metal film when flattening the metal film by polishing, the polishing method including the steps of interposing an electrolytic solution including a chelating agent between a cathode member and the copper film, applying a voltage between the cathode member used as a cathode and the copper film used as an anode to oxidize the surface of the copper film and forming a chelate film of the oxidized copper, selectively removing a projecting portion of the chelate film corresponding to the shape of the copper film to expose the projecting portion of the copper film at its surface, and repeating the above chelate film forming step and the above chelate film removing step until the projecting portion of the copper film

Abstract: A coil winding jig comprises: a first block having a first flange to which the free end of the wire is fixed; a second block having a second flange and disposed opposite to and coaxially with the first block with the front surface of the second flange facing the front surface of the first flange and spaced apart a distance corresponding to the width of the coil to be formed from the front surface of the first flange; a third block disposed coaxially with the second block, having a middle portion contained within the second block, and a coil form having a front end to be pressed against the first flange and projecting from the middle portion through a hole formed in the second flange toward the first flange of the first block. The coil form is tapered toward the first flange, has an outer circumference consisting of inclined side surfaces and is provided with steps having a size smaller than half the diameter of the wire on its side surfaces contiguously with the front surface of the second flange.

Abstract: A headrest device as applied to a haigh back seat, wherein a headrest body is formed independently of a seat back of the seat, and wherein a first engagement element of the headrest body is engaged with a second engagement element of the seat back, to thereby secure such separate headrest body to the seat back. This arrangement allows improvement in design, coloring and appearance for each of headrest and seat back in the high back seat.