Abstract: A polymer including, as the main chain, a metal-oxygen-metal bond including a structural unit represented by the following general formula (1): wherein M represents a metal atom selected from the group consisting of Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, In, Sn, Sb, Hf, Ta, W, and Bi; R1 is selected from a hydrogen atom, a C1-C8 alkyl group, a C1-C8 alkylcarbonyl group, a C6-C12 aryl group, a C7-C13 aralkyl group, a (R53Si-group, a (R6R7N—) group, a 4-oxopent-2-en-2-yl group, a C5-C12 4-alkoxy-4-oxobuta-2-en-2-yl group, and a C10-C16 4-aryloxy-4-oxobuta-2-en-2-yl group; R2 and R3 are each independently a hydrogen atom or a C1-C8 alkyl group; R4 is a hydrogen atom, a C1-C8 alkyl group, or a C1-C8 alkylcarbonyl group; R5 is a hydroxy group, a C1-C8 alkyl group, a C5-C12 alicyclic alkyl group, a C1-C12 alkoxy group, a C6-C12 aryl group, a C7-C13 aralkyl group, or a group having a siloxane bond; a plurality of R5 may be the same or different; R6 and R7 are each independently a hydrogen

Abstract: Disclosed is a polymetalloxane including a constituent unit represented by the following general formula (1), which stably exists in a transparent and uniform state in a solution and can form a homogeneous cured film: wherein R1 is an organic group and at least one of R1 is an (R33SiO—) group, R3 is optionally selected from specific groups, R2 is optionally selected from specific groups, when plural R1, R2, and R3 exist, they may be the same or different, M represents a specific metal atom, m is an integer indicating a valence of a metal atom M, and a is an integer of 1 to (m?2).

Abstract: A method of producing an inorganic solid pattern is described that includes: a step of coating an inorganic solid with a composition containing a polymetalloxane and an organic solvent; a step of heating the coating film obtained in the coating step, at a temperature of 100° C. or more and 1000° C. or less to form a heat-treated film; a step of forming a pattern of the heat-treated film; and a step of patterning the inorganic solid by etching using the pattern of the heat-treated film as a mask.

Abstract: Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. The siloxane resin composition contains: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D).

Abstract: A polymetalloxane is described having a constituent unit represented by the following general formula (1): wherein R1, R2, R3, M a, b and m are as defined.

Abstract: A method of producing a metal oxide fiber is described, including a spinning step of spinning a composition containing a polymetalloxane and an organic solvent to obtain a thread-like product; and a firing step of firing the thread-like product obtained in the spinning step at a temperature of 200° C. or higher and 2,000° C. or lower to obtain a metal oxide fiber, where the polymetalloxane has a repeating structure composed of a metal atom selected from the group consisting of Al, Sc, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Pd, Ag, In, Sn, Sb, Hf, Ta, W and Bi, and an oxygen atom and where the weight average molecular weight of the polymetalloxane is 20,000 or more and 2,000,000 or less.

Abstract: Provided is a siloxane resin composition having excellent adhesion and fine patterning properties. The siloxane resin composition contains: a siloxane resin (A) including a structure represented by general formula (1), a structure represented by general formula (2), and a structure represented by general formula (3); a compound (B) having an unsaturated double bond; a photopolymerization initiator (C); and a solvent (D).

Abstract: Provided is a substrate whereby diffusion of light toward a backlight can be suppressed and luminance of an image display device can be enhanced. A substrate having, on a transparent substrate, (a) a color conversion light-emitting layer and (b) a light diffusion prevention layer in this order from the transparent substrate side, the refractive index of the light diffusion prevention layer with respect to a wavelength of 550 nm being 1.20-1.35.

Abstract: Disclosed is a polymetalloxane including a constituent unit represented by the following general formula (1), which stably exists in a transparent and uniform state in a solution and can form a homogeneous cured film: wherein R1 is an organic group and at least one of R1 is an (R33SiO—) group, R3 is optionally selected from specific groups, R2 is optionally selected from specific groups, when plural R1, R2, and R3 exist, they may be the same or different, M represents a specific metal atom, m is an integer indicating a valence of a metal atom M, and a is an integer of 1 to (m?2).

Abstract: A positive photosensitive resin composition including: a polysiloxane synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane that has a carboxyl group and/or a dicarboxylic acid anhydride structure; particles of one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound, or composite particles of a silicon compound and one or more metal compounds selected from an aluminum compound, a tin compound, a titanium compound, and a zirconium compound; a naphthoquinone diazide compound; and a solvent.

Abstract: A positive photosensitive resin composition including: a polysiloxane synthesised by hydrolysing and partially condensing a specific organosilane and an organosilane that has a carboxyl group and/or a dicarboxylic acid anhydride structure; particles of one or more metal compounds selected from an aluminium compound, a tin compound, a titanium compound, and a zirconium compound, or composite particles of a silicon compound and one or more metal compounds selected from an aluminium compound, a tin compound, a titanium compound, and a zirconium compound; a naphthoquinone diazide compound; and a solvent.

Abstract: A substrate having a desired pattern on a plane thereof and a method for manufacturing same, a light-emitting element and a method for manufacturing same, and a device having the substrate or the light-emitting element are provided which allow the pattern to be formed without any photoresist film, enabling a reduction in the number of steps and a reduction in costs associated with the reduction in the number of steps. A flat substrate is prepared, a dielectric containing a photosensitive agent is formed on a plane of the substrate, the dielectric is patterned to form a desired pattern on the substrate plane, thus, a substrate is obtained which has a pattern of island-shaped protrusions on the plane of the flat substrate and in which the protrusions are configured of the dielectric.

Abstract: A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.

Abstract: Disclosed is a positive photosensitive resin composition which is characterized by containing (a) a polysiloxane that is synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane oligomer, (b) aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, composite particles of the aforementioned compounds or composite particles of any of the aforementioned compounds and a silicon compound, (c) a naphthoquinonediazide compound and (d) a solvent. The positive photosensitive resin composition is also characterized in that the organosilane oligomer contains a specific organosilane. The positive photosensitive resin composition has achieved excellent sensitivity and resolution without deteriorating high refractive index and high transparency.

Abstract: A photosensitive resin composition which can impart insulating properties and light-shielding properties against light having a wavelength lying in an ultra-violet range, a visible range and a near-infrared range to a substrate more readily when applied onto the substrate, wherein the substrate has such properties that the permeability to light having a wavelength of 400 to 900 nm inclusive is less than 3.0% and the maximum value of the permeability to light having a wavelength of longer than 900 nm and not longer than 1300 nm is 3.0% or more. The photosensitive resin composition is characterized by comprising (a) an alkali soluble resin, (b) a specific tungsten oxide and/or a specific composite tungsten oxide, (c) a photopolymerizable compound having at least two polymerizable groups, (d) an oxime-type photopolymerization initiator, and (e) a solvent.

Abstract: Disclosed is a positive photosensitive resin composition which is characterized by containing (a) a polysiloxane that is synthesized by hydrolyzing and partially condensing a specific organosilane and an organosilane oligomer, (b) aluminum compound particles, tin compound particles, titanium compound particles, zirconium compound particles, composite particles of the aforementioned compounds or composite particles of any of the aforementioned compounds and a silicon compound, (c) a naphthoquinonediazide compound and (d) a solvent. The positive photosensitive resin composition is also characterized in that the organosilane oligomer contains a specific organosilane. The positive photosensitive resin composition has achieved excellent sensitivity and resolution without deteriorating high refractive index and high transparency.