Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

Abstract: An infrared sensor includes an infrared detecting device, a lens, a member, a gap and a spacer. The lens is disposed above the infrared detecting device. The member forms an external surface and includes a first opening having a maximum internal diameter. The gap is disposed between the member and the lens. The spacer is disposed between the member and the lens so as to form the gap, and that is directly contact with lens. The spacer has a circular inner periphery, in planar view, which has a larger internal diameter than the maximum internal diameter of the first opening of the member.

Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.

Abstract: The present invention relates to an organic electroluminescence element in which a transparent first electrode, an organic light emitting layer, a second electrode are stacked on a translucent substrate in this order. The translucent substrate includes a moisture-proof layer facing the first electrode. An LR layer and an HR layer having a refractive index higher than a refractive index of the LR layer are situated between the moisture-proof layer and the first electrode in this order from the moisture-proof layer. An uneven structure is provided at an interface between the LR layer and the HR layer. A linear expansivity ? of the moisture-proof layer, and a linear expansivity ? of the LR layer, and a linear expansivity ? of the HR layer satisfy a relation of ?????.

Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

Abstract: The present invention relates to an organic electroluminescence element in which a transparent first electrode, an organic light emitting layer, a second electrode are stacked on a translucent substrate in this order. The translucent substrate includes a moisture-proof layer facing the first electrode. An LR layer and an HR layer having a refractive index higher than a refractive index of the LR layer are situated between the moisture-proof layer and the first electrode in this order from the moisture-proof layer. An uneven structure is provided at an interface between the LR layer and the HR layer. A linear expansivity ? of the moisture-proof layer, and a linear expansivity ? of the LR layer, and a linear expansivity ? of the HR layer satisfy a relation of ?????.

Abstract: An infrared radiation element includes: a first insulating layer having heat insulating properties and electrically insulating properties; a heating element layer provided on the first insulating layer and configured to radiate infrared radiation when energized; and a second insulating layer provided on an opposite side of the heating element layer from the first insulating layer and having heat insulating properties and electrically insulating properties. The second insulating layer transmits the infrared radiation radiated from the heating element layer. The heating element layer has such a sheet resistance that impedance of the heating element layer matches impedance of space which is in contact with the second insulating layer.

Abstract: The organic electroluminescence element includes: a substrate; an organic light emitter formed on a surface of the substrate and including a first electrode, an organic light emitting layer, and a second electrode in this order; and an enclosing member bonded to the substrate to enclose the organic light emitter by covering it. The element further includes: an extended electrode part electrically connected to the first electrode and/or the second electrode and extending outward across the enclosing member to be on a surface of an end part of the substrate; and an electrode piece serving as an interconnection electrode and provided on an opposite side of the enclosing member from the substrate. The electrode piece includes an extension part fixed to the extended electrode part to make electric connection between the electrode piece and the extended electrode part.

Abstract: An infrared radiation element includes: a first insulating layer having heat insulating properties and electrically insulating properties; a heating element layer provided on the first insulating layer and configured to radiate infrared radiation when energized; and a second insulating layer provided on an opposite side of the heating element layer from the first insulating layer and having heat insulating properties and electrically insulating properties. The second insulating layer transmits the infrared radiation radiated from the heating element layer. The heating element layer has such a sheet resistance that impedance of the heating element layer matches impedance of space which is in contact with the second insulating layer.

Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

Abstract: An infrared sensor includes: an infrared detecting device; a lens disposed above the infrared detecting device; an member that is disposed at a side of an upper surface of the lens and includes an opening; and a gap that intervenes between the member and the lens and has a wider range than the opening.

Abstract: The LED module comprises a flexible wiring substrate and surface mounting type LED packages. The flexible wiring substrate is formed at its surface with power supply terminals which comprises a first electrode pad and a second electrode pad, and is formed with a patterned wiring being electrically connected to the patterned wiring. The surface mounting type LED package comprises an LED chip and a mounting substrate. The mounting substrate is formed at its front surface with a recess, and its rear surface with a first connection electrode and the second connection electrode which are electrically connected to the first electrode pad and the second electrode pad, respectively when the mounting substrate is mounted on the flexible wiring substrate. The LED chip is disposed within the recess so as to receive the electrical current through the outside connection electrode and the power supply terminal.

Abstract: The infrared sensor includes: an infrared sensor chip in which a plurality of pixel portions each including a temperature-sensitive portion formed of a thermopile is disposed in an array on one surface side of a semiconductor substrate; and an IC chip that processes an output signal of the infrared sensor chip. A package includes a package main body on which the infrared sensor chip and the IC chip are mounted to be arranged side-by-side, and a package cover that has a lens transmitting infrared rays and is hermetically bonded to the package main body. The package is provided therein with a cover member that includes a window hole through which infrared rays pass into the infrared sensor chip and equalizes amounts of temperature change of hot junctions and cold junctions among the pixel portions, the temperature change resulting from heating of the IC chip.

Abstract: An infrared sensor module includes: an infrared sensor device disposed on a substrate and configured to receive infrared signals; a signal processing circuit device configured to process an output from the infrared sensor device; a metal case which is provided at a predetermined distance from the infrared sensor device, which includes a light incident window provided with an optical system for coupling an image on the infrared sensor device from external infrared signals, and which accommodates the infrared sensor device and the signal processing circuit device; and a sensor cover which is disposed between the infrared sensor device and the case and the signal processing circuit device, and which includes a light-transmitting portion configured to guide the infrared signals entering via the optical system to the infrared sensor device.

Abstract: To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.

Abstract: The LED module comprises a flexible wiring substrate and surface mounting type LED packages. The flexible wiring substrate is formed at its surface with power supply terminals which comprises a first electrode pad and a second electrode pad, and is formed with a patterned wiring being electrically connected to the patterned wiring. The surface mounting type LED package comprises an LED chip and a mounting substrate. The mounting substrate is formed at its front surface with a recess, and its rear surface with a first connection electrode and the second connection electrode which are electrically connected to the first electrode pad and the second electrode pad, respectively when the mounting substrate is mounted on the flexible wiring substrate. The LED chip is disposed within the recess so as to receive the electrical current through the outside connection electrode and the power supply terminal.

Abstract: To improve thermal insulation, a thermal infrared sensing element is carried on a sensor mount of a porous material and is spaced upwardly from a substrate by means of anchor studs projecting on the substrate. The sensor mount is formed with a pair of coplanar beams carry thereon leads extending from the sensing element. The leads and the beams are secured to the upper ends of the anchor studs to hold the sensing element at a predetermined height above the substrate. The beams and the leads are combined with each other by intermolecular adhesion such that the sensing element as well as the sensor mount can be altogether supported to the anchor studs.

Abstract: An infrared sensor unit has a thermal infrared sensor and an associated semiconductor device commonly developed on a semiconductor substrate. A dielectric top layer covers the substrate to conceal the semiconductor device formed in the top surface of the substrate. The thermal infrared sensor carried on a sensor mount which is supported above the semiconductor device by means of a thermal insulation support. The sensor mount and the support are made of a porous material which is superimposed on top of the dielectric top layer.