Abstract: According to an apparatus and a method for manufacturing a hot-rolled steel plate, a roughing process for reducing a thickness of a continuously cast slab is performed to obtain a sheet bar, and a finishing rolling process for rolling the sheet bar is effected to produce a hot-rolled steel plate having a predetermined plate thickness. After cooling down, the hot-rolled steel plate is then wound. A pair of dies 6 each of which has a tapered portion 6b on an input side and a parallel portion 6b on an output side are used in at least part of the roughing process. Further, before performing plate thickness pressing to a material in a plate thickness direction by using the dies 6, at least one of a front end and a rear end of the material is pressed in a widthwise direction to be pre-formed.

Abstract: Each of a pair of rolls has a barrel with different diameters axially of the barrel such that sum of the diameters of the barrels is substantially constant and that each of the rolls is bilaterally symmetrical. The rolls themselves have an ability to control workpiece profile and have at least one substantially parallel center portion.

Abstract: In a method for forming a capacitor, after preparing a substrate having at least one device area thereon, an amorphous silicon film containing one type of dopant is formed on the device area. A mask layer comprising mask islands is formed and distributed on a surface of the amorphous silicon film. The surface of the amorphous silicon is dry-etched by using the mask layer as a selective etching mask to produce a jagged surface having a lot of protrusions. After forming the jagged surface, the amorphous silicon film is changed into a polycrystalline silicon film serving as a storage electrode. Finally, a dielectric film and then another storage electrode are formed sequentially on the jagged surface of the storage electrode.

Abstract: First, a metal layer is deposited on a silicon film surface to form a silicide layer in an interface between the silicon film and the metal layer. Subsequently, the metal layer is all removed by etching such that silicide islands are left on the surface of the silicon film, and then the exposed silicon film surface is dry-etched by using the silicide islands as a selective mask.

Abstract: A chemical vapor deposition apparatus includes a reaction tube, a substrate-holder installed in the reaction tube, the substrate-holder holding a plurality of substrates in a vertical direction, surfaces of the substrates being held horizontally, a rotating-means for rotating the substrate-holder, a heating-means for heating the substrates, a first gas-supply nozzle tube installed vertically in the reaction tube, the first gas-supply nozzle tube having a first vertical gas-emission line of a plurality of first gas-emission holes aligned in a vertical direction, and a second gas-supply nozzle tube installed vertically in the reaction tube, the second gas-supply nozzle tube having a second vertical gas-emission line, a plurality of second gas-emission holes aligned in a vertical direction, a first gas-emitting-axis of the first gas-emission holes intersecting with a second gas-emitting-axis of the second gas-emission holes at a first intersection over the substrate, the first intersection of the first and secon

Abstract: A gettering method has a step in which the back surface of a semiconductor substrate having the upper surface on which semiconductor device elements is to be formed, with a laser beam having a wavelength of 150 to 400 nm to introduce strain fields onto the back surface of the substrate. The energy density of the laser beam is from 0.5 to 10 J/cm.sup.2, and the irradiation pitch of the laser is 40 to 1500 .mu.m. The laser irradiation may be effected under the condition where an oxide film or a nitride film is formed on the back surface of the semiconductor substrate, or after the back surface of the semiconductor substrate is blasted with fine particles of silica or the like.

Abstract: A rolling process wherein a pair of working rolls are driven at different peripheral velocities so that the peripheral velocity ratio may be varied, and the peripheral velocity ratio is so controlled that the rolling torque of each of the working rolls may be within a maximum tolerable torque which the working roll may transmit, thereby reducing the rolling force.

Abstract: Metal rolling process and mill wherein the ratio in peripheral velocity between a pair of upper and lower work rolls is so controlled that a metal may be rolled to a desired shape or to close thickness tolerances.