Patents by Inventor Masao Ohnuki

Masao Ohnuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8921707
    Abstract: A suspension substrate according to the present invention includes an insulating layer and a metallic support layer provided on the actuator element's side of the insulating layer. On the other side of the insulating layer, a wiring layer is provided. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. The outer periphery of the metallic support layer in a connection structure region is positioned outside relative to the outer periphery of the insulating layer and the outer periphery of the wiring connection section of the wiring layer.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: December 30, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Masao Ohnuki
  • Patent number: 8810970
    Abstract: A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein the metal supporting substrate has, in a recording element mounting region for mounting a recording element, an opening for arranging and fitting thereinto a heat assisting element, wherein the wiring layer has a heat assisting wiring layer having a terminal section for supplying electric power directly to the heat assisting element.
    Type: Grant
    Filed: January 13, 2014
    Date of Patent: August 19, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Masao Ohnuki
  • Publication number: 20140126086
    Abstract: A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein the metal supporting substrate has, in a recording element mounting region for mounting a recording element, an opening for arranging and fitting thereinto a heat assisting element, wherein the wiring layer has a heat assisting wiring layer having a terminal section for supplying electric power directly to the heat assisting element.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Masao OHNUKI
  • Patent number: 8669475
    Abstract: A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein the metal supporting substrate has, in a recording element mounting region for mounting a recording element, an opening for arranging and fitting thereinto a heat assisting element, wherein the wiring layer has a heat assisting wiring layer having a terminal section for supplying electric power directly to the heat assisting element.
    Type: Grant
    Filed: August 29, 2011
    Date of Patent: March 11, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Masao Ohnuki
  • Patent number: 8634166
    Abstract: A suspension substrate according the present invention includes: an insulating layer; a metallic support layer provided on the actuator element's side of the insulating layer. A wiring layer is provided on the other side of the insulating layer. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. A conductive connection section extending through the insulating layer and configured to connecting the metallic support layer with the wiring connection section of the wiring layer is provided in the connection structure region.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: January 21, 2014
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masao Ohnuki, Yoichi Miura
  • Patent number: 8519272
    Abstract: The object of the present invention is to provide a suspension substrate such that the thickness of an insulating layer for supporting a connecting terminal having a flying structure is uniform. The present invention attains the object by providing a suspension substrate, comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein a wiring layer projecting section is provided by a plurality; an adjusting section formed on the insulating layer and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections; and a gap between a first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between a second outermost wiring layer projecting section and the second adjusting section are equal.
    Type: Grant
    Filed: March 22, 2011
    Date of Patent: August 27, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventor: Masao Ohnuki
  • Patent number: 8390958
    Abstract: A suspension substrate according to the present invention includes an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in a substrate main body region and isolated from each wiring. Further, in the substrate main body region, an alignment through hole is provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer. This alignment through hole is used for alignment for the actuator elements.
    Type: Grant
    Filed: July 5, 2011
    Date of Patent: March 5, 2013
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Masao Ohnuki, Tsuyoshi Yamazaki
  • Publication number: 20120048609
    Abstract: A main object of the present invention is to provide a suspension substrate capable of supplying electric power easily to an assisting element fitted thereto. The object is attained by providing a suspension substrate comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein the metal supporting substrate has, in a recording element mounting region for mounting a recording element, an opening for arranging and fitting thereinto a heat assisting element, wherein the wiring layer has a heat assisting wiring layer having a terminal section for supplying electric power directly to the heat assisting element.
    Type: Application
    Filed: August 29, 2011
    Publication date: March 1, 2012
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Masao OHNUKI
  • Publication number: 20120014017
    Abstract: A suspension substrate according the present invention includes: an insulating layer; a metallic support layer provided on the actuator element's side of the insulating layer. A wiring layer is provided on the other side of the insulating layer. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. A conductive connection section extending through the insulating layer and configured to connecting the metallic support layer with the wiring connection section of the wiring layer is provided in the connection structure region.
    Type: Application
    Filed: July 8, 2011
    Publication date: January 19, 2012
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masao Ohnuki, Yoichi Miura
  • Publication number: 20120006586
    Abstract: A suspension substrate according to the present invention includes an insulating layer and a metallic support layer provided on the actuator element's side of the insulating layer. On the other side of the insulating layer, a wiring layer is provided. This wiring layer includes a plurality of wirings and a wiring connection section that can be electrically connected with the actuator element via a conductive adhesive. The outer periphery of the metallic support layer in a connection structure region is positioned outside relative to the outer periphery of the insulating layer and the outer periphery of the wiring connection section of the wiring layer.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 12, 2012
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventor: Masao OHNUKI
  • Publication number: 20120002366
    Abstract: A suspension substrate according to the present invention includes an insulating layer, a metallic support layer provided on one face of the insulating layer, a wiring layer provided on the other face of the insulating layer, the wiring layer including a plurality of wirings and an alignment section located in a substrate main body region and isolated from each wiring. Further, in the substrate main body region, an alignment through hole is provided to extend through the metallic support layer, insulating layer and alignment section of the wiring layer. This alignment through hole is used for alignment for the actuator elements.
    Type: Application
    Filed: July 5, 2011
    Publication date: January 5, 2012
    Applicant: Dai Nippon Printing Co., Ltd.
    Inventors: Masao OHNUKI, Tsuyoshi YAMAZAKI
  • Publication number: 20110235213
    Abstract: The object of the present invention is to provide a suspension substrate such that the thickness of an insulating layer for supporting a connecting terminal having a flying structure is uniform. The present invention attains the object by providing a suspension substrate, comprising a metal supporting substrate, an insulating layer formed on the metal supporting substrate, and a wiring layer formed on the insulating layer, wherein a wiring layer projecting section is provided by a plurality; an adjusting section formed on the insulating layer and composed of a first adjusting section and a second adjusting section is provided on both sides of the plural wiring layer projecting sections; and a gap between a first outermost wiring layer projecting section and the first adjusting section, a gap between the adjacent wiring layer projecting sections, and a gap between a second outermost wiring layer projecting section and the second adjusting section are equal.
    Type: Application
    Filed: March 22, 2011
    Publication date: September 29, 2011
    Applicant: DAI NIPPON PRINTING CO., LTD.
    Inventor: Masao OHNUKI