Abstract: A sintered material excellent in thermal stress and bonding strength; a connection structure containing the sintered material; a composition for bonding with which the sintered material can be produced; and a method for producing the sintered material. The sintered material has a base portion, buffer portions, and filling portions. The buffer portions and filling portions are dispersed in the base portion. The base portion is a metal sintered body, each buffer portion is formed from a pore and/or material that is not the same as the sintered body, and each filling portion is formed from particles and/or fibers. The sintered material satisfies A>B. A is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material. B is the kurtosis of volume distribution of the base portions in a three-dimensional image of the sintered material from which the filling portions are removed.

Abstract: Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13, through holes 11, and conductive parts 12. The multiple through holes 11 are arranged in the substrate 13, the conductive parts 12 are housed inside the through holes 11, and the conductive parts 12 contain conductive particles 2. The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21. The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.

Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?m or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

Abstract: Provided is a metal-containing particle which can be bonded to another particle or another member by melting a tip of a protrusion in the metal-containing particle at a relatively low temperature and solidifying the melt after melting, enhance connection reliability, suppress an ion migration phenomenon, and enhance insulation reliability. The metal-containing particle according to the present invention is a metal-containing particle, an outer surface of which has a plurality of protrusions, in which the metal-containing particle includes a base particle, a metal section which is disposed on a surface of the base particle, an outer surface of the metal section having a plurality of protrusions, and a metal film covering the outer surface of the metal section, and a tip of the protrusion in the metal-containing particle is meltable at 400° C. or less.

Abstract: Provided are a sintered material excellent in both thermal stress and bonding strength; a connection structure comprising the sintered material; a composition for bonding with which the sintered material can be produced; and a method for producing the sintered material. The sintered material comprises a base portion, one or more buffer portions, and one or more filling portions. The buffer portions and the filling portions are dispersed in the base portion. The base portion is a metal sintered body, each buffer portion is formed from at least one of a pore and a material that is not the same as that of the sintered body, and each filling portion is formed from at least one of particles and fibers.

Abstract: Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13, through holes 11, and conductive parts 12. The multiple through holes 11 are arranged in the substrate 13, the conductive parts 12 are housed inside the through holes 11, and the conductive parts 12 contain conductive particles 2. The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21. The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.

Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?or more and 15 ?m or loss, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part, that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part, after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 nm or more and 15 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 50% or less.

Abstract: Particles that can suppress the occurrence of cracking or peeling during a thermal cycle in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part, and can increase the connection strength are provided. The particles according to the present invention are particles used to obtain a connecting material for forming a connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of 30 N/mm2 or more and 3000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.

Abstract: A connecting material that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected, further can suppress the variation in thickness in the connection part to ensure the heat dissipation performance, and can increase the connection strength is provided. The connecting material according to the present invention is a connecting material used for forming the connection part that connects two members to be connected, the connecting material contains particles and metal atom-containing particles, the particles are used for forming the connection part such that thickness of the connection part after connection is twice or less the average particle diameter of the particles before connection, or the particles have an average particle diameter of 1 ?m or more and 300 ?m or less, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 N/mm2 or less, and the particles have a particle diameter CV value of 10% or less.