Abstract: There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

Abstract: There is provided a method for producing a plated article in which a plating film pattern is formed on the surface of a glass substrate, comprising a first step of irradiating a partial area of the surface of the glass substrate with a pulsed laser; a second step of attaching an electroless catalyst on the surface of the glass substrate; a third step of selectively deactivating or selectively removing the catalyst attached to the unirradiated area with the pulsed laser in the glass substrate; and a fourth step of nonelectrolytically plating the glass substrate after the third step to selectively form a plating film in the irradiated area with the pulsed laser. The method allows for easily producing a plated article in which a highly adherent plating film pattern is formed on the surface of the glass substrate.

Abstract: There is provided a method for producing a plated article, comprising immersing a substrate made of a conductive metal in a plating solution and forming a plating layer on the substrate by electroplating, wherein the plating solution is a solution containing 0.01 to 1 mol/L of Ni ions with pH of 6 or more; and a porous Ni plating layer is formed by performing the electroplating at a cathode current density of 10 A/dm2 or more. This method allows for easily producing a plated article wherein a uniform porous Ni plating layer is formed on the surface of a substrate.

Abstract: An electrical component is provided by a method comprising forming a middle plated layer made of palladium or a palladium alloy on a substrate and forming a surface plated layer made of tin or a tin alloy containing a metal other than palladium on the middle plated layer. Thus, there can be provided an electrical component having a surface layer consisting primarily of tin in which whisker formation can be prevented for a long period under stress.