Patents by Inventor Masao Takehiro

Masao Takehiro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
    Patent number: 6716675
    Abstract: The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.
    Type: Grant
    Filed: August 23, 2002
    Date of Patent: April 6, 2004
    Assignee: Fujitsu Limited
    Inventors: Masaki Waki, Fumitoshi Fujisaki, Masao Takehiro, Shinichiro Maki
  • Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
    Publication number: 20030006501
    Abstract: The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a resin package sealing this semiconductor element, a terminal formed on a mount side of this resin package so as to protrude thereon, and a wire electrically connecting this terminal and an electrode pad on the semiconductor element to each other, a heat sink dissipating heat generated in the semiconductor element is provided on an undersurface of the semiconductor element so as to improve a heat-dissipation property.
    Type: Application
    Filed: August 23, 2002
    Publication date: January 9, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Masaki Waki, Fumitoshi Fujisaki, Masao Takehiro, Shinichiro Maki