Patents by Inventor Masao Tezuka
Masao Tezuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11705625Abstract: Disclosed herein is an antenna device that includes a first molded substrate having first and second surfaces opposite to each other, a second molded substrate having third and fourth surfaces opposite to each other, a first electrode formed on the first surface of the first molded substrate, a feed electrode formed on the second surface of the first molded substrate so as to overlap the first electrode in a plan view, and a first ground electrode formed on the third surface of the second molded substrate. The first and second molded substrates overlap each other such that the second surface of the first molded substrate and the fourth surface of the second molded substrate face each other.Type: GrantFiled: June 2, 2021Date of Patent: July 18, 2023Assignee: TDK CORPORATIONInventor: Masao Tezuka
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Publication number: 20210384619Abstract: Disclosed herein is an antenna device that includes a first molded substrate having first and second surfaces opposite to each other, a second molded substrate having third and fourth surfaces opposite to each other, a first electrode formed on the first surface of the first molded substrate, a feed electrode formed on the second surface of the first molded substrate so as to overlap the first electrode in a plan view, and a first ground electrode formed on the third surface of the second molded substrate. The first and second molded substrates overlap each other such that the second surface of the first molded substrate and the fourth surface of the second molded substrate face each other.Type: ApplicationFiled: June 2, 2021Publication date: December 9, 2021Inventor: Masao TEZUKA
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Patent number: 10910695Abstract: An on-chip antenna includes an integrated circuit chip, a reflective conductor, at least one first coupler, at least one patch antenna element, a connection, and at least one second coupler. The integrated circuit chip includes a semiconductor, has an active surface and a back surface opposed to each other, and has a semiconductor circuit. The reflective conductor is disposed above the back surface. The at least one first coupler is disposed between the back surface and the reflective conductor. The at least one patch antenna element is disposed above the reflective conductor. The connection couples the at least one patch antenna element and the at least one first coupler. The at least one second coupler is provided on the active surface to be electrically conductive to the semiconductor circuit, and is opposed to the at least one first coupler and in non-contact with the at least one first coupler.Type: GrantFiled: September 4, 2019Date of Patent: February 2, 2021Assignee: TDK CORPORATIONInventor: Masao Tezuka
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Publication number: 20200091584Abstract: An on-chip antenna includes an integrated circuit chip, a reflective conductor, at least one first coupler, at least one patch antenna element, a connection, and at least one second coupler. The integrated circuit chip includes a semiconductor, has an active surface and a back surface opposed to each other, and has a semiconductor circuit. The reflective conductor is disposed above the back surface. The at least one first coupler is disposed between the back surface and the reflective conductor. The at least one patch antenna element is disposed above the reflective conductor. The connection couples the at least one patch antenna element and the at least one first coupler. The at least one second coupler is provided on the active surface to be electrically conductive to the semiconductor circuit, and is opposed to the at least one first coupler and in non-contact with the at least one first coupler.Type: ApplicationFiled: September 4, 2019Publication date: March 19, 2020Applicant: TDK CORPORATIONInventor: Masao TEZUKA
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Publication number: 20070042745Abstract: A wireless communication device relays data between a USB terminal of a computer, and a peripheral device which is usually connected to the USB terminal. The wireless communication device has a DC power input terminal connected to an external power source, and a DC power output terminal connected to the peripheral device. A art of the power input to the DC power input terminal is used for driving the wireless communication device and another part of the power is supplied to the peripheral device via the DC power output terminal.Type: ApplicationFiled: June 28, 2006Publication date: February 22, 2007Applicant: TDK CORPORATIONInventor: Masao Tezuka
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Publication number: 20040023642Abstract: A wireless access point capable of building up a communication network which, despite of its simple constitution, prevents eavesdropping of authentication data, facilitates the system management and effects the authentication within a short period of time. A central control unit at a wireless access point reads a bridge control program, an IEEE 802.1x control program and an authentication control program into a memory to execute them. Based upon the IEEE 802.1x control program and the authentication control program, the central control unit authenticates a wireless terminal on a wireless LAN in response to a request for access to a network on a wired LAN from the wireless terminal on the wireless LAN, and notifies a common key of WEP to the wireless terminal on the wireless LAN when the authentication is obtained. Thus, the wireless access point is furnished with an authentication server function which is installed on the wired LAN in a conventional network system.Type: ApplicationFiled: February 20, 2003Publication date: February 5, 2004Applicant: TDK CorporationInventor: Masao Tezuka
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Patent number: 4782316Abstract: Electromagnetic parts have windings composed of an inorganic insulating cable including a metal sheath, an inorganic insulating material, and conductive wires. Thereby, the windings are adapted to have higher heat resisting properties by selectively employing a material having a higher melting point and not changing its state even at temperature of about several hundred degrees Celsius as the sheath and the conductive wire.Type: GrantFiled: November 14, 1986Date of Patent: November 1, 1988Assignee: Sukegawa Electric Co., Ltd.Inventors: Yokichi Domeki, Masanori Nozaki, Hajime Ishimaru, Masao Tezuka
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Patent number: 4446115Abstract: Disclosed is method of recovering tantalum from silicon-containing tantalum scrap, which comprises dissolving said scrap in an inorganic acid, bringing the resulting solution into contact with an anionic exchange resin, followed by washing said anionic exchange resin with (a) a solution of 3 to 10 mol/l. of hydrofluoric acid or (b) a solution of strongly acidic medium containing 0.01 to 0.5 mol/l. of hydrofluoric acid and 1 to 6 mol/l. of a strong acid, and then washing the same with an aqueous solution of a mixture composed of hydrofluoric acid, aqueous ammonia and an ammonium salt.Type: GrantFiled: March 2, 1982Date of Patent: May 1, 1984Assignee: Tokyo Shibaura Denki Kabushiki KaishaInventors: Hiroshi Endo, Naoyuki Hirate, Masao Tezuka
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Patent number: 4287229Abstract: Disclosed is a method for surface treatment of phosphor particles which comprises forming a continuous film of silicon dioxide on the surface of each phosphor particle by treating the phosphor particle with a solution containing an aqueous solution of organic alkali and silicon dioxide dissolved therein.Type: GrantFiled: November 5, 1979Date of Patent: September 1, 1981Assignee: Tokyo Shibaura Denki KabushikikaishaInventors: Minoru Watanabe, Mitsuhiro Oikawa, Toshio Nishimura, Masao Asada, Masao Tezuka, Tsurahide Cho