Abstract: A socket (1) for burn-in tests of IC packages employs rack and pinion gears to drive contact makers (6). As a cover (3) is depressed against coil springs (38), a slide actuator member (4) with sliding portions (30, 32) is raised by rack (3b, 26a, 27a, 28a, 29a) and pinion gears (34, 35). Slide actuator member 4 includes grid members (4b) which bias the contact makers (6) into an open position when the actuator member is raised and allows the contact makers to close when the slide actuator member is lowered. Supporting surfaces (30d, 32d) of the sliding parts (30, 32) of the slide actuator member are raised higher than interdigitated loading surfaces (20a, 21a) of guide elements (20, 21) of the base (2) so that the IC package (5) can be easily positioned by the supporting surfaces (30d, 32d) without engaging the ball terminals (5b) with arms (6a, 6b) of contact makers (6). Cover (3) begins to move upwardly when the downward force on the cover is released, while the slide actuator member (4) moves downwardly.

Abstract: An IC seating portion (14) of a socket (2) for a semiconductor device (300) is arranged so that the IC terminal leads can engage with contact heads (22) of contact pins (20) mounted in the socket. Each contact pin (20) is arranged in a respective slit (8) formed by partition members (7) providing electrically isolation of the contact pins from one another. Socket (2) has a blocking member (3) which blocks the gaps or slits at their top to prevent IC terminal leads from becoming entangled with the slits or contact pins (20). A stop member (4) is formed in the IC seating portion (14) to facilitate positioning of a semiconductor device (300) on the seating portion and to prevent the IC terminal leads from interfering with contact pins (20).

Abstract: A socket for removably mounting an electric part such as an IC package (30) has a cover (14) which when pushed down from a raised at rest position causes a drive shaft (26) fixed to the cover (14) to move down rotating a first lever (36) and actuating a second lever (38). Upon such rotation a latch (48) moves to a receded position which is obliquely above a plurality of contact elements (28) and, at the same time, vertically movable arms (50) rise to a selected vertical position from a cavity (52). The IC package (30) is then received on the vertically movable arms (50).

Abstract: A socket having a structure which is suitable for electrical connection with ball-shaped lead terminals of an IC package is shown. When a cover (12) is pushed down, a latch (70) moves away, a slide plate (40) slides toward the positive side in an X direction through levers (52) and (50) and movable shaft (58) and both arms of each contact maker (30) open. Each lead terminal (solder ball) (32a) of the BGA package (32) is freely inserted between both arms of a respective contact maker (30) when in the open state. When cover (12) rises to its highest position, slide plate (40) slides in the reverse direction by the spring force of a compression coil spring, thereby returning to the its original position and both arms of each contact (32) engage each lead terminal (32a) in such a way as to hold it from opposite sides with a result that an electrical connection based on compressive engagement is obtained between each contact element (30) and each respective terminal (32a).

Abstract: A socket having contact elements (22, 22', 50, 89) movable into and out of engagement with terminal leads (14a, 87) of an electrical component has a connection assembly (28, 34; 28', 34'; 58, 60, 66; 90, 91, 95) rotatably mounted to the base (10, 52, 80) of the socket for moving the contact elements into and out of engagement with the terminal leads. The connection assembly is driven by a movable cover (12) or by a motor (46) through a shaft (26, 54) which may be interconnected with comparable shafts on other sockets.

Abstract: A coating composition for building materials which comprises 100 parts by weight of a quaternary ammonium silicate having a silica content, calculated as SiO.sub.2, of 5 to 70% by weight, 2 to 200 parts by weight of a metal oxide and/or hydroxide capable of converting silica sol to silica gel and water in an amount sufficient to plasticize said composition.