Patents by Inventor Masao Tsukizawa
Masao Tsukizawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8169784Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.Type: GrantFiled: September 26, 2008Date of Patent: May 1, 2012Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLCInventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Patent number: 8107255Abstract: Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.Type: GrantFiled: September 26, 2008Date of Patent: January 31, 2012Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLCInventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Patent number: 8102655Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.Type: GrantFiled: July 15, 2010Date of Patent: January 24, 2012Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLCInventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Patent number: 8102670Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.Type: GrantFiled: September 26, 2008Date of Patent: January 24, 2012Assignees: SANYO Semiconductor Co., Ltd., Semiconductor Components Industries, LLCInventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Publication number: 20100284159Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.Type: ApplicationFiled: July 15, 2010Publication date: November 11, 2010Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Patent number: 7782628Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.Type: GrantFiled: September 26, 2008Date of Patent: August 24, 2010Assignees: Sanyo Electric Co., Ltd., Sanyo Semiconductor Co., Ltd.Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Patent number: 7751194Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.Type: GrantFiled: September 26, 2008Date of Patent: July 6, 2010Assignees: Sanyo Electric Co., Ltd., Sanyo Semiconductor Co. Ltd.Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Publication number: 20090103276Abstract: Provided is a circuit device that allows a plurality of circuit boards, which are stacked each other and arranged in a case member, to be sealed with a resin effectively, and a method of manufacturing the same. In a hybrid integrated circuit device, a first circuit board is overlaid with the second circuit board and both of the boards are fitted into the case member. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, an opening is provided in a side wall part of the case member, and an internal space of the case member communicates with the outside through this opening. Accordingly, in the resin sealing step, a sealing resin can be injected into the internal space of the case member from the outside through this opening.Type: ApplicationFiled: September 26, 2008Publication date: April 23, 2009Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Hideyuki SAKAMOTO, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Publication number: 20090086431Abstract: Provided is a circuit device capable of increasing the packaging density and also suppressing the thermal interference between incorporated circuit elements. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member being arranged in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. In addition, inside the case member, a hollow portion (internal space) which is not filled with a sealing resin is provided, and this hollow portion communicates with the outside through a communicating opening, which is provided by partially opening the case member.Type: ApplicationFiled: September 26, 2008Publication date: April 2, 2009Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Publication number: 20090086442Abstract: To improve reliability of a circuit module by improving heat release performance and minimizing thermal influence on a device to be mounted, a base substrate having a first substrate mounted thereon is fitted into a lower portion of casing member, and a second substrate is installed in the upper portion of the casing member so that a spaced area can be provided. In addition, a drive device to be installed on the second substrate is positioned off the center of the second substrate.Type: ApplicationFiled: September 26, 2008Publication date: April 2, 2009Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Hideyuki SAKAMOTO, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Publication number: 20090086455Abstract: Provided is a circuit device, in which circuit elements incorporated are electrically connected to each other via a lead so as to achieve both of the enhanced functionality and miniaturization. In a hybrid integrated circuit device, a first circuit board and a second circuit board are incorporated into a case member in a way that a first circuit board is overlaid with a second circuit board. A first circuit element is arranged on the upper face of the first circuit board and a second circuit element is arranged on the upper face of the second circuit board. Leads provided in the hybrid integrated circuit device include a lead connected only to the first circuit element mounted on the first circuit board, a lead connected only to the second circuit element mounted on the second circuit board, and a lead connected to both of the first circuit element and the second circuit element.Type: ApplicationFiled: September 26, 2008Publication date: April 2, 2009Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Hideyuki SAKAMOTO, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Publication number: 20090086454Abstract: Provided is a circuit device capable of increasing the packaging density and preventing the thermal interference between circuit elements to be incorporated. In a hybrid integrated circuit device, a first circuit board and a second circuit board are fitted into a case member in a way that the first circuit board is overlaid with the second circuit board. A first circuit element is arranged on the upper surface of the first circuit board and a second circuit element is arranged on the upper surface of the second circuit board. Furthermore, inside the case member, provided is a hollow portion that is not filled with a sealing resin. Such a configuration prevents the second circuit element, which is a microcomputer, from operating unstably due to a heat generated in the first circuit element, which is a power transistor, for example.Type: ApplicationFiled: September 26, 2008Publication date: April 2, 2009Applicants: SANYO Electric Co., Ltd., SANYO Semiconductor Co., Ltd.Inventors: Hideyuki Sakamoto, Hidefumi Saito, Yasuhiro Koike, Masao Tsukizawa
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Patent number: 7231307Abstract: In some embodiments, a temperature measuring apparatus is provided with a light receiving portion having a plurality of light receiving units for measuring heat quantity of divided temperature detecting area in a noncontact manner, a thermal sensor for detecting temperature of each of the plurality of light receiving units, a calculation portion for calculating a temperature of each of the divided temperature detecting areas based on the temperature obtained by the thermal sensor and the relative temperature difference obtained by the light receiving portion, a correction information holding portion for holding correction information on known reference temperature of the temperature detecting area and its corresponding calculated result outputted from the calculation portion obtained when heat quantity of the temperature detecting area is set to the reference temperature, and a correction portion for correcting the calculated result of the calculation portion based on the correction information.Type: GrantFiled: August 11, 2005Date of Patent: June 12, 2007Assignee: Sanyo Electric Co., Ltd.Inventors: Youji Takei, Masao Tsukizawa
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Publication number: 20060080056Abstract: In some embodiments, a temperature measuring apparatus is provided with a light receiving portion having a plurality of light receiving units for measuring heat quantity of divided temperature detecting area in a noncontact manner, a thermal sensor for detecting temperature of each of the plurality of light receiving units, a calculation portion for calculating a temperature of each of the divided temperature detecting areas based on the temperature obtained by the thermal sensor and the relative temperature difference obtained by the light receiving portion, a correction information holding portion for holding correction information on known reference temperature of the temperature detecting area and its corresponding calculated result outputted from the calculation portion obtained when heat quantity of the temperature detecting area is set to the reference temperature, and a correction portion for correcting the calculated result of the calculation portion based on the correction information.Type: ApplicationFiled: August 11, 2005Publication date: April 13, 2006Applicant: SANYO ELECTRIC CO., LTD.Inventors: Youji Takei, Masao Tsukizawa
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Publication number: 20060069532Abstract: In some embodiments, a noise reduction circuit for use in a temperature measuring apparatus includes a replacing processing portion configured to execute replacing processing for replacing data of one of plural pixels among plural pixels with data of another pixel among the plural pixels, the data of the one of plural pixels being discriminated as noise, and an averaging processing portion configured to execute averaging processing for averaging the data of the one of plural pixels to smooth the data of the one of plural pixels. The averaging processing is executed at the averaging processing portion after executing the replacing processing at the replacing processing portion.Type: ApplicationFiled: September 29, 2005Publication date: March 30, 2006Inventors: Youji Takei, Masao Tsukizawa