Abstract: The semiconductor device has two sets of semiconductor units 13, having a plurality of semiconductor pellets 11 arranged and connected in parallel on the same plane, which are connected in series with a common electrode plate 14 intervened between the semiconductor units 13. An anode plate 15 and a cathode plate 16 are arranged in parallel on both sides of the semiconductor units 13. These electrode plates are pushed against the opposed main faces of the semiconductor pellets 11 by pushing force of coned disc springs 17. A press-connecting screw member consisting of a through bolt 21 and a nut 22 is set through the center of the semiconductor units and the like. A pushing force is uniformly applied to respective parts of the electrode plates without being dispersed, and the electrode plates are securely pushed against the respective semiconductor pellets 11.

Abstract: Drum washer-drier includes a drum rotating about a horizontal rotary axis, a water tank including drum, and outer tank resiliently supporting water tank. A plurality of suspending rods are suspended from an upper inner surface of outer tank, and water tank is resiliently supported by providing compression springs between spring receiving portions at lower ends of suspending rods and support receiving portions of water tank. Further, a damper generating a sliding resistance as the spring is expanded/compressed is provided at the lower end portion of suspending rod. At the time of dehydration, drum is rotated for a prescribed time period at a rotation speed higher than critical rotation speed of a fluid balancer but lower than a resonance rotation speed caused by resilient support, and thereafter high speed rotation starts. A structure for protecting the fluid balancer formed of synthetic resin during drying is also provided.

Abstract: High power semiconductor module device constituted in such a manner that a circuit board to which semiconductor pellets are bonded is bonded onto a heat sink, and an electrically insulating case with elasticity which has a tubular portion surrounding the sides of the circuit board is mounted on the heat sink, wherein there is provided a push member which is composed of an electrically insulating material and pushes the respective pellet wholly or partially from above with a predetermined pressure. By thus pushing the pellet by means of the push member, the destruction of the module device due to the thermal fatigue of the bonded portions of the circuit board and the pellets, the bonded portion of the circuit board and heat sink, and the bonded portions of the bonding wires is prevented even when the temperature of the whole module is repeatedly raised and lowered by the repetition of heating and cooling during the operation of the pellets.

Abstract: Drum washer-drier includes a drum rotating about a horizontal rotary axis, a water tank including drum, and outer tank resiliently supporting water tank. A plurality of suspending rods are suspended from an upper inner surface of outer tank, and water tank is resiliently supported by providing compression springs between spring receiving portions at lower ends of suspending rods and support receiving portions of water tank. Further, a damper generating a sliding resistance as the spring is expanded/compressed is provided at the lower end portion of suspending rod. At the time of dehydration, drum is rotated for a prescribed time period at a rotation speed higher than critical rotation speed of a fluid balancer but lower than a resonance rotation speed caused by resilient support, and thereafter high speed rotation starts. A structure for protecting the fluid balancer formed of synthetic resin during drying is also provided.

Abstract: A semiconductor module device according to the present invention includes a disk-shaped DBC circuit board which are divided into, e.g., six sectorial DBC circuit boards. A plurality of semiconductor pellets are arranged in a staggered fashion on each of the sectorial DBC circuit boards. Externally leading electrodes are provided at the respective innermosts of the sectorial DBC circuit boards, and externally leading power terminals, which are connected to the externally leading electrodes, are extracted from the central part of the DBC circuit board. With this constitution, the distances between the externally leading power terminals and the sectorial DBC circuit boards can be minimized, and the distances between the externally leading power terminals and the semiconductor pellets on the sectorial DBC circuit boards can be uniformed, with the result that the efficiency and reliability of the module device can be improved.

Abstract: A propeller blade tip path plane-inclining device which is provided with a fuselage, a propeller including a center piece rotating unitary with a rotation shaft in association therewith and a plurality of blades extending substantially horizontally from the center piece and differing the variation in pitch during the rotation thereof from one another, a motor for driving the propeller for rotation, a position detector for detecting the position of the propeller in the propeller rotation plane, and a control device for controlling the motor in accordance with an output signal of the position detector.

Abstract: A resin for powder molding having a superior flow-ability; capable of faithfully duplicating the patterns of a mold even when the mold has a complicated structure and fine projection and depression parts; capable of obtaining a molded product having a uniform thickness and no pinholes; and having a good storage stability over a long term, and a process for producing the resin are provided, which resin is obtained by coating a powdery vinyl chloride resin composition containing plasticizer with a high polymer film component on the surface of the composition.

Abstract: A process which produces a vinyl chloride resin composition for powder molding by mixing a vinyl chloride resin, a plasticizer and at least one vinyl chloride resin modifying additive in a mixer is provided, which process includes the following steps (A), (B), and (C): (A) feeding a powdery vinyl chloride resin, a plasticizer and at least one vinyl chloride resin modifying additive to a high-speed agitating mixer provided with agitating elements, a jacket, a gas-inlet port and a gas-outlet port and mixing these materials with stirring while heating them to 120.degree. C. to 130.degree. C.; (B) cooling the resulting materials in a mixer down to 70.degree. C. or lower; and (C) further adding thereto a vinyl chloride emulsion polymer and mixing the resulting materials with stirring at 70.degree. C. or lower.

Abstract: A semiconductor element is formed in a semiconductor substrate. An electrode wiring pattern which is connected to the active region and contains aluminum as the main component is formed on the main surface of said semiconductor substrate. A metal bump is formed on the electrode wiring pattern. The metal bump contains zinc of 1 to 10% in mass percentage in addition to at least one element selected from a group consisting of tin, lead and aluminum a second metal bump is formed having a lower melting point than that of first bump. The second bump contains lead, tin and at least one of silver and copper.

Abstract: In a propeller blade tip path plane-inclining device for a toy helicopter, a propeller is disposed asymmetrically with respect to a rotation shaft, and the position of the propeller in the plane of rotation of the propeller is detected, and the speed of rotation of the propeller is increased and decreased at predetermined regions so as to change the flexing of the propeller caused by a difference in the rotational speed, so that the propeller blade tip path plane is inclined, thereby determining the direction of the force of propulsion of a fuselage.

Abstract: A process for producing a molded article is provided includinga) The surface of a mold is cooled with a releasing agent for powder molding which has, as an essential component, a copolymer AB derived from at least one monomer A represented by the following general formula (I) ##STR1## wherein X is a hydrogen atom or a methyl group, k is an integer of 0-5, l is an integer of 1-3, m is an integer of 1-3, n is an integer of 0-550 and Y is a methyl group or a fluorine atom-containing substituent having 1-20 carbon atoms,and at least one vinyl-polymerizable monomer B containing at least one alkyl acrylate or alkylmethacrylate wherein the alkyl group has 1 to 8 carbon atoms.b) The coated mold is heated.c) A powder of a non-rigid vinyl chloride resin containing a plasticizer is allowed to adhere to the heated mold to melt the powder.d) The mold, releasing agent and powder are cooled to form a molded article.e) The molded article is peeled from the mold.

Abstract: A soft metal plate having substantially equal hardness as emitter electrodes formed of soft metal is disposed between the emitter electrodes and a heat buffer metal plate formed of hard metal, and pressure applied to the emitter electrodes is shared by the soft metal plate, so as to reduce the thermal fatigue of the emitter electrodes.