Patents by Inventor Masaru Heishi

Masaru Heishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110189432
    Abstract: Provided is an epoxy resin composition capable of reducing the surface roughness of the surface of a roughening-treated cured body. The epoxy resin composition includes an epoxy resin, a curing agent, and a silica component obtained by performing a surface treatment on silica particles using a silane coupling agent; and the epoxy resin composition does not include a curing accelerator, or includes a curing accelerator at a content equal to or less than 3.5 parts by weight to a total of 100 parts by weight of the epoxy resin and the curing agent. Mean particle diameter of the silica particles is equal to or less than 1 ?m. An amount B (g) of the silane coupling agent used for surface treatment, per 1 g of the silica particles in the silica component, is within a range between 10% to 80% with regard to a value C (g) per 1 g of the silica particles, which is calculated by the following formula (X).
    Type: Application
    Filed: July 29, 2009
    Publication date: August 4, 2011
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Nobuhiro Goto, Masaru Heishi, Hidenobu Deguchi, Takayuki Kobayashi, Junnosuke Murakami
  • Publication number: 20090104429
    Abstract: Provided is a resin composition, a prepreg, a cured body, a sheet-like formed body, a laminate, and a multilayered laminate using the resin composition, the resin composition including an epoxy resin and an inorganic filler. For example, when a second layer is formed onto the surface of a cured body, the cured body has improved adhesive property or adhesive property between the cured body and the second layer. A resin composition comprising an epoxy resin, a curing agent for the epoxy resin, a silica treated with an imidazole silane and having a mean particle diameter not more than 5 micrometers, the resin composition including the silica at a proportion of 0.1 to 80 parts by weight to a mixture consisting of the epoxy resin and the curing agent for the epoxy resin 100 parts by weight.
    Type: Application
    Filed: September 14, 2006
    Publication date: April 23, 2009
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Nobuhiro Goto, Hiroshi Kouyanagi, Takayuki Kobayashi, Masaru Heishi