Abstract: The method according to the present invention includes the steps of: sequentially applying a plurality of different voltages to an MR element and sequentially detecting output signals from the MR element; and eliminating the MR element as a defective product when an evaluation value, based on a difference of SN ratios of the output signals from the MR element respectively obtained for each applied voltage, is less than a threshold value, and selecting the MR element as a non-defective product when the evaluation value is greater than or equal to the threshold value.

Abstract: The method according to the present invention includes the steps of: sequentially applying a plurality of different voltages to an MR element and sequentially detecting output signals from the MR element; and eliminating the MR element as a defective product when an evaluation value, based on a difference of SN ratios of the output signals from the MR element respectively obtained for each applied voltage, is less than a threshold value, and selecting the MR element as a non-defective product when the evaluation value is greater than or equal to the threshold value.

Abstract: A noise-testing method for a thin-film magnetic head with an MR read head element and a heating unit capable of applying a heat and a stress to the MR read head element, includes a step of applying alternately and discontinuously with each other an electrical power having a first level and an electrical power having a second level higher than the first level to the heating unit, and a step of evaluating the thin-film magnetic head by measuring a noise output or noise outputs obtained from the MR read head element when the electrical power or the electrical powers are applied to the heating unit.

Abstract: Provided is a smear-removing method that can remove smear of a manufactured thin-film magnetic head. The method is performed to a thin-film magnetic head including an MR effect element for reading data having two electrode layers sandwiching an MR effect multilayer as a magneto-sensitive portion therebetween. The method comprises the step of applying a stress voltage less than a breaking voltage of the MR effect element between the two electrode layers to burn off smear. In the method, it is preferable that the stress voltage is applied while an electric resistance or an output voltage of the MR effect element is measured, and the stress voltage is increased until the value of the electric resistance or the output voltage reaches an upper limit specified value specified from a value of an electric resistance or an output voltage in a normal case where smear is not present.

Abstract: A noise-testing method for a thin-film magnetic head with an MR read head element and a heating unit capable of applying a heat and a stress to the MR read head element, includes a step of applying alternately and discontinuously with each other an electrical power having a first level and an electrical power having a second level higher than the first level to the heating unit, and a step of evaluating the thin-film magnetic head by measuring a noise output or noise outputs obtained from the MR read head element when the electrical power or the electrical powers are applied to the heating unit.

Abstract: Provided is a smear-removing method that can remove smear of a manufactured thin-film magnetic head. The method is performed to a thin-film magnetic head including an MR effect element for reading data having two electrode layers sandwiching an MR effect multilayer as a magneto-sensitive portion therebetween. The method comprises the step of applying a stress voltage less than a breaking voltage of the MR effect element between the two electrode layers to burn off smear. In the method, it is preferable that the stress voltage is applied while an electric resistance or an output voltage of the MR effect element is measured, and the stress voltage is increased until the value of the electric resistance or the output voltage reaches an upper limit specified value specified from a value of an electric resistance or an output voltage in a normal case where smear is not present.

Abstract: A head support mechanism includes a suspension for supporting a magnetic head slider with a thin-film magnetic head, having a slider mounting section on which the magnetic head slider is fixed, and a heating unit formed on the slider mounting section of the suspension. The heating unit is capable of producing heat.

Abstract: A head support mechanism includes a suspension for supporting a magnetic head slider with a thin-film magnetic head, having a slider mounting section on which the magnetic head slider is fixed, and a heating unit formed on the slider mounting section of the suspension. The heating unit is capable of producing heat.

Abstract: The present invention provides a thin film magnetic head realizing the gradient and the strength of a perpendicular magnetic field increased as much as possible. A main magnetic pole layer is made recede from a write shield layer. As compared with the case where the magnetic pole layer is not receded from the write shield layer, an overlap range in which the main magnetic pole layer and the write shield layer are overlapped one another is smaller. Accordingly, the amount of magnetic flux emitted from the main magnetic pole layer toward a recording medium relatively increases, and the amount of magnetic flux leaked from the main magnetic pole layer to the write shield layer relatively decreases.

Abstract: An HGA includes a magnetic head slider provided with at least one thin-film magnetic head element, and a conductive suspension to which the magnetic head slider is fixed. A conductive resistance between the magnetic head slider and the suspension is equal to or higher than 1 M?.

Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.

Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low roughness and produce a high peel strength to such resin base materials as polyimide resin which is weak in peel strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one rust-proofing treatment.

Abstract: Disclosed is a copper foil—for printed circuit boards—which is especially excellent in soft etching property and also superior in such properties as heat discoloration resistance, rust-proofing and solder-ability. The copper foil for printed circuit boards comprising a first layer formed by applying 12 to 50 mg/m2 of a sulfur-contained zinc alloy containing 0.1 to 2.5 percent by weight of sulfur on the surface on at least one side of the copper foil and a second layer formed of a chromate layer on the first layer by applying 0.5 to 2.5 mg/m2 of chromium and, if necessary, 1.5 to 6 mg/m2 of phosphorus.

Abstract: Disclosed is a process of treating the surface of copper foil without using harmful elements such as arsenic, selenium and tellurium unlike in the prior art. It is possible to, in an easy way, obtain a uniform rough condition and low rougheness and produce a high adhesive strength to such resin base materials as polymide resin which is weak in adhesive strength. The process comprises a roughening treatment involving a cathodic electrolysis of at least one side of copper foil near or above the limiting current density in an electrolytic bath containing titanium ions and tungsten ions and prepared by adding sulfuric acid and copper sulfate so as to have copper protrusions deposited and then coating the depositions with copper or a copper alloy in a cathodic electrolysis, followed by giving to the surface of the above-mentioned copper or the copper alloy at least one of the following rust-proofing treatments—chromate treatment, organic rust-proofing treatment and silane coupling agent treatment.