Abstract: To provide a position detection system, a position detection method, an angle detection method, and a marker that enable detection of a position, adjustment of a position, detection of an angle, and the like of a movable body with respect to a stationary body to be easily performed.

Abstract: User interface having a sensor and a composite interface that floats. Embodiments of user interfaces described herein are useful, for example, as automobile components (e.g., dashboard components), appliance components (e.g., dishwasher components, stove components, oven components, microwave oven components, clothes washer components, and clothes dyer components), medical equipment, elevator buttons, laboratory equipment (e.g., scales), as well as consumer electronics (e.g., entertainment devices and cell phones), automatic teller machines, and the like.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: There are provided optical members having a microlens array structure that can be produced by a more simple process, as well as devices employing them. The optical members have on one main surface a microlens array formed using a replication process that employs a mold comprising a plurality of gas bubbles arranged on a replication surface. There are also provided devices that employ the optical members.

Abstract: User interface having a sensor and a composite interface that floats. Embodiments of user interfaces described herein are useful, for example, as automobile components (e.g., dashboard components), appliance components (e.g., dishwasher components, stove components, oven components, microwave oven components, clothes washer components, and clothes dyer components), medical equipment, elevator buttons, laboratory equipment (e.g., scales), as well as consumer electronics (e.g., entertainment devices and cell phones), automatic teller machines, and the like.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: A donor sheet for transferring an image pattern to an image receiving element by a thermal imaging process using laser beam, comprising a base having formed in order on the base a light-to-heat conversion layer, and a transfer layer containing an image component which is melted by heating due to an action of the light-to-heat conversion layer and transferred to the image receiving element in a patterned form, in which the image component of the transfer layer contains an ink-repellent or solvent-repellent compound in an optimized amount. Using the donor sheet, it becomes possible to produce an separation member such as partition pattern and black matrix of a color filter by a shortened manufacturing step with ease and accuracy at high contrast, and can impart excellent ink repellency to the separation member.

Abstract: A donor sheet for transferring an image pattern to an image receiving element by a thermal imaging process using laser beam, comprising a base having formed in order on the base a light-to-heat conversion layer, and a transfer layer containing an image component which is melted by heating due to an action of the light-to-heat conversion layer and transferred to the image receiving element in a patterned form, in which the image component of the transfer layer contains an ink-repellent or solvent-repellent compound in an optimized amount. Using the donor sheet, it becomes possible to produce an separation member such as partition pattern and black matrix of a color filter by a shortened manufacturing step with ease and accuracy at high contrast, and can impart excellent ink repellency to the separation member.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body comprising a substrate to be ground and a support, where the substrate is ground to a very small thickness and can then be separated from the support without damaging the substrate. One embodiment of the present invention is a laminated body comprising a substrate to be ground, a joining layer in contact with the substrate to be ground, a photothermal conversion layer comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the laminated body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.

Abstract: Provided is a laminated body (1) comprising a substrate (2) to be ground and a support (5), where the substrate (2) is ground to a very small thickness and can then be separated from the support (5) without damaging the substrate (2). One embodiment of the present invention is a laminated body (1) comprising a substrate (2) to be ground, a joining layer (3) in contact with the substrate (2) to be ground, a photothermal conversion layer (4) comprising a light absorbing agent and a heat decomposable resin, and a light transmitting support (5). After grinding the substrate surface which is opposite that in contact with the joining layer (3), the laminated body (1) is irradiated through the light transmitting support (5) and the photothermal conversion layer (4) decomposes to separate the substrate (2) and the light transmitting support (5).

Abstract: Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semiconductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting su

Abstract: A donor sheet for transferring an image pattern to an image receiving element by a thermal imaging process using laser beam, comprising a base having formed in order on the base a light-to-heat conversion layer, and a transfer layer containing an image component which is melted by heating due to an action of the light-to-heat conversion layer and transferred to the image receiving element in a patterned form, in which the image component of the transfer layer contains an ink-repellent or solvent-repellent compound in an optimized amount. Using the donor sheet, it becomes possible to produce an separation member such as partition pattern and black matrix of a color filter by a shortened manufacturing step with ease and accuracy at high contrast, and can impart excellent ink repellency to the separation member.

Abstract: A donor sheet for transferring an image pattern to an image receiving element by a thermal imaging process using laser beam, comprising a base having formed in order on the base a light-to-heat conversion layer, and a transfer layer containing an image component which is melted by heating due to an action of the light-to-heat conversion layer and transferred to the image receiving element in a patterned form, in which the image component of the transfer layer contains an ink-repellent or solvent-repellent compound in an optimized amount. Using the donor sheet, it becomes possible to produce an separation member such as partition pattern and black matrix of a color filter by a shortened manufacturing step with ease and accuracy at high contrast, and can impart excellent ink repellency to the separation member.

Abstract: A donor sheet for transferring an image pattern to an image receiving element by a thermal imaging process using laser beam, comprising a base having formed in order on the base a light-to-heat conversion layer, and a transfer layer containing an image component which is melted by heating due to an action of the light-to-heat conversion layer and transferred to the image receiving element in a patterned form, in which the image component of the transfer layer contains an ink-repellent or solvent-repellent compound in an optimized amount. Using the donor sheet, it becomes possible to produce an separation member such as partition pattern and black matrix of a color filter by a shortened manufacturing step with ease and accuracy at high contrast, and can impart excellent ink repellency to the separation member.

Abstract: Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support through a photocurable adhesive by placing the circuit face and the photothermal conversion layer to face each other, thereby forming a laminated body having a non-circuit face on the outside; grinding the non-circuit face of the semiconductor wafer until the semi-conductor wafer reaches a desired thickness; dicing the ground semiconductor wafer from the non-circuit face side to cut it into a plurality of semiconductor chips; irradiating radiation energy from the light-transmitting support side to decompose the photothermal conversion layer, thereby causing separation into a semiconductor chips having the adhesive layer and a light-transmitting s