Patents by Inventor Masaru KITADA

Masaru KITADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11673162
    Abstract: The present invention provides a composite molded body in which a rubber layer in the form of a thin film is formed on a surface of a resin molded body and a production method therefor. According to an embodiment of the present invention, a liquid composition containing a rubber component such as a rubber latex and a peroxide is applied to a surface of a resin molded body such as a polyamide-based resin having an amino group, causing crosslinking to occur in an uncrosslinked rubber layer and forming a crosslinked rubber layer in the form of a thin film. When a co-crosslinking agent is used in combination, adhesion to the resin molded body can be improved even when the thickness of the crosslinked rubber layer is small.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: June 13, 2023
    Assignees: DAICEL-EVONIK LTD., NAKANO MANUFACTURING CO., LTD.
    Inventors: Mitsuteru Mutsuda, Masaru Kitada
  • Publication number: 20210308719
    Abstract: The present invention provides a composite molded body in which a rubber layer in the form of a thin film is formed on a surface of a resin molded body and a production method therefor. According to an embodiment of the present invention, a liquid composition containing a rubber component such as a rubber latex and a peroxide is applied to a surface of a resin molded body such as a polyamide-based resin having an amino group, causing crosslinking to occur in an uncrosslinked rubber layer and forming a crosslinked rubber layer in the form of a thin film. When a co-crosslinking agent is used in combination, adhesion to the resin molded body can be improved even when the thickness of the crosslinked rubber layer is small.
    Type: Application
    Filed: August 8, 2019
    Publication date: October 7, 2021
    Applicants: DAICEL-EVONIK LTD., NAKANO MANUFACTURING CO., LTD.
    Inventors: Mitsuteru MUTSUDA, Masaru KITADA