Abstract: Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)3Si—(SiR2—O—)n—SiR3 (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

Abstract: Provided is a filler that has a low viscosity when mixed in a resin material and has reduced permittivity and dielectric loss tangent. The filler includes: a metal oxide particle material; and a polyorganosiloxane compound with which a surface treatment is performed on the metal oxide particle material and which is represented by general formula (1): (RO)3Si—(SiR2—O—)n—SiR3 (in general formula (1), each R is independently selected from among alkyl groups having 1 to 4 carbon atoms, and n is not less than 10 and not greater than 200). A resin composition obtained by containing the filler in a resin is suitable for an electronic material.

Abstract: A particulate material is mainly composed of alumina, has a volume average particle diameter of from 70 to 200 ?m, has a degree of sphericity of from 0.89 or more to less than 0.99, has a degree of alfa-aluminization of from 40 to 85%, and produces a result of 0.017 g or less in an abrasion test for equipment.

Abstract: A silicone-coated filler comprises: a particulate material mainly composed of an inorganic oxide formed by oxidizing a predetermined element; a first silicone structure bonded to a surface of the particulate material by way of a “-‘the predetermined element’-OSi—” structure; and a second silicone structure including a cross-linking structure with a carbon-carbon structure directly bonded to a silicon atom of the first silicone structure, and a polysiloxane structure bonded to the cross-linking structure.

Abstract: A particulate material is mainly composed of alumina, has a volume average particle diameter of from 70 to 200 ?m, has a degree of sphericity of from 0.89 or more to less than 0.99, has a degree of alfa-aluminization of from 40 to 85%, and produces a result of 0.017 g or less in an abrasion test for equipment.

Abstract: A filler for resinous composition is contained and used in resinous composition constituting electronic packaging material for electronic device, and includes: a filler ingredient including a crystalline siliceous material with a crystal structure made of at least one member selected from the group consisting of type FAU, type FER, type LTA, type MFI and type CHA, and/or type MWW, wherein: the filler ingredient is free of any activity when evaluated by an “NH3-TPD” method; and includes the crystalline siliceous material in an amount falling in a range allowing the filler ingredient to exhibit a negative thermal expansion coefficient. The filler ingredient may further be free of a surface in which silver, copper, zinc, mercury, tin, lead, bismuth, cadmium, chromium, cobalt and nickel are exposed.

Abstract: A particulate material is mainly composed of alumina, has a volume average particle diameter of from 70 to 200 ?m, has a degree of sphericity of from 0.89 or more to less than 0.99, has a degree of alfa-aluminization of from 40 to 85%, and produces a result of 0.017 g or less in an abrasion test for equipment.

Abstract: A silicone-coated filler comprises: a particulate material mainly composed of an inorganic oxide formed by oxidizing a predetermined element; a first silicone structure bonded to a surface of the particulate material by way of a “-‘the predetermined element’-OSi—” structure; and a second silicone structure including a cross-linking structure with a carbon-carbon structure directly bonded to a silicon atom of the first silicone structure, and a polysiloxane structure bonded to the cross-linking structure.