Abstract: Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.

Abstract: A substrate is mounted on a first conveying carrier including a flat surface, transferred onto a printing table of a flux printer, transferred from the flux printer onto a second conveying carrier, transferred from the second conveying carrier onto a printing table of a solder ball printer, and transferred from the solder ball printer onto a third conveying carrier using a first carry-in mechanism, a first carry-out mechanism, a second carry-in mechanism, and a second carry-out mechanism including a plurality of vacuum attraction pads. Images of alignment marks provided at four corners of the substrate on the printing tables and four corners of a mask are simultaneously picked up by separate camera units on a front side and a rear side in a conveying direction to calculate a positional deviation amount.

Abstract: A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.

Abstract: Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.

Abstract: A substrate laminating apparatus which sticks substrates together in vacuum with high accuracy. The apparatus includes a first chamber into which two substrates are carried; a second chamber in which substrates are stuck together; and a third chamber which delivers a substrate laminate. The pressure level in the first chamber and the third chamber is varied from atmospheric to medium vacuum under control and that in the second chamber is varied from medium vacuum to high vacuum under control. In the second chamber, electrostatic adsorption means which can move up and down picks up an upper substrate and holds it on an upper table.

Abstract: A printing plate includes, on the printing surface of a raised part, grooves passing through from one side to another thereof. Preferably, the grooves are parallel to each other and equally spaced apart. More preferably the raised part is in the shape of a nearly-rectangular frame, and the grooves are provided such that one side of the near-rectangle and the longitudinal direction of the grooves form an angle of 45°.

Abstract: A printing plate (1) includes, on the printing surface of a raised part (2), grooves (3) passing through from one side to another thereof. Preferably, the grooves (3) are parallel to each other and equally spaced apart. More preferably the raised part (2) is in the shape of a nearly-rectangular frame, and the grooves (3) are provided such that one side of the near-rectangle and the longitudinal direction of the grooves (3) form an angle of 45°.