Abstract: A method for producing a light detection device includes preparing a back-illuminated light receiving element that includes a plurality of light receiving sections and a trench which is open to a first main surface so as to isolate the adjacent light receiving sections from each other; disposing the light receiving element on a wiring substrate such that the first main surface of the light receiving element faces the wiring substrate; forming a resin mold, which reaches at least a position that is further away from the wiring substrate than an end portion on a second main surface side of the trench in a thickness direction of the wiring substrate, on the wiring substrate so as to surround an entire side surface of the light receiving element; polishing the light receiving element and the resin mold from the second main surface side of the light receiving element.

Abstract: A method for producing a light detection device includes preparing a back-illuminated light receiving element that includes a plurality of light receiving sections and a trench which is open to a first main surface so as to isolate the adjacent light receiving sections from each other; disposing the light receiving element on a wiring substrate such that the first main surface of the light receiving element faces the wiring substrate; forming a resin mold, which reaches at least a position that is further away from the wiring substrate than an end portion on a second main surface side of the trench in a thickness direction of the wiring substrate, on the wiring substrate so as to surround an entire side surface of the light receiving element; polishing the light receiving element and the resin mold from the second main surface side of the light receiving element.

Abstract: A method for producing a light detection device includes preparing a back-illuminated light receiving element that includes a plurality of light receiving sections and a trench which is open to a first main surface so as to isolate the adjacent light receiving sections from each other; disposing the light receiving element on a wiring substrate such that the first main surface of the light receiving element faces the wiring substrate; forming a resin mold, which reaches at least a position that is further away from the wiring substrate than an end portion on a second main surface side of the trench in a thickness direction of the wiring substrate, on the wiring substrate so as to surround an entire side surface of the light receiving element; polishing the light receiving element and the resin mold from the second main surface side of the light receiving element.

Abstract: A UV-bandpass filter for transmitting therethrough light having a wavelength included in a UV-region. The bandpass filter is an optical filter including a thin silver film; wherein the thin silver film includes an entrance face and an exit face opposing the entrance face, for emitting light having a wavelength included in a specific UV-region whose wavelength ranges from 250 nm to 400 nm in the light having reached the entrance face, and has such a thickness as to yield a transmittance of 10% or less with respect to light having a wavelength excluding the specific UV-region.

Abstract: An electronic component is provided with a base member 1 having a through hole 41 (43) extending from a bottom surface of a recess 15 to a back surface 11back, an electronic element 4 mounted in the recess 15, a lid member 2 closing an aperture of the recess 15, and an adhesive 3 (42) interposed between the lid member 2 and an opening end face of the recess 15, and obstructing the through hole 41 (43) to keep an interior space of the recess in a hermetically-sealed state; the adhesive 3 (42) obstructs a space between the lid member 2 and the base member 1, and the adhesive 3 (42) finally also obstructs the through hole 41 (43) extending from the bottom surface of the recess 15 to the back surface 11back so as to allow air, which could inhibit the obstruction, to escape during production.

Abstract: Cut faces 15a to 15h are formed on the front end faces 13a to 13h of the exposed portions 12a to 12h of respective lead terminals 11a to 11h of a semiconductor device 100, and plating for increasing the solderability is provided on the cut faces 15a to 15h.

Abstract: The present invention relates to a UV-bandpass filter for transmitting therethrough light having a wavelength included in a UV-region, and the like. The bandpass filter is an optical filter including a thin silver film; whereas the thin silver film comprises an entrance face and an exit face opposing the entrance face, for emitting light having a wavelength included in a specific UV-region whose wavelength ranges from 250 nm to 400 nm in the light having reached the entrance face, and has such a thickness as to yield a transmittance of 10% or less with respect to light having a wavelength excluding the specific UV-region.

Abstract: Cut faces 15a to 15h are formed on the front end faces 13a to 13h of the exposed portions 12a to 12h of respective lead terminals 11a to 11h of a semiconductor device 100, and plating for increasing the solderability is provided on the cut faces 15a to 15h.