Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Abstract: In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.

Abstract: In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.

Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

Abstract: In laser annealing using a solid state laser, a focus position of a minor axial direction of a rectangular beam is easily corrected depending on positional variation of a laser irradiated portion of a semiconductor film. By using a minor-axis condenser lens 29 condensing incident light in a minor axial direction and a projection lens 30 projecting light, which comes from the minor-axis condenser lens 29, onto a surface of a semiconductor film 3, laser beam 1 is condensed on the surface of the semiconductor film 3 in the minor axial direction of a rectangular beam. The positional variation of a vertical direction of the semiconductor film 3 in a laser irradiated portion of the semiconductor film 3 is detected by a positional variation detector 31, and the minor-axis condenser lens 29 is moved in an optical axis direction based on a value of the detection.

Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.

Abstract: Provided is a laser annealing apparatus capable of reducing irradiation unevenness of laser light caused by a refraction phenomenon of laser light due to fluctuation in the temperature of inert gas. A laser annealing apparatus 1 includes a gas supply unit 10 for supplying inert gas G to at least a laser irradiation area of a workpiece 7 to be processed, and a gas temperature controller 15 for regulating the temperature of the inert gas G. The gas temperature controller 15 controls the temperature of the inert gas G supplied to the laser irradiation area so as to decrease the temperature difference between the temperature of the inert gas G and the atmospheric temperature of a space (a room R) that is disposed outside the supply area of the inert gas so as to surround the optical path of the laser light.

Abstract: Disclosed are a laser annealing method and apparatus capable of forming a crystalline semiconductor thin film on the entire surface of a substrate without sacrificing the uniformity of crystallinity in a seam portion in a long-axis direction of laser light, the crystalline semiconductor thin film having good properties and high uniformity to an extent that the seam portion is not visually recognizable. During the irradiation of a linear beam, portions corresponding to the edges of the linear beam are shielded by a mask 10 which is disposed on the optical path of a laser light 2, and the mask 10 is operated so that the amount of shielding is periodically increased and decreased.

Abstract: In laser annealing using a solid state laser, a focus position of a minor axial direction of a rectangular beam is easily corrected depending on positional variation of a laser irradiated portion of a semiconductor film. By using a minor-axis condenser lens 29 condensing incident light in a minor axial direction and a projection lens 30 projecting light, which comes from the minor-axis condenser lens 29, onto a surface of a semiconductor film 3, laser beam 1 is condensed on the surface of the semiconductor film 3 in the minor axial direction of a rectangular beam. The positional variation of a vertical direction of the semiconductor film 3 in a laser irradiated portion of the semiconductor film 3 is detected by a positional variation detector 31, and the minor-axis condenser lens 29 is moved in an optical axis direction based on a value of the detection.

Abstract: An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.

Abstract: In the case of a lens array type homogenizer optical system, the incident angle and intensity of a laser beam 1 entering a large-sized lens (long-axis condenser lens 22) of a long-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while long-axis lens arrays 20a and 20b are reciprocated in a direction corresponding to a long axial direction of a linear beam (X-direction). Therefore, vertical stripes are significantly reduced. Further, the incident angle and intensity of a laser beam 1 entering a large-sized lens (projection lens 30) of a short-axis condensing optical system, which is provided on the rear side, are changed for every shot by performing laser irradiation while short-axis lens arrays 26a and 26b are reciprocated in a direction corresponding to a short axial direction of a linear beam (Y-direction). Therefore, horizontal stripes are significantly reduced.

Abstract: The present invention is directed to a vehicle body structure in which a collision load applied to one of vehicle doors from a lateral side thereof is received by a load receiving member of a body via an impact beam and a door box of the door and is transmitted from the load receiving member to a cross member. The load receiving member includes a load receiving pipe that is formed as a linear tubular body disposed between the right and left doors so as to extend in a vehicle widthwise direction and is capable of transmitting the collision load from the door box of one of the doors to a door box of the other of the doors, and connecting portions that are capable of supporting the load receiving pipe at positions adjacent to the right and left doors and connecting the load receiving pipe to the cross member.

Abstract: A heat shield plate for a substrate annealing apparatus is provided with a horizontally supported flat-plate-like substrate 1, a heater 5 positioned above the substrate to heat the upper surface of the substrate with radiation heat, and a heat shield plate 10 horizontally movable between a shielding position where the substrate is shielded from heater and an open position out of the shielding position. The heat shield plate 10 is composed of a structural member 12 made of a low thermal expansion material (carbon composite material) which is hardly deformed due to a temperature difference in the shielding position, and a heat insulating member 14 which covers the upper surface of the structural member and keeps the surface at an allowable temperature or below.

Abstract: A cover component mountable to an airbag system has a tear line that is torn open when an airbag of the airbag system inflates. At least part of the tear line includes a recessed line and hollows bored in the recessed line at intervals. The recessed line is molded into the cover component using a raised line provided on a core surface of a die, and where the hollows are bored into the cover component by laser processing.

Abstract: A technique and apparatus for effectively constructing a cover for covering a vehicle airbag is provided. An ultrasonic machine is used that includes an ultrasonic machining blade for machining a tear line in the cover rear surface of the airbag cover. First and second transmitting displacement sensors are disposed on the opposite side of the cover rear surface of the airbag cover so as to be opposed to a cutting edge of the ultrasonic machining blade with the airbag cover interposed therebetween. The sensors directly sense the distance between the cutting edge of the machining blade and each of the first and second displacement sensors and through the airbag cover. A control section controls the relative position of the cutting edge with respect to the airbag cover, based on the sensed results by the first and second displacement sensors.

Abstract: A technique and apparatus for effectively constructing a cover for covering a vehicle airbag is provided. An ultrasonic machine is used that includes an ultrasonic machining blade for machining a tear line in the cover rear surface of the airbag cover. First and second transmitting displacement sensors are disposed on the opposite side of the cover rear surface of the airbag cover so as to be opposed to a cutting edge of the ultrasonic machining blade with the airbag cover interposed therebetween. The sensors directly sense the distance between the cutting edge of the machining blade and each of the first and second displacement sensors and through the airbag cover. A control section controls the relative position of the cutting edge with respect to the airbag cover, based on the sensed results by the first and second displacement sensors.

Abstract: An airbag cover is provided with a tear line, an open-out door panel which is openable when the tear line is torn, a thinned portion formed in the boundary area between the main body of the airbag cover and the open-out door panel on the back surface of the cover, and a second rib extending in the direction intersecting the extending surface of the open-out door panel between the main body of the airbag cover and the open-out door panel. The airbag cover is configured such that the extending length of the portion on which the second rib is provided is larger than the wall thickness of the respective portions on the side of the open-out door panel with respect to the second rib.

Abstract: A cover component mountable to an airbag system has a tear line that is torn open when an airbag of the airbag system inflates. At least part of the tear line includes a recessed line and hollows bored in the recessed line at intervals. The recessed line is molded into the cover component using a raised line provided on a core surface of a die, and where the hollows are bored into the cover component by laser processing.