Abstract: An electronic musical instrument includes an operation unit that receives a user performance; and at least one processor. wherein the at least one processor performs the following: in accordance with a user operation specifying a chord on the operation unit, obtaining lyric data of a lyric and obtaining a plurality of pieces of waveform data respectively corresponding to a plurality of pitches indicated by the specified chord; inputting the obtained lyric data to a trained model that has been trained and learned singing voices of a singer so as to cause the trained model to output acoustic feature data in response thereto; synthesizing each of the plurality of pieces of waveform data with the acoustic feature data so as to generate a plurality of pieces of synthesized waveform data; and outputting a polyphonic synthesized singing voice based on the generated plurality of pieces of synthesized waveform data.

Abstract: A processing method of a wafer includes a modified layer forming step of positioning the focal point of a laser beam with a wavelength having transmissibility with respect to the wafer to the inside of a planned dividing line and executing irradiation along the planned dividing line to form modified layers inside and a water-soluble resin coating step of coating the front surface of the wafer with a water-soluble resin before or after the modified layer forming step. The processing method also includes a dividing step of expanding a dicing tape to divide the wafer into individual device chips together with the water-soluble resin with which the front surface of the wafer is coated and a modified layer removal step of executing plasma etching and removing the modified layers that remain at the side surfaces of the device chips in a state in which the dicing tape is expanded and the front surfaces of the individual device chips are coated with the water-soluble resin.

Abstract: A holding table manufacturing method includes forming a plurality of first grooves in a front surface of a plate-shaped body, forming a plurality of second grooves in a back surface of the plate-shaped body, laying, on one another, a plurality of the plate-shaped bodies formed respectively with a plurality of the first grooves and a plurality of the second grooves and uniting the plate-shaped bodies together to form a suction plate, and accommodating the suction plate in an accommodating recess of a frame body to form a holding table. The first grooves and the second grooves do not reach side surfaces of the plate-shaped body, the first grooves and the second grooves communicate with each other, and the thickness of the suction plate is larger than the depth of the accommodating recess.

Abstract: An apparatus for insertion into a body through a working channel of an endoscope includes a catheter including a dilator, a guide tube disposed in a lumen of the catheter, and a handle including a puncturing actuator operatively coupled to the proximal end of the guide tube. The dilator may be a cautery device and/or a balloon. The apparatus may also include a stylet needle that includes a cutting distal end for puncturing tissue and extends through a lumen in the guide tube. The handle may further include a stopper detachably coupled to the puncturing actuator to fix a position of the puncturing actuator on the handle, and moveable on the handle independently of the puncturing actuator when detached from the puncturing actuator. The disclosed embodiments also include a method for forming a passageway in a wall of a hollow body organ using the apparatus.

Abstract: A method of processing a wafer having a plurality of devices formed in respective areas on a face side of the wafer, the areas being demarcated by a plurality of intersecting projected dicing lines, includes a resin applying step of coating the face side of the wafer with a liquid resin to cover an area of the wafer where the plurality of devices are present, a resin curing step of curing the liquid resin into a protective film, a protective tape laying step of laying a protective tape on an upper surface of the protective film, and a planarizing step of planarizing a face side of the protective tape.

Abstract: A method of processing a wafer having a plurality of devices formed in respective areas on a face side of the wafer, the areas being demarcated by a plurality of intersecting projected dicing lines, includes a low-viscosity resin applying step of coating the face side of the wafer with a first liquid resin of low viscosity to cover an area of the wafer where the plurality of devices are present, a high-viscosity resin applying step of, after the low-viscosity resin applying step, coating the face side of the wafer with a second liquid resin of higher viscosity than the first liquid resin in overlapping relation to the first liquid resin, a resin curing step of curing the first liquid resin and the second liquid resin that have coated the face side of the wafer into a protective film, and a planarizing step of planarizing the protective film.

Abstract: A method of processing a wafer having a plurality of devices formed in respective areas on a face side of the wafer, the areas being demarcated by a plurality of intersecting projected dicing lines, includes a resin applying step of coating the face side of the wafer with a liquid resin to cover an area of the wafer where the plurality of devices are present, a resin curing step of curing the liquid resin into a protective film, and a planarizing step of planarizing the protective film.

Abstract: An electronic musical instrument includes at least one processor that, in accordance with a user operation on an operation unit, obtains lyric data and waveform data corresponding to a first tone color; inputs the obtained lyric data to a trained model so as to cause the trained model to output acoustic feature data in response thereto; generates waveform data corresponding to a singing voice of a singer and corresponding to a second tone color that is different from the first tone color, based on the acoustic feature data outputted from the trained model and the obtained waveform data corresponding to the first tone color; and outputs a singing voice based on the generated waveform data corresponding to the second tone color.

Abstract: A processing method includes a holding step of holding a workpiece by a chuck table including a holding surface that holds the workpiece in an upper surface and a sheet covering step of covering the upper surface of the chuck table in addition to the workpiece by a sheet having transmissibility. The processing method also includes a close contact step of generating a suction force for the holding surface of the chuck table and reducing the pressure on a region covered by the sheet to bring the workpiece into close contact with the upper surface of the chuck table by an atmospheric pressure applied to the sheet and a modified layer forming step of positioning the focal point of a laser beam inside the workpiece through the sheet and irradiating the workpiece with the laser beam to form a modified layer.

Abstract: A liquid ejecting apparatus includes a liquid ejecting head that ejects liquid and an attachment portion to which a liquid container that stores the liquid supplied to the liquid ejecting head is detachably attached. The attachment portion includes a liquid inlet portion that is coupled to a liquid outlet provided in the liquid container, and an urging mechanism that urges the liquid container in a direction opposite to an attaching direction in which the liquid container is attached to the attachment portion. The urging mechanism includes an elastic member that is in close contact with the liquid container attached to the attachment portion and that is provided below the liquid inlet portion in a direction of gravity.

Abstract: A crack detection method includes a crack forming step of applying a laser beam to a plate-shaped workpiece that has a first side and a second side opposite to the first side linearly from the first side with a focal point of the laser beam positioned inside the workpiece, the laser beam being of a wavelength having a transmitting property to the workpiece, to thereby form a modified layer inside the workpiece and further form a crack extending from the modified layer toward the second side, a coating material applying step of applying a coating material to the second side, and a crack detecting step of detecting the crack by searching for a portion where the coating material is linearly repelled.

Abstract: An electrostatic charge image developing toner includes a toner particle, and the toner particle includes: a core particle containing a large-diameter particle having a number average particle diameter of 1 ?m or more; and a shell layer that includes at least two resin layers each containing an amorphous resin and covers a surface of the core particles, and an outermost layer of the at least two resin layers is a resin layer being made of the amorphous resin.

Abstract: A method for producing a resin fine particle includes dissolving or melting an oily mixture containing at least a polyester resin, a base, and a basic dye while applying a shearing force to the oily mixture, and emulsifying the dissolved or molten oily mixture by adding a surfactant and an aqueous medium while applying a shearing force to the dissolved or molten oily mixture to prepare a dispersion liquid of the resin fine particle. The resin fine particle includes the polyester resin and the basic dye, has a volume average particle diameter of 0.05 ?m or more and 1 ?m or less, and has a ratio of a concentration of the basic dye in a center of gravity portion of the resin fine particle to a concentration of the basic dye in a surface layer portion having a depth of 10 nm or less from a surface of the resin fine particle of 0.8 or more.

Abstract: A toner for developing an electrostatic charge image includes toner particles that include a binder resin, a releasing agent, a brilliant pigment, and an aminocarboxylic acid compound.

Abstract: A coating device includes: a coating liquid holding part provided with an upper opening portion and a lower opening portion and holding a coating liquid that is supplied from a coating liquid supply part; and an annular body that is disposed inside the coating liquid holding part, through which a cylindrical body penetrating the upper opening portion and the lower opening portion of the coating liquid holding part penetrates, and in which the coating liquid held by the coating liquid holding part flows in from an upper side and flows out from a lower side with a relative movement to the cylindrical body, the annular body being installed to be relatively displaceable along an installation surface intersecting a direction of the relative movement with respect to the coating liquid holding part.

Abstract: A processing apparatus includes a chuck table that holds a workpiece, a processing unit that processes the workpiece held by the chuck table, and a panel that surrounds components including the chuck table and the processing unit. Power source sockets are disposed on the panel, and electric apparatuses including an inspection device, a personal computer, a fan, and a cleaner are connected to the power source sockets and are used.

Abstract: A method of processing a wafer to divide the wafer into individual device chips, includes a second modified layer forming step of applying a laser beam to the wafer while positioning a focused spot of the laser beam inside the wafer along the projected dicing lines extending in a second direction intersecting with a first direction, thereby forming second modified layers in the wafer along the projected dicing lines extending in the second direction. In the second modified layer forming step, when the focused spot of the laser beam along the projected dicing lines extending in the second direction reaches first modified layers, the focused spot of the laser beam is shifted along the first modified layers to thereby undulate the laser beam in a staggered pattern to prevent the second modified layers from being formed straight in the wafer along the projected dicing lines extending in the second direction.

Abstract: An electronic musical instrument includes: a memory that stores lyric data including lyrics for a plurality of timings, pitch data including pitches for said plurality of timings, and a trained model that has been trained and learned singing voice features of a singer; and at least one processor, wherein at each of said plurality of timings, the at least one processor: if the operation unit is not operated, obtains, from the trained model, a singing voice feature associated with a lyric indicated by the lyric data and a pitch indicated by the pitch data; if the operation unit is operated, obtains, from the trained model, a singing voice feature associated with the lyric indicated by the lyric data and a pitch indicated by the operation of the operation unit; and synthesizes and outputs singing voice data based on the obtained singing voice feature of the singer.

Abstract: A wafer laminating method includes a cooling step of cooling a first wafer, a laminating step of producing a laminated wafer by stacking and laminating a second wafer on a surface of the first wafer when condensation forms on the surface of the cooled first wafer, and a heat treatment step of subjecting the laminated wafer to heat treatment.

Abstract: A non-volatile semiconductor storage device includes: a memory cell array having memory cells arranged therein, the memory cells storing data in a non-volatile manner; and a plurality of transfer transistors transferring a voltage to the memory cells, the voltage to be supplied for data read, write and erase operations with respect to the memory cells. Each of the transfer transistors includes: a gate electrode formed on a semiconductor substrate via a gate insulation film; and diffusion layers formed to sandwich the gate electrode therebetween and functioning as drain/source layers. Upper layer wirings are provided above the diffusion layers and provided with a predetermined voltage to prevent depletion of the diffusion layers at least when the transfer transistors become conductive.