Abstract: In a semiconductor module, first and second connection terminals and a control terminal are electrically connected to a semiconductor chip. The second connection terminal extends in a first direction in a resin molded part and projects from a predetermined surface of the resin molded part. An internal terminal of the first connection terminal extends in the resin molded part along the first direction and overlaps with the second connection terminal with a predetermined space therebetween in a second direction, and is exposed from an opening portion of the resin molded part. An external terminal of the first connection terminal is connected to the internal terminal at the opening portion and projects outside the resin molded part. The first connection terminal includes a tie bar remaining portion extending from the internal terminal in a direction that intersects the first direction and the second direction.

Abstract: A semiconductor module includes a semiconductor chip, a resin molded part, and a connection terminal electrically connected to the semiconductor chip. The connection terminal includes an internal terminal sealed in the resin molded part, an external terminal, and a tie bar remaining portion. The internal terminal is extended in a first direction and exposed from an opening portion of the resin molded part. The external terminal is connected to the internal terminal through the opening portion, and projected outside the resin molded part. The tie bar remaining portion extends from the internal terminal in a second direction intersecting the first direction and projects outside the resin molded part to provide a tie bar projecting portion. The connection terminal has a groove portion covered with the resin molded part, between an exposed portion of the internal terminal and the tie bar projecting portion.