Patents by Inventor Masaru Ohta

Masaru Ohta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230416709
    Abstract: It was found that four nuclease domain mutants have nuclease activity superior to that of a wild-type nuclease domain and are capable of enhancing genome editing efficiency in combination with various nucleic acid binding domains.
    Type: Application
    Filed: November 4, 2021
    Publication date: December 28, 2023
    Applicants: EDITFORCE, INC., Kyushu University, National University Corporation
    Inventors: Yusuke YAGI, Masaru OHTA, Takahiro NAKAMURA
  • Publication number: 20090288855
    Abstract: The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.
    Type: Application
    Filed: July 30, 2009
    Publication date: November 26, 2009
    Applicant: JSR CORPORATION
    Inventors: Kouji NISHIKAWA, Kousuke Mori, Masaru Ohta, Shin-ichiro Iwanaga
  • Publication number: 20070248905
    Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of: sequentially applying positive radiation-sensitive resin compositions 1 and 2 to form a two-layer laminate; subjecting the two-layer resist to single exposure and development to produce fine patterns having an undercut cross section; depositing and/or sputtering an organic or inorganic thin layer with use of the resist pattern as a mask; and lifting off the resist pattern to leave a pattern of the thin layer in desired shape.
    Type: Application
    Filed: June 14, 2007
    Publication date: October 25, 2007
    Applicant: JSR Corporation
    Inventors: Masaru OHTA, Atsushi ITO, Isamu Mochizuki, Katsumi INOMATA, Shin-ichiro IWANAGA
  • Publication number: 20070237890
    Abstract: A negative radiation-sensitive two-layer laminated film for forming bumps includes a lower layer that includes a composition including a polymer (A) with a specific structural unit and an organic solvent (B). A process for forming bumps uses the laminated film. The negative radiation-sensitive two-layer laminated film for forming bumps permits excellent printing of a solder paste, is patternable with good configuration, and is easily peeled from a substrate. The bump-forming process using the laminated film provides the same effects.
    Type: Application
    Filed: February 18, 2005
    Publication date: October 11, 2007
    Applicant: JSR Corporation
    Inventors: Hiroko Sakai, Masaru Ohta, Katsumi Inomata, Shin-ichrio Iwanaga
  • Patent number: 7265044
    Abstract: A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: September 4, 2007
    Assignee: JSR Corporation
    Inventors: Masaru Ohta, Katsumi Inomata, Shinichiro Iwanaga
  • Patent number: 7265266
    Abstract: The present invention provides a method of increasing salt tolerance in a plant by overexpressing a gene encoding a mutant SOS2 protein in at least one cell type in the plant. The present invention also provides for transgenic plants expressing the mutant SOS2 proteins.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: September 4, 2007
    Assignees: Arizona Board of Regents/Behalf of University of Arizona, Consejo Superior de Investigaciones Cientificas
    Inventors: Jian-Kang Zhu, Francisco Javier Quintero-Toscano, Jose Manuel Pardo-Prieto, Quansheng Qiu, Karen Sue Schumaker, Masaru Ohta, Changqing Zhang, Yan Guo
  • Patent number: 7247420
    Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of: sequentially applying positive radiation-sensitive resin compositions 1 and 2 to form a two-layer laminate; subjecting the two-layer resist to single exposure and development to produce fine patterns having an undercut cross section; depositing and/or sputtering an organic or inorganic thin layer with use of the resist pattern as a mask; and lifting off the resist pattern to leave a pattern of the thin layer in desired shape.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: July 24, 2007
    Assignee: JSR Corporation
    Inventors: Masaru Ohta, Atsushi Ito, Isamu Mochizuki, Katsumi Inomata, Shin-ichiro Iwanaga
  • Publication number: 20070031758
    Abstract: The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.
    Type: Application
    Filed: August 2, 2006
    Publication date: February 8, 2007
    Applicant: JSR Corporation
    Inventors: Kouji Nishikawa, Kousuke Mori, Masaru Ohta, Shin-ichiro Iwanaga
  • Publication number: 20060168698
    Abstract: The present invention provides a method of increasing salt tolerance in a plant by overexpressing a gene encoding a mutant SOS2 protein in at least one cell type in the plant. The present invention also provides for transgenic plants expressing the mutant SOS2 proteins.
    Type: Application
    Filed: January 24, 2005
    Publication date: July 27, 2006
    Applicants: Arizona Bd of Regents/Behalf of Univ. of Arizona, CONSEJO SUPERIOR DE INVESTIGACIONES CIENTIFICAS
    Inventors: Jian-Kang Zhu, Francisco Quintero-Toscano, Jose Pardo-Prieto, Quansheng Qiu, Karen Shumaker, Masaru Ohta, Changqing Zhang, Yan Guo
  • Publication number: 20050277245
    Abstract: A process for forming bumps on electrode pads for a wiring board including a substrate and a plurality of electrode pads. The process (a) forms a laminated two-layer film on the wiring board and forms a pattern of apertures at positions corresponding to the electrode pads, the laminated two-layer film including a lower layer containing an alkali-soluble radiation-nonsensitive resin composition and an upper layer containing a negative radiation-sensitive resin composition; (b) fills a low-melting metal in the aperture pattern; (c) reflows the low-melting metal by pressing or heating to form bumps; and (d) peels and removes the laminated two-layer film from the board. The laminated film including two layers with different properties permits high resolution and easy peeling.
    Type: Application
    Filed: August 21, 2003
    Publication date: December 15, 2005
    Inventors: Masaru Ohta, Katsumi Inomata, Shinichiro Iwanaga
  • Patent number: 6849302
    Abstract: There is disclosed a resin-coated metal sheet for a part of electronic machinery and tools, which is a metal sheet coated with a resin on the surface, wherein a resin layer is composed of one or more resin selected from polyester-series, epoxy-series, phenol-series and alkyd-series resins, the resin layer has a 0.1 to 10 ?m thickness, and the resin layer contains 2 to 60 parts by weight of nickel with 0.1 to 100 ?m of an average value in terms of maximum longer diameters, to 100 parts by weight of the resin. The resin-coated aluminum sheet is excellent in anti-fingerprint property and formability, as well as excellent in electric characteristics.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: February 1, 2005
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Masaru Ohta, Osamu Kato
  • Publication number: 20040131963
    Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate.
    Type: Application
    Filed: October 27, 2003
    Publication date: July 8, 2004
    Inventors: Masaru Ohta, Atsushi Ito, Isamu Mochizuki, Katsumi Inomata, Shin-ichiro Iwanaga
  • Publication number: 20040071959
    Abstract: There is disclosed a resin-coated metal sheet for a part of electronic machinery and tools, which is a metal sheet coated with a resin on the surface, wherein a resin layer is composed of one or more resin selected from polyester-series, epoxy-series, phenol-series and alkyd-series resins, the resin layer has a 0.1 to 10 &mgr;m thickness, and the resin layer contains 2 to 60 parts by weight of nickel with 0.1 to 100 &mgr;m of an average value in terms of maximum longer diameters, to 100 parts by weight of the resin. The resin-coated aluminum sheet is excellent in anti-fingerprint property and formability, as well as excellent in electric characteristics.
    Type: Application
    Filed: September 22, 2003
    Publication date: April 15, 2004
    Inventors: Masaru Ohta, Osamu Kato
  • Publication number: 20040038148
    Abstract: The present invention provides a positive type radiation-sensitive resin composition for producing a product formed by plating, which is capable of forming a product formed by plating of a thick film such as a bump or a wiring with high precision and has excellent sensitivity and resolution, and a process for producing a product formed by plating using the composition. The positive type radiation-sensitive resin composition for producing a product formed by plating comprises (A) a polymer having an acid-dissociative functional group which is dissociated by an acid to generate an acid functional group and (B) a component which generates an acid when irradiated with a radiation. This composition is used also for a positive type radiation-sensitive resin film. The product formed by plating is produced by a process including a step wherein electroplating is carried out with the use of a pattern that is formed from the composition or the resin film on the substrate as a mold.
    Type: Application
    Filed: August 21, 2002
    Publication date: February 26, 2004
    Applicant: JSR CORPORATION
    Inventors: Masaru Ohta, Atsushi Ito, Shin-Ichiro Iwanaga
  • Patent number: 6670031
    Abstract: There is disclosed a resin-coated metal sheet for a part of electronic machinery and tools, which is a metal sheet coated with a resin on the surface, wherein a resin layer is composed of one or more resin selected from polyester-series, epoxy-series, phenol-series and alkyd-series resins, the resin layer has a 0.1 to 10 &mgr;m thickness, and the resin layer contains 2 to 60 parts by weight of nickel with 0.1 to 100 &mgr;m of an average value in terms of maximum longer diameters, to 100 parts by weight of the resin. The resin-coated aluminum sheet is excellent in anti-fingerprint property and formability, as well as excellent in electric characteristics.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: December 30, 2003
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Masaru Ohta, Osamu Kato
  • Publication number: 20030233681
    Abstract: The present invention provides methods and compositions for improving cold acclimation of plants. More specifically, the present invention utilizes overexpression of ICE1 in plants and plant cells.
    Type: Application
    Filed: April 30, 2003
    Publication date: December 18, 2003
    Applicant: Arizona Bd of Regents/Behalf of Univ. of Arizona
    Inventors: Jian-Kang Zhu, Viswanathan Chinnusamy, Masaru Ohta, Siddhartha Kanrar, Byeong-ha Lee, Manu Agarwal
  • Patent number: 5942369
    Abstract: A positive photoresist composition including (A) 100 parts by weight of an alkali-soluble novolak resin, and based thereon; (B) 5 to 50 parts by weight of an alkali-soluble acrylic resin containing, as s, 10 to 80% by weight of a unit of a radical-polymerizable compound having an alcoholic hydroxyl group and 3 to 50% by weight of at least one of a unit of a radical-polymerizable compound having a carboxyl group and a unit of a radical-polymerizable compound having a phenolic hydroxyl group; (C) 5 to 100 parts by weight of a quinonediazide group-containing compound; and (D) a solvent, is provided. This composition has a good adhesion to substrates at the time of development and a good plating solution resistance and moreover can be well wetted with plating solutions, can be well developed with alkali developing solutions and can be well stripped from substrates at the resist unexposed areas, and is suited for the formation of thick films suitable as bump forming materials.
    Type: Grant
    Filed: January 27, 1998
    Date of Patent: August 24, 1999
    Assignee: JSR Corporation
    Inventors: Toshiyuki Ota, Kimiyasu Sano, Masaru Ohta, Hozumi Sato
  • Patent number: 5584994
    Abstract: Pure water discharged from a pure water tank 9 by means of a pump 27 is returned again to the tank 9 through a cyclic water channel 37. Midway in the cyclic water channel 37, a magnetic force generator 31 is provided. In the magnetic force generator 31, permanent magnets are arranged in such a manner that they interpose therebetween three water channels each made of a non-magnetic material and each having a long and narrow section and that magnetic poles of the magnets face each other outside the longer side of the section.
    Type: Grant
    Filed: May 25, 1995
    Date of Patent: December 17, 1996
    Inventors: Toshimitsu Hattori, Masaru Ohta
  • Patent number: 5055375
    Abstract: A method of forming an image which comprises subjecting an image-forming material comprised of a substrate and a photosensitive layer containing a dye and/or a pigment and a photopolymerizable compound and disposed on the substrate to an image-exposure, thereby to allow the exposure to cause a difference of adhesion between an exposed portion and non-exposed portion in the photosensitive layer, and transferring the image to an image receptor on the basis of the difference of adhesion; wherein the photosensitive layer of the exposed image-forming material and the image receptor are allowed to face each other and directed into the nip between two rollers consisting of an elastic roller and a metallic roller having a surface temperature of between 50.degree. C. and 150.degree. C.
    Type: Grant
    Filed: January 4, 1991
    Date of Patent: October 8, 1991
    Assignee: Toyo Ink Manufacturing Co., Ltd.
    Inventors: Masaaki Matsuo, Masujiro Sumita, Isao Hosoi, Hirohumi Aoki, Masaru Ohta
  • Patent number: 4835576
    Abstract: In the negative form of lith type film or photographic printing paper, the ground part is light-untransmissible and image part (letter, pattern) is light-transmissible. Apart from them, pinholes and stains also constitute light-transmissible areas. Although the light-transmissible areas of letter and pattern are necessary, the light-transmissible areas of pinhole and stain are unnecessary. Thus, the unnecessary light-transmissible areas must be distinguished from the necessary light-transmissible areas, and an opaque layer must be provided on the unnecessary areas to make them opaque. Generally, however, the unnecessary light-transmissible areas are minute and many in number, so that their detection and opaquing is a very laborious work. Thus, according to the opaquing method of the present invention, only the necessary light-transmissible area is detected and the other light-transmissible areas are regarded as unnecessary and the latter are stopped out.
    Type: Grant
    Filed: October 14, 1987
    Date of Patent: May 30, 1989
    Assignee: Toyo Ink Mfg. Co., Ltd.
    Inventors: Keiji Komori, Masaru Ohta, Takashi Sawada, Masaaki Matsuo