Abstract: A semiconductor device includes a semiconductor substrate having a quadrangular shape when viewed from above and having a front surface, a rear surface opposite to the front surface, and four side surfaces connecting the front surface and the rear surface. Each of the side surfaces has a step section in which a plurality of protruding portions and a plurality of recessed portions alternately and repeatedly appear along a direction in which a peripheral edge of the front surface of the semiconductor substrate extends.

Abstract: A semiconductor device includes a semiconductor substrate and a metal layer disposed on a surface of the semiconductor substrate. The metal layer includes a first metal layer and a second metal layer. The second metal layer covers a surface of the first metal layer and has a higher solder wettability than the first metal layer. The second metal layer is exposed on a main surface of the metal layer. The first metal layer is exposed on a side surface of the metal layer. The metal layer has a protruding portion on the main surface. The protruding portion extends to make one round along an outer peripheral edge of the main surface.

Abstract: A manufacturing method of a semiconductor device includes preparing a semiconductor substrate having a plurality of element regions and having a first surface and a second surface opposite to each other, forming a crack extending in a thickness direction of the semiconductor substrate along a boundary between the plurality of element regions by pressing a pressing member against the first surface of the semiconductor substrate along the boundary, forming a metal film over the plurality of element regions on the first surface of the semiconductor substrate after the forming of the crack, and dividing the semiconductor substrate and the metal film along the boundary by pressing a dividing member against the semiconductor substrate along the boundary from a direction facing the second surface of the semiconductor substrate after the forming of the metal film.

Abstract: A method of manufacturing a semiconductor device, the method may include: forming a SOG film on a wafer, the wafer including a semiconductor substrate and a polyimide film exposed on a surface of the wafer, and the SOG film being formed so as to cover the polyimide film; applying a protection tape on a surface of the SOG film; processing the wafer on which the protection tape is applied; and peeling the protection tape from the wafer.

Abstract: A method of manufacturing a semiconductor device, the method may include: forming a SOG film on a wafer, the wafer including a semiconductor substrate and a polyimide film exposed on a surface of the wafer, and the SOG film being formed so as to cover the polyimide film; applying a protection tape on a surface of the SOG film; processing the wafer on which the protection tape is applied; and peeling the protection tape from the wafer.

Abstract: An electronic apparatus includes a photography unit that captures a moving image and a still image, a transmitter that transmits the images captured by the photography unit to another electronic apparatus, a receiver that receives images captured by the other electronic apparatus from the other electronic apparatus, a common portion detector that detects a common portion between the images captured by the photography unit and the images received by the receiver, a combined moving image generation unit that generates a combined moving image that displays a positional relationship between the electronic apparatus and the other electronic apparatus, a display unit that displays the generated combined moving image, and a panorama image generation unit that generates the panorama image by overlapping and combining the still image captured by the photography unit, the still image captured by the other electronic apparatus, and the common portion, according to the positional relationship.

Abstract: An electronic apparatus includes a photography unit that captures a moving image and a still image, a transmitter that transmits the images captured by the photography unit to another electronic apparatus, a receiver that receives images captured by the other electronic apparatus from the other electronic apparatus, a common portion detector that detects a common portion between the images captured by the photography unit and the images received by the receiver, a combined moving image generation unit that generates a combined moving image that displays a positional relationship between the electronic apparatus and the other electronic apparatus, a display unit that displays the generated combined moving image, and a panorama image generation unit that generates the panorama image by overlapping and combining the still image captured by the photography unit, the still image captured by the other electronic apparatus, and the common portion, according to the positional relationship.

Abstract: An imaging device and a method for generating a panoramic image are provided. The imaging device includes an imaging unit configured to generate a plurality of continuous frame image in a certain direction in order to generate a panoramic image, an input unit configured to receive a command from a user during contiguous photographing of frame images via the imaging unit, a reference image setting unit configured to set a frame image captured by the imaging unit as a reference image upon receiving the command from the user, and an image synthesizer configured to generate a panoramic image by synthesizing other frame images around the reference image set by the reference image setting unit.