Abstract: A semiconductor device includes: a first semiconductor chip having a first active surface and a bonding surface forming an opposite side of the first active surface, the bonding surface being bonded to a mounting surface of a substrate; a second semiconductor chip having a second active surface facing the first active surface, and stacked on the first semiconductor chip; a slope section having a sloping surface with a shape of smoothing a step between the first active surface and the mounting surface, and adapted to bury the step in at least a part of a periphery of the first semiconductor chip; and a first wiring wire laid down between the mounting surface and the first active surface via the sloping surface of the slope section, and connected to a first bump provided to the second active surface on the first active surface.

Abstract: A semiconductor device includes: an electrode pad; a wiring line electrically coupled to the electrode pad, the wiring line being formed by disposing and drying a droplet of a conductive ink in which metal fine particles are dispersed in a dispersion medium; an intermediate layer of an bonded layer of the metal fine particles on a surface of the electrode pad; and a liquid repellent layer that includes a liquid repellent material repelling the dispersion medium and is layered on the intermediate layer to cover the intermediate layer. In the device, the wiring line is physically coupled to the electrode pad with the liquid repellent layer and the intermediate layer interposed between the wiring line and the electrode pad.

Abstract: The present invention provides a drive unit manufacturing method including the steps of: preparing a conducting wire which contains at least copper and forms a voice coil for conversion between sound and electric signals and arranging the conducting wire on a land which is formed on a board that the voice coil is arranged on and is provided for transmitting the electric signals; and connecting the conducting wire and the land by resistance welding.