Patents by Inventor Masashi Hamanaka
Masashi Hamanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6919267Abstract: After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, respective foreign matters adhered to a polishing pad and to a surface to be polished during polishing are removed and then a surface of the anti-reflection film is polished.Type: GrantFiled: December 26, 2002Date of Patent: July 19, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Tetsuya Ueda, Masashi Hamanaka, Takeshi Harada, Hideaki Yoshida
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Patent number: 6881660Abstract: After a plurality of grooves are formed in an insulating film, a barrier metal film and a conductive film are deposited successively on the insulating film such that each of the grooves is filled completely therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, a foreign matter adhered to the surface to be polished during polishing is removed and then a surface of the insulating film is polished.Type: GrantFiled: December 26, 2002Date of Patent: April 19, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Harada, Hideaki Yoshida, Tetsuya Ueda, Masashi Hamanaka
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Patent number: 6858549Abstract: After a plurality of grooves are formed in an insulating film and in an antireflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled. Subsequently, the portions of the conductive film outside the grooves are removed by a first polishing step and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, foreign matter adhered to the surface of the anti-reflection film is removed and a third polishing step is conducted on the surface of the anti-reflection film using an abrasive agent of the same type as used in the first polishing step of the conductive film.Type: GrantFiled: December 26, 2002Date of Patent: February 22, 2005Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masashi Hamanaka, Takeshi Harada, Hideaki Yoshida, Tetsuya Ueda
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Patent number: 6759322Abstract: After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the wiring grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the wiring are removed by polishing. Thereafter, a foreign matter adhered to a surface to be polished during polishing is removed and then a surface of the anti-reflection film is polished.Type: GrantFiled: December 26, 2002Date of Patent: July 6, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Yoshida, Tetsuya Ueda, Masashi Hamanaka, Takeshi Harada
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Publication number: 20040127148Abstract: A method for fabricating a semiconductor device, which includes the process step of polishing a substrate using CMP. To suppress the generation of scars and scratches on a wafer surface, in the polishing process, a tube-type slurry supply pump 15 is used to supply slurry. Then, in the tube-type slurry supply pump 15, a vinyl chloride type tube is used as a tube 12 for supplying a slurry.Type: ApplicationFiled: September 29, 2003Publication date: July 1, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Masashi Hamanaka, Eigo Shirakashi, Fumitaka Ito
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Publication number: 20040097174Abstract: On the surface of a belt-type surface plate wound around two rollers whose rotation axes are arranged in parallel with each other, four or other number of sheet-shaped polishing pads of polyurethane are stuck. Each of the polishing pads has grooves extending in the same direction as the drive direction of the surface plate. Moreover, the polishing pads adjacently arranged in the drive direction of the surface plate are stuck apart in such a manner that the grooves of one polishing pad are spaced not to align with the respective grooves of the other polishing pad.Type: ApplicationFiled: September 22, 2003Publication date: May 20, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Eigo Shirakashi, Masashi Hamanaka, Fumitaka Ito
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Patent number: 6737348Abstract: Holes are formed in a first insulating film deposited on a substrate. After depositing a first conducting film over the first insulating film including the holes, the first conducting film is subjected to first CMP, so as to form plugs from the first conducting film. Next, the first insulating film is subjected to second CMP with a polishing rate of the first insulating film higher than a polishing rate of the first conducting film, so as to planarize the first insulating film by eliminating erosion caused in a region of the first insulating film where the plugs are densely formed. After depositing a second insulating film on the planarized first insulating film, interconnect grooves are formed in the second insulating film. After depositing a second conducting film over the second insulating film including the interconnect grooves, the second conducting film is subjected to third CMP, so as to form buried interconnects from the second conducting film.Type: GrantFiled: April 12, 2002Date of Patent: May 18, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Mitsunari Satake, Masashi Hamanaka, Hideaki Yoshida
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Publication number: 20040009653Abstract: After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, respective foreign matters adhered to a polishing pad and to a surface to be polished during polishing are removed and then a surface of the anti-reflection film is polished.Type: ApplicationFiled: December 26, 2002Publication date: January 15, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Tetsuya Ueda, Masashi Hamanaka, Takeshi Harada, Hideaki Yoshida
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Publication number: 20030224594Abstract: After a plurality of grooves are formed in an insulating film and in an anti-reflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the wiring grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the wiring are removed by polishing. Thereafter, a foreign matter adhered to a surface to be polished during polishing is removed and then a surface of the anti-reflection film is polished.Type: ApplicationFiled: December 26, 2002Publication date: December 4, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hideaki Yoshida, Tetsuya Ueda, Masashi Hamanaka, Takeshi Harada
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Publication number: 20030216033Abstract: After a plurality of grooves are formed in an insulating film, a barrier metal film and a conductive film are deposited successively on the insulating film such that each of the grooves is filled completely therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, a foreign matter adhered to the surface to be polished during polishing is removed and then a surface of the insulating film is polished.Type: ApplicationFiled: December 26, 2002Publication date: November 20, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Harada, Hideaki Yoshida, Tetsuya Ueda, Masashi Hamanaka
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Publication number: 20030216019Abstract: After a plurality of grooves are formed in an insulating film and in an antireflection film on the insulating film, a barrier metal film and a conductive film are deposited on the anti-reflection film such that each of the grooves is filled therewith. Subsequently, the portions of the conductive film outside the grooves are removed by polishing and then the portions of the barrier metal film outside the grooves are removed by polishing. Thereafter, a foreign matter adhered to a surface to be polished during polishing is removed and then a surface of the anti-reflection film is polished by using an abrasive agent of the same type as used in the step of polishing the conductive film.Type: ApplicationFiled: December 26, 2002Publication date: November 20, 2003Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Masashi Hamanaka, Takeshi Harada, Hideaki Yoshida, Tetsuya Ueda
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Publication number: 20020168846Abstract: Holes are formed in a first insulating film deposited on a substrate. After depositing a first conducting film over the first insulating film including the holes, the first conducting film is subjected to first CMP, so as to form plugs from the first conducting film. Next, the first insulating film is subjected to second CMP with a polishing rate of the first insulating film higher than a polishing rate of the first conducting film, so as to planarize the first insulating film by eliminating erosion caused in a region of the first insulating film where the plugs are densely formed. After depositing a second insulating film on the planarized first insulating film, interconnect grooves are formed in the second insulating film. After depositing a second conducting film over the second insulating film including the interconnect grooves, the second conducting film is subjected to third CMP, so as to form buried interconnects from the second conducting film.Type: ApplicationFiled: April 12, 2002Publication date: November 14, 2002Inventors: Mitsunari Satake, Masashi Hamanaka, Hideaki Yoshida
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Patent number: 6416617Abstract: A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.Type: GrantFiled: November 30, 2000Date of Patent: July 9, 2002Assignee: Matsushita Electronics CorporationInventors: Hideaki Yoshida, Masashi Hamanaka
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Patent number: 6248660Abstract: A method for forming a metallic plug capable of preventing the occurrence of defects due to a short between conductive layers and the decrease of reliability in a conductive layer caused by a change of plug resistance by polishing and eliminating a filling film and an adhesive layer using a slurry for polishing a metal after eliminating a part of the filling film by dry etching beforehand. A metal plug can be obtained by the following steps: forming an end connection opened in an interlayer dielectric so as to expose the surface of a conductive layer under the interlayer dielectric; forming an adhesive layer on the exposed conductive layer and on the interlayer dielectric; forming a filling film on the adhesive layer, which fills the end connection completely; eliminating 60% or more of the film thickness of the filling film formed by dry etching; and polishing and eliminating the filling film and the adhesive layer using a slurry for polishing a metal.Type: GrantFiled: January 26, 1998Date of Patent: June 19, 2001Assignee: Matsushita Electronics CorporationInventors: Masashi Hamanaka, Tetsuo Ishida, Masafumi Shishino
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Publication number: 20010000753Abstract: A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.Type: ApplicationFiled: November 30, 2000Publication date: May 3, 2001Applicant: Matsushita Electronics CorporationInventors: Hideaki Yoshida, Masashi Hamanaka
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Patent number: 6191038Abstract: A polishing pad is fixed on a polishing platen mounted to be rotatable. An abrasive supply tube supplies an abrasive onto the polishing pad. A substrate holder is mounted to be rotatable above the polishing pad, holds a substrate to be polished and presses the substrate against the polishing pad, thereby polishing the substrate. A dresser is mounted to be rotatable above the polishing pad, and dresses the polishing pad. A torque detector detects the rotation torque of the polishing platen or the rotation torque of the substrate holder. A dresser controller makes the dresser dress the polishing pad if the rotation torque detected by the torque detector is equal to or smaller than a predetermined value.Type: GrantFiled: September 1, 1998Date of Patent: February 20, 2001Assignee: Matsushita Electronics CorporationInventors: Hideaki Yoshida, Masashi Hamanaka