Patents by Inventor Masashi Hanyu

Masashi Hanyu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked conduit assembly and screw fastening method for conduit part
    Patent number: 8356633
    Abstract: A stacked conduit assembly includes: a conduit part in which a plurality of plate-like parts are stacked and integrated, and a hollow conduit is formed in an inner layer; and a control board to be fastened to the conduit part by a screw. The plate-like parts include a plurality of plate-like parts that respectively form a side wall, an upper face, and a bottom face of the conduit, a pilot hole is formed in a plate-like part that forms the side wall of the conduit, and the screw is a tapping screw that taps by itself in the pilot hole and is fastened. Thus, a stacked conduit assembly that can stabilize a screw engagement state and realize downsizing or thinning of devices and cost reduction can be obtained.
    Type: Grant
    Filed: February 24, 2009
    Date of Patent: January 22, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Minoru Hashimoto, Masashi Hanyu
  • STACKED CONDUIT ASSEMBLY AND SCREW FASTENING METHOD FOR CONDUIT PART
    Publication number: 20110000570
    Abstract: A stacked conduit assembly includes: a conduit part in which a plurality of plate-like parts are stacked and integrated, and a hollow conduit is formed in an inner layer; and a control board to be fastened to the conduit part by a screw. The plate-like parts include a plurality of plate-like parts that respectively form a side wall, an upper face, and a bottom face of the conduit, a pilot hole is formed in a plate-like part that forms the side wall of the conduit, and the screw is a tapping screw that taps by itself in the pilot hole and is fastened. Thus, a stacked conduit assembly that can stabilize a screw engagement state and realize downsizing or thinning of devices and cost reduction can be obtained.
    Type: Application
    Filed: February 24, 2009
    Publication date: January 6, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Minoru Hashimoto, Masashi Hanyu