Abstract: The present invention is a negative photosensitive resin composition includes: (A) a polymer compound having a polyimide precursor structure; (C) a photoinitiator; (D) a nitrogen-containing organic compound represented by the following general formula (1); and (E) a solvent. This can provide: a photosensitive resin composition using a polyimide precursor, which enables imide ring closure reaction to be performed at low temperature, has excellent stability of the composition, and is capable of forming a fine pattern and providing resistance to chemicals. Additionally, a patterning process using the photosensitive resin composition, an interlayer insulating film characterized by including a cured film of a photosensitive resin composition, and an electronic component are to be provided.

Abstract: Polymerizable ester compounds having formula (1) are novel wherein R1 is H, F, methyl or trifluoromethyl, R2 is an acid labile group, Aa is a divalent hydrocarbon group which may be separated by —O— or —C(?O)—, and k1 is 0 or 1. They are useful as monomers to produce polymers which are transparent to radiation ?500 nm. Radiation-sensitive resist compositions comprising the polymers as base resin exhibit excellent developed properties.