Abstract: A film peeling apparatus including a board support section 41, a hole forming jig 51, a punch unit 21, and a film peeling mechanism. The board support section 41 supports a board 15 to which an inter-layer insulating film and carrier film has been bonded, the carrier film being arranged on a side of the insulating material opposite the board. The hole forming jig 51 has needles 57 serving as a tip-sharpened member. The needles 57 pierce a peripheral portion of the carrier film so as to form through holes. The punch unit 21 drives the hole forming jig 51 so as to piercing the carrier film by use of the needles 57. The film peeling mechanism peels off the carrier film, starting from air pockets formed around the through holes. Also disclosed is a method of manufacturing a wiring board having an insulating layer, which includes a step of peeling a carrier film from a board to which the insulating material and carrier film has been bonded.

Abstract: A circuit board having a plurality of solder bumps is provided. The solder bumps are flattened and leveled at the tops so that the coplanarity of the solder bumps is 0.5 &mgr;m or less per 1 mm. The flattened and leveled tops of the solder bumps are formed by cold pressing, hot pressing or grinding. Method of forming such solder bumps and jigs used for carrying out such methods are also provided.