Abstract: Provided is a laser welding method including a welding step of welding a workpiece by irradiating a surface of a workpiece with a laser beam that is swept two-dimensionally while being advanced in an X direction. In the welding step, the laser beam is swept to draw a predetermined pattern on the surface of the workpiece. Additionally, drawing speed and output of the laser beam are controlled to have an equal amount of heat input per unit drawing length in the predetermined pattern over the entire length of the predetermined pattern. The predetermined pattern is a continuous pattern in which two annular patterns are in contact with each other at one point.

Abstract: A laser welding device includes: a laser oscillator to which an incidence end of a fiber is connectable; a welding head connectable to an emission end of the fiber and configured to perform laser welding while condensing laser light emitted from the laser oscillator via the emission end and irradiating a workpiece with the laser light; a detector configured to detect presence or absence of a defect in the laser welding; and a controller including a processor and a memory storing instructions that, when executed by the processor, cause the laser welding device to perform operations. The operations include: performing, in response to receiving, from the detector, an output signal indicating a defect at a welding point on the workpiece during the laser welding of the workpiece, control such that supplementary laser welding is performed at a predetermined position in a vicinity of the welding point.

Abstract: A laser welding device includes: a laser oscillator with which an incoming end of a fiber is connected; a welding head that is connected to an outgoing end of the fiber and that performs laser welding while irradiating a workpiece with laser light by guiding the laser light from the laser oscillator to the workpiece via the fiber; a sensor that detects, during the laser welding, an intensity of plume light that is based on the laser welding at a welded position at which the workpiece is irradiated with the laser light; and a controller that controls a height of the welding head based on a detection output from the sensor, the height being a height in a direction parallel with a direction that the laser light is emitted.

Abstract: A laser welding method includes a welding step of applying a laser beam to a surface of a workpiece while the laser beam is caused to advance in an X-direction and scanning with the laser beam is simultaneously performed in a Y-direction intersecting the X-direction. The welding step includes a first weaving step of causing the laser beam to weave in the Y-direction with first amplitude (A1), and a second weaving step of causing the laser beam to weave with a predetermined amplitude smaller than first amplitude (A1) at both end portions of a weaving trajectory drawn by the laser beam in the first weaving step.

Abstract: A laser beam machine has a control unit. The control unit transmits an output signal for starting an output of the laser beam at a first time point and stopping the output of the laser beam at a second time point which is later than the first time point, to the laser oscillator. The control unit receives a detection signal indicating first detection intensity which is greater than first preset intensity from the light detector, at a third time point which is later than the second time point. The control unit transmits a drive signal for controlling the emission unit to be driven, to the emission unit, at a fourth time point equal to or later than the third time point. The control unit transmits a warning signal at a fifth time point equal to or later than the third time point.

Abstract: A method and device capable of properly selecting light radiating conditions in soldering work where components are soldered onto a board with light radiation applied to a solder joint. The device for selecting the light radiation conditions may contain a) an input device for entering information on; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; and d) an output device for outputting the light radiating conditions determined by the calculator. The input device may further comprise i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component.

Abstract: An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path.

Abstract: Provided is a light processing apparatus which can judge goodness or badness of small amount and various kind processing, and is useful for small amount and various kind processing, and can realize light processing at an appropriate position in conformity with a state of a substrate, at low cost, and can prevent production of a bad item before it happens, and enables local heating by focusing light energy, and is useful for a processing apparatus such as solder joint or heat processing of resin and a production equipment which used this. A state of an object to be processed enters into an image receiving unit, through a first light path and a second light path. This image and an image which was set up in a storage device in advance are compared, and goodness or badness judgment is carried out. There occurs a change of a point to be irradiated, in an approximately horizontal direction to the first light path, between a case that the object to be processed is in a warp age state, and a case that it is not so.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: The light radiating conditions selecting device contains a) an input device for entering at least any one item of information on i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; d) and an output device for outputting the light radiating conditions determined by the calculator.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: Provided is a light processing apparatus which can judge goodness or badness of small amount and various kind processing, and is useful for small amount and various kind processing, and can realize light processing at an appropriate position in conformity with a state of a substrate, at low cost, and can prevent production of a bad item before it happens, and enables local heating by focusing light energy, and is useful for a processing apparatus such as solder joint or heat processing of resin and a production equipment which used this. A state of an object to be processed enters into an image receiving unit, through a first light path and a second light path. This image and an image which was set up in a storage device in advance are compared, and goodness or badness judgment is carried out. There occurs a change of a point to be irradiated, in an approximately horizontal direction to the first light path, between a case that the object to be processed is in a warpage state, and a case that it is not so.

Abstract: The invention presents a optical processing apparatus capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

Abstract: An optical processing apparatus includes an emitter for emitting light, a first light path for directing the light to a position to be processed on a workpiece, and a processing head. The processing head includes an optical system provided in the first light path, for shaping the light, a second light path having a portion shared with the first light path, the second light path directing light reflected from the workpiece, and an optical receiver for receiving the reflected light from the second light path.