Patents by Inventor Masashi Isoda

Masashi Isoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mounting apparatus and method to control mounting apparatus
    Patent number: 8042266
    Abstract: A mounting apparatus to mount electronic components on a board includes at least one component feeder in which electronic components of different types are disposed in series, and a mounting information supplier which supplies mounting information. The component feeder is configured to mount the electronic components on the board based on the mounting information from the mounting information supplier.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: October 25, 2011
    Assignee: Ricoh Company, Ltd.
    Inventors: Masashi Isoda, Hideki Takahashi
  • MOUNTING APPARATUS AND METHOD TO CONTROL MOUNTING APPARATUS
    Publication number: 20080098591
    Abstract: A mounting apparatus to mount electronic components on a board includes at least one component feeder in which electronic components of different types are disposed in series, and a mounting information supplier which supplies mounting information. The component feeder is configured to mount the electronic components on the board based on the mounting information from the mounting information supplier.
    Type: Application
    Filed: October 25, 2007
    Publication date: May 1, 2008
    Inventors: Masashi ISODA, Hideki Takahashi
  • Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument
    Patent number: 6779710
    Abstract: A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: August 24, 2004
    Assignee: Ricoh Company, Ltd.
    Inventors: Minoru Igarashi, Katsuhiko Mukai, Masashi Isoda, Takayuki Kobayashi
  • Mounting parts peel suppressing soldering method, electronic circuit baseboard, and electronic instrument
    Publication number: 20020170947
    Abstract: A method for soldering parts mounted on a print circuit baseboard with Pb-free material. A reflow soldering process is performed to parts mounted on one side surface of the print circuit baseboard. A flow soldering process is then performed to parts mounted on the other side surface of the print circuit baseboard with a jet flow solder process. Either a composition or a melting point of alloys generated when the reflow and flow soldering are performed is differentiated so that the alloy on one side surface does not melt during a flow soldering process to the other side surface.
    Type: Application
    Filed: April 29, 2002
    Publication date: November 21, 2002
    Inventors: Minoru Igarashi, Katsuhiko Mukai, Masashi Isoda, Takayuki Kobayashi