Patents by Inventor Masashi Kanaoka
Masashi Kanaoka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10423070Abstract: A substrate treating method includes a determining step for determining a treating condition for hydrophobizing a surface of a substrate, based on a target regarding a dissolved area size in a resist pattern, and a treating step for hydrophobizing the surface of the substrate with the treating condition determined in the determining step before forming resist film on the surface of the substrate.Type: GrantFiled: February 28, 2017Date of Patent: September 24, 2019Assignee: SCREEN Holdings Co., Ltd.Inventors: Masashi Kanaoka, Masanori Imamura, Taiji Matsu, Hidetoshi Sagawa, Atsushi Tanaka, Kazuhiro Tadokoro, Kazuya Ono, Shinichi Takada, Tsuyoshi Mitsuhashi
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Patent number: 10144033Abstract: A substrate is held and rotated in a horizontal attitude by a rotation holder. A coating liquid is supplied by a coating liquid supplier to a surface to be processed of the substrate rotated by the rotation holder. A first removal liquid is supplied by a first removal liquid supplier to a first annular region at a peripheral portion of the substrate rotated by the rotation holder before the coating liquid supplied by the coating liquid supplier loses fluidity. In this state, a supply position of the first removal liquid by the first removal liquid supplier is moved from an inner edge to an outer edge of the first annular region.Type: GrantFiled: August 30, 2016Date of Patent: December 4, 2018Assignee: SCREEN Holdings Co., Ltd.Inventors: Masanori Imamura, Masashi Kanaoka, Hidetoshi Sagawa, Yoshinori Tawaratani, Masaaki Furukawa
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Patent number: 10134610Abstract: After a development liquid on a substrate is washed away with a rinse liquid, the rotational speed of the substrate is reduced, so that a liquid layer of the rinse liquid is formed over a top surface of the substrate. Thereafter, the rotational speed of the substrate is increased. The increase in the rotational speed of the substrate causes a centrifugal force to be slightly greater than tension, thereby causing the liquid layer to be held on the substrate with the thickness thereof in its peripheral portion increased and the thickness thereof at the center thereof decreased. Then, gas is discharged toward the center of the liquid layer from a gas supply nozzle, so that a hole is formed at the center of the liquid layer. This causes tension that is balanced with a centrifugal force exerted on the peripheral portion of the liquid layer to disappear. Furthermore, the rotational speed of the substrate is further increased while the gas is discharged. Thus, the liquid layer moves outward from the substrate.Type: GrantFiled: September 11, 2008Date of Patent: November 20, 2018Assignee: Screen Semiconductor Solutions Co., Ltd.Inventors: Tadashi Miyagi, Masashi Kanaoka, Kazuhito Shigemori, Shuichi Yasuda, Masakazu Sanada
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Patent number: 9937520Abstract: A nozzle starts discharging a processing liquid while a spin chuck holds and rotates a substrate having a water-repellent film being formed on a surface thereof. The processing liquid is discharged to a position spaced away from the center of the substrate by a preset distance, and flows so as to converge into one stream on the substrate immediately after discharge of the processing liquid starts. This achieves suppression of the minute water droplets. Moreover, the nozzle is moved toward outside of the substrate while discharging the processing liquid successively. This allows entire flow of the processing liquid to move toward outside of the substrate while the processing liquid converging into one stream on the substrate is maintained. Here, inside the flow of the processing liquid is a dried region.Type: GrantFiled: May 26, 2015Date of Patent: April 10, 2018Assignee: SCREEN Holdings Co., Ltd.Inventors: Masashi Kanaoka, Takehiro Wajiki, Shinichi Takada
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Publication number: 20170277038Abstract: A substrate treating method includes a determining step for determining a treating condition for hydrophobizing a surface of a substrate, based on a target regarding a dissolved area size in a resist pattern, and a treating step for hydrophobizing the surface of the substrate with the treating condition determined in the determining step before forming resist film on the surface of the substrate.Type: ApplicationFiled: February 28, 2017Publication date: September 28, 2017Inventors: Masashi KANAOKA, Masanori IMAMURA, Taiji MATSU, Hidetoshi SAGAWA, Atsushi TANAKA, Kazuhiro TADOKORO, Kazuya ONO, Shinichi TAKADA, Tsuyoshi MITSUHASHI
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Publication number: 20170056917Abstract: A substrate is held and rotated in a horizontal attitude by a rotation holder. A coating liquid is supplied by a coating liquid supplier to a surface to be processed of the substrate rotated by the rotation holder. A first removal liquid is supplied by a first removal liquid supplier to a first annular region at a peripheral portion of the substrate rotated by the rotation holder before the coating liquid supplied by the coating liquid supplier loses fluidity. In this state, a supply position of the first removal liquid by the first removal liquid supplier is moved from an inner edge to an outer edge of the first annular region.Type: ApplicationFiled: August 30, 2016Publication date: March 2, 2017Inventors: Masanori IMAMURA, Masashi KANAOKA, Hidetoshi SAGAWA, Yoshinori TAWARATANI, Masaaki FURUKAWA
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Patent number: 9477162Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.Type: GrantFiled: November 26, 2014Date of Patent: October 25, 2016Assignee: SCREEN Semiconductor Solutions Co., Ltd.Inventors: Koji Kaneyama, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori, Shuichi Yasuda, Tetsuya Hamada
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Publication number: 20160203997Abstract: A substrate processing method includes forming a first film on the upper surface of the substrate and supplying a first removal liquid to a peripheral edge of said first film to remove a first annular region at the peripheral edge. The method also includes correcting a relative positional relationship between the substrate and a first removal nozzle, forming a second film so as to cover the first film, and supplying a second removal liquid to a peripheral edge of said second film to remove a second annular region at the peripheral edge. The method also includes correcting a relative positional relationship between the substrate and a second removal nozzle so that said second annular region at the peripheral edge of said second film is removed in a predetermined second constant width and carrying the substrate into each of a first and second film formation units by a carry-in device.Type: ApplicationFiled: March 23, 2016Publication date: July 14, 2016Inventors: Tadashi Miyagi, Masashi Kanaoka, Tetsuya Hamada, Kazuhito Shigemori, Shuichi Yasuda
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Publication number: 20150352591Abstract: A nozzle starts discharging a processing liquid while a spin chuck holds and rotates a substrate having a water-repellent film being formed on a surface thereof. The processing liquid is discharged to a position spaced away from the center of the substrate by a preset distance, and flows so as to converge into one stream on the substrate immediately after discharge of the processing liquid starts. This achieves suppression of the minute water droplets. Moreover, the nozzle is moved toward outside of the substrate while discharging the processing liquid successively. This allows entire flow of the processing liquid to move toward outside of the substrate while the processing liquid converging into one stream on the substrate is maintained. Here, inside the flow of the processing liquid is a dried region.Type: ApplicationFiled: May 26, 2015Publication date: December 10, 2015Inventors: Masashi KANAOKA, Takehiro WAJIKI, Shinichi TAKADA
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Patent number: 8941809Abstract: A substrate processing apparatus includes an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, and an interface block. An exposure device is arranged adjacent to the interface block. The interface block includes first and second inspection units. The first inspection unit inspects the state of the substrate before exposure processing, and the second inspection unit inspects the state of the substrate after exposure processing.Type: GrantFiled: December 22, 2009Date of Patent: January 27, 2015Assignee: SCREEN Semiconductor Solutions Co., Ltd.Inventor: Masashi Kanaoka
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Patent number: 8932672Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a resist cover film processing block, a resist cover film removal block, a cleaning/drying processing block, and an interface block. An exposure device is arranged adjacent to the interface block in the substrate processing apparatus. The exposure device subjects a substrate to exposure processing by means of an immersion method. In the edge cleaning unit in the cleaning/drying processing block, a brush abuts against an end of the rotating substrate, so that the edge of the substrate before the exposure processing is cleaned. At this time, the position where the substrate is cleaned is corrected.Type: GrantFiled: November 30, 2009Date of Patent: January 13, 2015Assignee: SCREEN Semiconductor Solutions Co., Ltd.Inventors: Koji Kaneyama, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori, Shuichi Yasuda, Tetsuya Hamada
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Patent number: 8894775Abstract: After a substrate is cleaned, a liquid layer of a rinse liquid is formed so as to cover one surface of the substrate. Then, a liquid supply nozzle moves outward from above the center of the substrate. The liquid supply nozzle is stopped once at the time point where it moves by a predetermined distance from above the center of the substrate. In this time period, the liquid layer is divided within a thin layer region by a centrifugal force, so that a drying core is formed at the center of the liquid layer. Thereafter, the liquid supply nozzle moves outward again, so that a drying region where no rinse liquid exists expands on the substrate with the drying core as its starting point.Type: GrantFiled: September 11, 2008Date of Patent: November 25, 2014Assignee: Screen Semiconductor Solutions Co., Ltd.Inventors: Tadashi Miyagi, Masashi Kanaoka, Kazuhito Shigemori, Shuichi Yasuda, Masakazu Sanada
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Publication number: 20140120477Abstract: A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes forming a photosensitive film on the substrate by said first processing unit before exposure processing by said exposure device and applying washing processing to the substrate by supplying a washing liquid to the substrate in said second processing unit after the formation of said photosensitive film and before the exposure processing. The method also includes applying drying processing to the substrate in said second processing unit after the washing processing by said second processing unit and before the exposure processing and applying development processing to the substrate by said third processing unit after the exposure processing. Applying the drying processing to the substrate includes the step of supplying an inert gas onto the substrate, to which the washing liquid is supplied.Type: ApplicationFiled: January 7, 2014Publication date: May 1, 2014Inventors: Shuichi Yasuda, Masashi Kanaoka, Koji Kaneyama, Tadashi Miyagi, Kazuhito Shigemori, Toru Asano, Yukio Toriyama, Takashi Taguchi, Tsuyoshi Mitsuhashi, Tsuyoshi Okumura
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Patent number: 8585830Abstract: A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes first, second and third processing units, includes the steps of: forming a photosensitive film made of a photosensitive material on the substrate by said first processing unit before exposure processing by said exposure device. The method also includes applying washing processing to the substrate by said second processing unit after the formation of said photosensitive film by said first processing unit and before the exposure processing by said exposure device and transporting the substrate after the washing processing to said exposure device. The method further includes transporting the substrate from said exposure device and applying development processing by said third processing unit to the substrate transported after the exposure processing by said exposure device.Type: GrantFiled: February 2, 2010Date of Patent: November 19, 2013Assignee: Sokudo Co., Ltd.Inventors: Shuichi Yasuda, Masashi Kanaoka, Koji Kaneyama, Tadashi Miyagi, Kazuhito Shigemori, Toru Asano, Yukio Toriyama, Takashi Taguchi, Tsuyoshi Mitsuhashi, Tsuyoshi Okumura
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Patent number: 8540824Abstract: The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.Type: GrantFiled: June 10, 2010Date of Patent: September 24, 2013Assignee: Sokudo Co., Ltd.Inventors: Koji Kaneyama, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori, Shuichi Yasuda
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Patent number: 8496761Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, and an interface block. An exposure device is arranged adjacent to an interface block. The interface block comprises a drying processing group including two drying processing units and an interface transport mechanism. After a substrate is subjected to exposure processing by the exposure device, the substrate is transported to the drying processing units in the drying processing group by the interface transport mechanism, where the substrate is subjected to cleaning and drying processings.Type: GrantFiled: April 6, 2010Date of Patent: July 30, 2013Assignee: Sokudo Co., Ltd.Inventors: Koji Kaneyama, Akihiro Hisai, Toru Asano, Hiroshi Kobayashi, Tsuyoshi Okumura, Shuichi Yasuda, Masashi Kanaoka, Tadashi Miyagi, Kazuhito Shigemori
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Patent number: 8356424Abstract: A substrate processing method comprises the step of subjecting a substrate to drying processing in at least one of a processing section and an interface, wherein the step of subjecting the substrate to the drying processing comprises the steps of: rotating the substrate at a first rotational speed around an axis perpendicular to the substrate, while holding the substrate horizontally, forming a liquid layer on the substrate in a state where the substrate is rotated at the first rotational speed, gradually and continuously increasing the rotational speed of the substrate to a second rotational speed after the formation of the liquid layer, and starting discharging a gas to the liquid layer on the substrate while the substrate is rotated at the second rotational speed.Type: GrantFiled: July 23, 2010Date of Patent: January 22, 2013Assignee: Dainippon Screen Mfg. Co., Ltd.Inventors: Koji Kaneyama, Kazuhito Shigemori, Masashi Kanaoka, Tadashi Miyagi, Shuichi Yasuda
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Patent number: 8218124Abstract: After a substrate is cleaned, a liquid supply nozzle moves outward from above the center of the substrate while discharging a rinse liquid with the substrate rotated. In this case, a drying region where no rinse liquid exists expands on the substrate. When the liquid supply nozzle moves to above a peripheral portion of the substrate, the rotational speed of the substrate is reduced. The movement speed of the liquid supply nozzle is maintained as it is. Thereafter, the discharge of the rinse liquid is stopped while the liquid supply nozzle moves outward from the substrate. Thus, the drying region spreads over the whole substrate so that the substrate is dried.Type: GrantFiled: September 11, 2008Date of Patent: July 10, 2012Assignee: Sokudo Co., Ltd.Inventors: Tadashi Miyagi, Masashi Kanaoka, Kazuhito Shigemori, Shuichi Yasuda, Masakazu Sanada
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Publication number: 20120037593Abstract: A substrate processing apparatus includes an anti-reflection film processing block, a resist film processing block, and a resist cover film processing block. In the processing blocks, an anti-reflection film, a resist film, and a resist cover film are formed on a substrate, respectively. Additionally, a film formed at a peripheral edge of the substrate is removed. The film formed at the peripheral edge of the substrate is removed by supplying a removal liquid capable of dissolving and removing the film to the peripheral edge of the substrate during rotation. When the peripheral edge of the film is removed, the position of the substrate is corrected such that the center of the substrate coincides with the center of a rotation shaft.Type: ApplicationFiled: October 28, 2011Publication date: February 16, 2012Applicant: SOKUDO CO., LTD.Inventors: Tadashi Miyagi, Masashi Kanaoka, Tetsuya Hamada, Kazuhito Shigemori, Shuichi Yasuda
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Patent number: 8040488Abstract: A substrate processing apparatus comprises an indexer block, an anti-reflection film processing block, a resist film processing block, a development processing block, a processing block for liquid immersion exposure processing, and an interface block. An exposure device is arranged adjacent to the interface block. The processing block for liquid immersion exposure processing comprises a coating processing group for resist cover film and a removal processing group for resist cover film. The resist cover film is formed in the processing block for liquid immersion exposure processing before the exposure processing. The resist cover film is removed in the processing block for liquid immersion exposure processing after the exposure processing.Type: GrantFiled: December 6, 2005Date of Patent: October 18, 2011Assignee: Sokudo Co., Ltd.Inventors: Shuichi Yasuda, Masashi Kanaoka, Koji Kaneyama, Tadashi Miyagi, Kazuhito Shigemori, Toru Asano, Yukio Toriyama, Takashi Taguchi, Tsuyoshi Mitsuhashi, Tsuyoshi Okumura