Patents by Inventor MASASHI KIKUCHII

MASASHI KIKUCHII has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    Publication number: 20110197438
    Abstract: A method of manufacturing a semiconductor device includes preparing a flexible printed wiring board having a first connection pad formed on a front surface, a second connection pad formed on a back surface, and a coating film covering regions of the flexible printed wiring board where the first and second connection pads are formed, and a semiconductor package having a third connection pad formed on a hack surface; mounting the semiconductor package on the front surface of the flexible printed wiring board so that the third connection pad is connected to the first connection pad; and folding the flexible printed wiring board so that the second connection pad is located above the front surface of the semiconductor package to face in the same direction as a front surface of the semiconductor package.
    Type: Application
    Filed: January 28, 2011
    Publication date: August 18, 2011
    Inventors: MASASHI KIKUCHII, HIROSHI SATO