Abstract: A photoelectric conversion apparatus includes a semiconductor substrate having a first surface and a second surface, a plurality of photoelectric conversion regions including an impurity of a first conductivity type and arranged at the semiconductor substrate, a trench arranged between the photoelectric conversion regions, an impurity region including an impurity of a second conductivity type opposite to the first conductivity type and arranged along a sidewall of the trench, and a first film arranged at the first surface of the semiconductor substrate and the sidewall of the trench. The impurity region includes a first region with an impurity concentration of a first concentration and a second region with an impurity concentration of a second concentration lower than the first concentration, and a distance between the first surface and the first region is smaller than a distance between the first surface and the second region.

Abstract: An image capturing apparatus where a pixel region that includes a photoelectric converter and a peripheral region that includes a transistor are arranged in a substrate is provided. The photoelectric converter is covered with a first silicon nitride layer, a side surface of a gate electrode of the transistor is covered with a side wall that include a second silicon nitride layer, and the first silicon nitride layer has a lower chlorine concentration than the second silicon nitride layer has.

Abstract: A photoelectric conversion apparatus includes: a substrate having a photoelectric conversion portion; a gate electrode of a transfer transistor provided on the substrate and configured to transfer charges generated by the photoelectric conversion portion; a first film; a second film provided on the first film; and a contact plug being in contact with the second film and connected to the transfer transistor.

Abstract: A method of manufacturing a photoelectric conversion apparatus includes heating a semiconductor substrate while a pixel circuit area is covered with an insulator film, performing ion implantation into the pixel circuit area through the insulator film, performing ion implantation into a peripheral circuit area after the heating, and forming a side wall on a side surface of a gate electrode of a transistor after the performing ion implantation into the peripheral circuit area.

Abstract: A semiconductor device has a silicon layer having a photoelectric conversion portion, a transfer electrode of a transfer portion disposed on the silicon layer, the transfer portion transferring a charge of the photoelectric conversion portion, and an insulator film having a first portion located between the transfer electrode and the silicon layer and a second portion located on the photoelectric conversion portion, the first portion and the second portion of the insulator film contain nitrogen, oxygen, and silicon, and the distance between the position where the nitrogen concentration shows the largest value in the second portion and the silicon layer is larger than the distance between the position where the nitrogen concentration shows the largest value in the first portion and the silicon layer.

Abstract: A method of manufacturing a photoelectric conversion apparatus includes heating a semiconductor substrate while a pixel circuit area is covered with an insulator film, performing ion implantation into the pixel circuit area through the insulator film, performing ion implantation into a peripheral circuit area after the heating, and forming a side wall on a side surface of a gate electrode of a transistor after the performing ion implantation into the peripheral circuit area.

Abstract: An image capturing apparatus where a pixel region that includes a photoelectric converter and a peripheral region that includes a transistor are arranged in a substrate is provided. The photoelectric converter is covered with a first silicon nitride layer, a side surface of a gate electrode of the transistor is covered with a side wall that include a second silicon nitride layer, and the first silicon nitride layer has a lower chlorine concentration than the second silicon nitride layer has.

Abstract: A semiconductor device has a silicon layer having a photoelectric conversion portion, a transfer electrode of a transfer portion disposed on the silicon layer, the transfer portion transferring a charge of the photoelectric conversion portion, and an insulator film having a first portion located between the transfer electrode and the silicon layer and a second portion located on the photoelectric conversion portion, the first portion and the second portion of the insulator film contain nitrogen, oxygen, and silicon, and the distance between the position where the nitrogen concentration shows the largest value in the second portion and the silicon layer is larger than the distance between the position where the nitrogen concentration shows the largest value in the first portion and the silicon layer.

Abstract: A method of manufacturing a solid-state image sensor is provided. The method comprises: depositing a gate electrode film above the semiconductor layer; etching the gate electrode film to form a first gate electrode patterned in a pixel region, leaving the gate electrode film in a peripheral region; depositing a first insulating film above the semiconductor layer after the forming the first gate electrode; removing the first insulating film formed in the peripheral region; etching the gate electrode film left in the peripheral region to form a second gate electrode patterned in the peripheral region after the removing the first insulating film; forming a second insulating film above the semiconductor layer after the forming the second gate electrode; and forming a side wall on side surface of the second gate electrode by etching the second insulating film.

Abstract: A method of manufacturing a solid-state image sensor is provided. The method comprises: depositing a gate electrode film above the semiconductor layer; etching the gate electrode film to form a first gate electrode patterned in a pixel region, leaving the gate electrode film in a peripheral region; depositing a first insulating film above the semiconductor layer after the forming the first gate electrode; removing the first insulating film formed in the peripheral region; etching the gate electrode film left in the peripheral region to form a second gate electrode patterned in the peripheral region after the removing the first insulating film; forming a second insulating film above the semiconductor layer after the forming the second gate electrode; and forming a side wall on side surface of the second gate electrode by etching the second insulating film.

Abstract: A photoelectric conversion device includes a pixel circuit section including: a first semiconductor region containing a first conductivity type impurity; a second semiconductor region formed in the first semiconductor region by using the first conductivity type impurity; a third semiconductor region formed in the second semiconductor region by using a second conductivity type impurity; and a contact plug formed on the third semiconductor region. A net concentration of the first conductivity type impurity is higher in the second semiconductor region than in the first and third semiconductor regions. In the second and third semiconductor regions, a distance between the contact plug and a position where the concentration of the second conductivity type impurity is maximum is equal to or less than a distance between the contact plug and a position where the concentration of the first conductivity type impurity is maximum.

Abstract: A method of manufacturing a photoelectric conversion apparatus which includes a pixel circuit section having a well where a photoelectric conversion element and an amplification element configured to generate a signal based on an amount of charge generated in the photoelectric conversion element are arranged, and a peripheral circuit section having a MOS transistor. The method includes forming a dielectric film for covering the photoelectric conversion element, the amplification element, and a gate electrode of the MOS transistor and forming, by etching the dielectric film, a side spacer by remaining a portion of the dielectric film on a side surface of the gate electrode while protecting by a resist, wherein an opening is formed in the dielectric film of the pixel circuit section with the etching, and a contact for defining a potential of the well is formed through the opening.

Abstract: Each of a plurality of pixel circuits is an insulated gate transistor and includes a first kind transistor having a maximum value of a gate potential difference to be applied equal to or higher than a first value. Each of a plurality of analog signal processing circuits is an insulated gate transistor and includes a second kind transistor having a maximum value of a gate potential difference to be applied equal to or lower than a second value that is lower than the first value. Each of a plurality of analog signal processing circuits does not include an insulated gate transistor having a maximum value of a gate potential difference to be applied not higher than the second value.

Abstract: A photoelectric conversion device includes a pixel circuit section including: a first semiconductor region containing a first conductivity type impurity; a second semiconductor region formed in the first semiconductor region by using the first conductivity type impurity; a third semiconductor region formed in the second semiconductor region by using a second conductivity type impurity; and a contact plug formed on the third semiconductor region. A net concentration of the first conductivity type impurity is higher in the second semiconductor region than in the first and third semiconductor regions. In the second and third semiconductor regions, a distance between the contact plug and a position where the concentration of the second conductivity type impurity is maximum is equal to or less than a distance between the contact plug and a position where the concentration of the first conductivity type impurity is maximum.

Abstract: Each of a plurality of pixel circuits is an insulated gate transistor and includes a first kind transistor having a maximum value of a gate potential difference to be applied equal to or higher than a first value. Each of a plurality of analog signal processing circuits is an insulated gate transistor and includes a second kind transistor having a maximum value of a gate potential difference to be applied equal to or lower than a second value that is lower than the first value. Each of a plurality of analog signal processing circuits does not include an insulated gate transistor having a maximum value of a gate potential difference to be applied not higher than the second value.

Abstract: A method of manufacturing a photoelectric conversion apparatus which includes a pixel circuit section having a well where a photoelectric conversion element and an amplification element configured to generate a signal based on an amount of charge generated in the photoelectric conversion element are arranged, and a peripheral circuit section having a MOS transistor. The method includes forming a dielectric film for covering the photoelectric conversion element, the amplification element, and a gate electrode of the MOS transistor and forming, by etching the dielectric film, a side spacer by remaining a portion of the dielectric film on a side surface of the gate electrode while protecting by a resist, wherein an opening is formed in the dielectric film of the pixel circuit section with the etching, and a contact for defining a potential of the well is formed through the opening.