Abstract: A management system includes a plurality of resources configured to be electrically connected to an external power supply, and a management device configured to manage the resources. The management device includes a planning unit and a management unit. The planning unit is configured to determine a power balancing plan of each of the resources by using first information on a use schedule of each of the resources and second information indicating a magnitude of an environmental load in a process of generating electric power to be supplied by the external power supply. The management unit is configured to manage the resources to cause each of the resources to operate according to the power balancing plan or a modified power balancing plan in power balancing of the external power supply.

Abstract: An optical film according to an embodiment includes a substrate 101, a surface member 102 provided on a front surface of the substrate 101, and an optical functional layer 103 provided on a back surface of the substrate 101. The optical functional layer 103 includes a low-refractive index layer 104 and a high-refractive index layer 105, and an interface between the low-refractive index layer 104 and the high-refractive index layer 105 has a recessed/protruding shape. The refractive index of the high-refractive index layer 105, the refractive index of the substrate 101, and the refractive index of the surface member 102 become smaller in this order.

Abstract: First and second electrically insulating substrates are joined with each other at respective joining faces thereof. Each of the first and second insulating substrates has an annular groove at the joining face, and a plurality of through holes along outer and inner peripheries of the annular groove. An annular core is mounted in the annular groove. A cylindrical connection is formed in each through hole, and a radial connection is formed on an outer surface of each insulating substrate so as to connect opposite cylindrical connections. A toroidal coil is formed by serially connecting cylindrical connections and radial connections. An IC chip is mounted on the outer surface of the first insulating substrate, and connected to the toroidal coil and electronic part. The toroidal coil and the electronic part are coated with an electrically insulating material.