Patents by Inventor Masashi NIIYAMA

Masashi NIIYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR MODULE
    Publication number: 20150162327
    Abstract: A semiconductor module is provided with a plurality of chip-type passive components, a conductive supporting member onto which the plurality of chip-type passive components are mounted, and a resin sealing part covering the plurality of chip-type passive components and at least a portion of the conductive supporting member. The plurality of chip-type passive components each include a semiconductor substrate, a plurality of electrodes formed on the semiconductor substrate, and a passive circuit connected between the plurality of electrodes.
    Type: Application
    Filed: December 3, 2014
    Publication date: June 11, 2015
    Inventor: Masashi NIIYAMA