Abstract: A novel method for storing a photocatalytic member containing fluorine-containing anatase-type titanium oxide is provided, which is capable of suppressing the decrease in content of fluorine during storage in a photocatalytic member containing fluorine-containing anatase-type titanium oxide. The storage method of the present invention is a method for storing a photocatalytic member containing fluorine-containing anatase-type titanium oxide including storing the photocatalytic member in a surrounding environment with a relative humidity of 30% or less. According to the storage method of the present invention, for example, the elimination of fluorine from the surface of fluorine-containing titanium oxide can be suppressed, and the decrease in content of fluorine during storage in a photocatalytic member can be suppressed.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: A sensor device is provided for performing rapid and high-sensitivity detection. The sensor device comprising at least one support for immobilizing a subject to be detected and a cell for containing a solution in which a reaction product generated from the subject to be detected is diffused. At least one reaction region having a constant concentration of the reaction product is formed by diffusion of the reaction product into the solution, and the reaction region is formed in such a manner that the reaction product is specifically detected in a predetermined measurement time.

Abstract: To provide a mold apparatus for resin encapsulation, which is small in number of components, has a simple driving mechanism, is easy in assembly or disassembly work, requires no labor for maintenance and has good workability; and a resin encapsulation method. Therefore, of a lower cavity bar 51 and an upper cavity bar 26, a plurality of groove-shaped pots 52 are provided in parallel at a predetermined pitch in a region where a substrate board is disposed, and each groove-shaped pot 52 is individually provided with a plurality of cavities 54 in parallel through runners. Then, a plunger plate 60 inserted in the grooved-shaped pot 52 in a manner so as to be able to move up and down is driven by a plunger 76, whereby a resin for encapsulation inserted into the pot 52 is melted with the plunger plate 60, and the melted resin is filled in the cavities 54 through the runners.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).

Abstract: A sensor device is provided for performing rapid and high-sensitivity detection. The sensor device comprising at least one support for immobilizing a subject to be detected and a cell for containing a solution in which a reaction product generated from the subject to be detected is diffused. At least one reaction region having a constant concentration of the reaction product is formed by diffusion of the reaction product into the solution, and the reaction region is formed in such a manner that the reaction product is specifically detected in a predetermined measurement time.

Abstract: A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).