Abstract: Provided are a glass substrate bonding method capable of securely anodically bonding a bonding material and a glass substrate even when Si having a large resistance value is used as a material for the bonding material, a glass assembly obtained by the glass substrate bonding method, a package manufacturing method, a package, a piezoelectric vibrator, and an oscillator, an electronic device, and a radio-controlled timepiece having the piezoelectric vibrator. A glass substrate bonding method includes an anodic bonding step of anodically bonding a bonding material fixed to an inner surface of a lid substrate wafer to a base substrate wafer. The bonding material is formed of an ITO film and a Si film which are sequentially formed on the inner surface of the lid substrate wafer.

Abstract: Provided are a package manufacturing method capable of hot-molding a substrate into a desired shape, and a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic apparatus, and a radio-controlled timepiece each having the piezoelectric vibrator. A molding step is a step in which in a penetration hole forming step, through-holes are formed by pressing and heating a base substrate wafer with a through-hole forming mold having convex portions corresponding to the through-holes. The through-hole forming mold is formed of a material having an open porosity equal to or larger than 14%.

Abstract: A piezoelectric vibrator according to the invention includes a base substrate and a lid substrate which are connected to each other and have a cavity formed therebetween; a piezoelectric vibrating reed that is mounted on the base substrate in the cavity; an external electrode that is formed on a lower surface of the base substrate; and a through electrode which is formed so as to pass through the base substrate, maintain the airtightness in the cavity, and electrically connect the piezoelectric vibrating reed with the external electrode. The through electrode is formed by a press molding by a forming mold having a pin, and includes a through hole of a taper-shaped section, in which a taper angle is in the range of 15° or more and 20° or less, and a conductive paste that is hardened after being filled in the through hole.

Abstract: A package manufacturing method capable of preventing recess portions from being formed in penetration electrodes. The package manufacturing method includes an electrode member forming step of inserting core portions made of a metallic material into cylindrical members made of a first glass material and heating the cylindrical members so as to weld the cylindrical members to the core portions, thus forming electrode members; a hole forming step of forming holes, in which the electrode members 8 are disposed, on a penetration electrode forming board wafer made of a second glass material; an electrode member disposing step of disposing the electrode members in the holes formed on the wafer; a welding step of heating the wafer and the electrode members so as to be welded to each other; and a cooling step of cooling the wafer and the electrode members.

Abstract: To provide a bonded glass cutting method whereby it is possible to suppress an occurrence of a crush or chipping when bonded glass is cut, and cut the bonded glass into pieces of a predetermined size, a package manufacturing method, a package, a piezoelectric vibrator, an oscillator, an electronic device, and an atomic timepiece. A bonded glass cutting method includes a scribing step, which irradiates a lid substrate wafer with a laser beam with a wavelength absorbed by a wafer bonded body along outlines, thus forming scribe lines on the lid substrate wafer, and a breaking step which, by cutting the wafer bonded body by applying a fracture stress to the scribe lines, dices the wafer bonded body into a plurality of piezoelectric vibrators, wherein a cutting step is carried out in a condition in which the wafer bonded body is placed on silicon rubber, and an outside end face of the lid substrate wafer is caused to face the silicon rubber.

Abstract: Provided is a method for manufacturing a high-quality piezoelectric vibrator in which reliable air-tightness of the inside of the cavity is maintained, and stable conduction between the piezoelectric vibrating reed and the outer electrodes is secured.

Abstract: The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.

Abstract: An electronic component capable of withstanding stress from a printed circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed circuit board.

Abstract: Providing a glass assembly cutting method capable of improving yield by cutting a glass assembly into a predetermined size, providing a package manufacturing method, a package and a piezoelectric vibrator manufactured by the manufacturing method, and an oscillator, an electronic device, and a radio-controlled timepiece. Providing a wafer assembly cutting method of cutting a wafer assembly 60 along a scribe line M?, the method including: a scribing step of irradiating a laser beam having an absorption wavelength of the wafer assembly 60 along the contour line to form the scribe line M? on a lid board wafer 50; and a breaking step of applying a breaking stress along the scribe line M? using a cutting blade to cut the wafer assembly along the scribe line M?, wherein the scribing step involves forming the scribe line M? so that the ratio of a depth dimension D of the scribe line M? to a width dimension W thereof is 0.8 or larger and 6.0 or smaller.

Abstract: Providing a method for manufacturing a package capable of improving production efficiency.

Abstract: A piezoelectric vibrating reed includes a piezoelectric plate made of a piezoelectric material, a pair of exciter electrodes formed on outer surfaces of the piezoelectric plate and configured to vibrate the piezoelectric plate when a predetermined voltage is applied thereon, and a pair of mount electrodes electrically connected to the pair of exciter electrodes, respectively. One mount electrode in the pair of mount electrodes is formed on one surface (under surface) of the piezoelectric plate and the other mount electrode is formed on the other surface (top surface) of the piezoelectric plate in a state not to oppose the one mount electrode with the piezoelectric plate in between. Accordingly, not only can power be saved, but also higher performance can be achieved by lowering the R1 characteristic and thereby enhancing the vibration characteristic.

Abstract: A method of fabricating a case accommodating a piezoelectric vibrating piece therein in a piezoelectric oscillator including the piezoelectric vibrating piece, including the steps of: applying deep drawing to a conductive plate member to shape the plate member in a nearly cylindrical shape with a bottom; pressing an inner surface of a bottom part of the plate member by a punch for step drawing while an outer surface of the bottom part is being abutted against a surface including an opening of a hole of a die having an inner diameter smaller than the outer diameter of the bottom part, whereby a projecting portion is formed on the outer surface of the bottom part; and cutting the plate member having the projecting portion at a predetermined position on the opening side thereof, whereby a case in a nearly cylindrical shape with a bottom having the projecting portion is obtained.

Abstract: In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Abstract: The piezoelectric vibrator of the invention comprises a base substrate, a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate, a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate, an external electrode formed on the lower face of the base substrate, a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity, and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed through hardening of a paste containing a plurality of metal fine particles and a plurality of glass beads.

Abstract: The piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed of a cylindrical body, which is formed of a glass material to have two flat ends and a thickness substantially equal to that of the base substrate, and is implanted in the through

Abstract: A piezoelectric vibrator includes a base substrate, a lid substrate, a piezoelectric vibrating reed, a pair of external electrodes, a pair of through electrodes, and routing electrodes. The base substrate is made of a glass material and a bonding film is formed on the upper surface of the base substrate. The lid substrate is made of a glass material, includes a recess for a cavity, and is bonded to the base substrate with the bonding film interposed therebetween so that the recess faces the base substrate. The piezoelectric vibrating reed is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between the base substrate and the lid substrate by the recess. The pair of external electrodes is formed on the lower surface of the base substrate. The pair of through electrodes is formed so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: The piezoelectric vibrator comprises a base substrate of which the two faces are polished; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through-electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member. The through-electrode is formed by hardening of a paste containing a plurality of metal fine particles.

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed so as to pass through the base substrate and is electrically connected to the pair of external electrodes, respectively. The routing electrodes 36 and 37 are formed on the upper surface of the base substrate and electrically connect the pair of through electrodes to the piezoelectric vibrating reed.

Abstract: There is provided a piezoelectric vibrator 1 that includes a base substrate 2, a lid substrate 3, a piezoelectric vibrating reed 4, a pair of external electrodes 38 and 39, a pair of through electrodes 32 and 33, and routing electrodes 36 and 37. The lid substrate 3 includes a recess 3a for a cavity and is bonded to the base substrate so that the recess faces the base substrate. The piezoelectric vibrating reed 4 is bonded to the upper surface of the base substrate so as to be received in a cavity that is formed between both the substrates. The pair of external electrodes 38 and 39 is formed on the lower surface of the base substrate. The pair of through electrodes 32 and 33 is formed by hardening paste P, which contains a plurality of metal fine particles and a plurality of metal beads P1, so as to pass through the base substrate, maintains airtightness in the cavity, and is electrically connected to the pair of external electrodes, respectively.

Abstract: An electronic component capable of withstanding stress from a printed-circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed-circuit board.