Patents by Inventor Masashi Ohi

Masashi Ohi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10990060
    Abstract: A fixing device includes a body and a cover. The body includes a roller and a positioning projection projecting from the body. The cover is supported on one end side in an axial direction of the roller and has a slot in which the positioning projection is inserted. The cover is configured to pivot on the positioning projection inserted in the slot, from a closed position to a retreated position from the body.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: April 27, 2021
    Assignee: RICOH COMPANY, LTD.
    Inventors: Atsushi Ashikagaya, Masashi Ohi, Junichi Sasaki, Yasunobu Kidoura, Yuuto Akiba
  • Publication number: 20200272091
    Abstract: A fixing device includes a body and a cover. The body includes a roller and a positioning projection projecting from the body. The cover is supported on one end side in an axial direction of the roller and has a slot in which the positioning projection is inserted. The cover is configured to pivot on the positioning projection inserted in the slot, from a closed position to a retreated position from the body.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 27, 2020
    Inventors: Atsushi ASHIKAGAYA, Masashi OHI, Junichi SASAKI, Yasunobu KIDOURA, Yuuto AKIBA
  • Patent number: 5986046
    Abstract: An oxidant solution for synthesizing a heat-resistant electroconductive polymer, composed of a solution of a non-protonic organic solvent and an oxidant of the organic compound iron salt expressed by the following formula:Fe.sup.3+O [(X)L--(M)m--(Y.sup.-)n]pH.sup.
    Type: Grant
    Filed: March 9, 1998
    Date of Patent: November 16, 1999
    Assignee: NEC Corporation
    Inventors: Toshihiko Nishiyama, Takashi Fukaumi, Atushi Kobayashi, Masashi Ohi, Yoshihiko Saiki, Kazuaki Fukushima, Tomitaro Hara, Shinji Takeoka, Kimihisa Yamamoto, Eishun Tuchida
  • Patent number: 5951840
    Abstract: The solid electrolytic capacitor comprises a sealed capacitor element having, as a solid electrolyte layer, a heat resistant conductive layer formed on a dielectric oxide film. The heat resistant conducting polymer layer contains water, and the capacitor element inside is substantially oxygen-free. A cathode conductive layer is provided on the capacitor element and then both an external cathode lead and an external anode lead are mounted on the capacitor element. Water is supplied to the conducting polymer layer of the capacitor element such that the conducting polymer layer inside contains water. The capacitor element is then sealed such that water is held within the heat resistant conducting polymer layer and that the capacitor element inside is substantially oxygen-free. The step of supplying water is carried out by dipping the heat resistant conducting polymer layer in water or heavy water or exposed to water-containing inert gas.
    Type: Grant
    Filed: December 28, 1995
    Date of Patent: September 14, 1999
    Assignee: NEC Corporation
    Inventors: Takashi Fukaumi, Toshihiko Nishiyama, Atsushi Kobayashi, Masashi Ohi, Eishun Tsuchida, Kumihisa Yamamoto, Shinji Takeoka, Yoshitaka Fujishima
  • Patent number: 5752986
    Abstract: A solid electrolytic capacitor free of short circuits which may be caused by the creeping of a solid electrolyte comprising a conducting polymer, and having high volume efficiency per volume. The solid electrolytic capacitor is constructed by successively forming an oxide film, a solid electrolyte (conducting polymer) and a cathode layer on an anode body which has an anode lead planted thereon. Then heating is applied, by a heater chip, to a part of the solid electrolyte that has crept from the head of the anode body along the anode lead to convert it is insulation, so as to produce a solid electrolyte insulated portion thereby. Or, in another way, the creeping solid electrolyte can be removed by heating with a heater chip and generating a thermal decomposition reaction thereof while supplying sufficient additional oxygen.
    Type: Grant
    Filed: November 4, 1994
    Date of Patent: May 19, 1998
    Assignee: NEC Corporation
    Inventors: Toshihiko Nishiyama, Masashi Ohi, Satoshi Arai, Koji Sakata, Atsuhiko Fujita
  • Patent number: 5707407
    Abstract: A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed.
    Type: Grant
    Filed: February 7, 1997
    Date of Patent: January 13, 1998
    Assignee: NEC Corporation
    Inventors: Masashi Ohi, Hiromichi Taniguchi, Atushi Kobayashi
  • Patent number: 5654869
    Abstract: A chip-formed solid electrolytic capacitor having a structure wherein a projecting anode lead is not provided for an anode member. The solid electrolytic capacitor is fabricated by the following manner: First, an electrically insulating resin such as a fluororesin is impregnated into an end face of a porous electrode member to form an insulating resin impregnated portion, and an electrode lead member is bonded to the anode member at the insulating resin impregnated portion. An anodic oxidation film, a solid electrolyte layer and a cathode layer successively are formed on the anode member. Then, an electrically insulating outer package is applied so that the cathode layer on a face of the anode member opposing to the face on which the electrode lead member is mounted is exposed.
    Type: Grant
    Filed: December 8, 1995
    Date of Patent: August 5, 1997
    Assignee: NEC Corporation
    Inventors: Masashi Ohi, Hiromichi Taniguchi, Atushi Kobayashi